• Title/Summary/Keyword: Plasma devices

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Arrays of Microcavity Plasma Devices;Versatile Platform for The Next Generation of Plasma Displays

  • Eden, J.G.;Park, S.J.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.473-476
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    • 2006
  • Microcavity plasma devices having characteristic dimensions below $100\;{\mu}m$ have been investigated as a candidate for the next generation of plasma displays. Arrays of inverted pyramid microcavity devices, fabricated in Si with emitting apertures of $(50\;{\mu}m)^2$ and designed for AC or bipolar excitation, demonstrate a luminous efficacy above 6 lm/W at pressures up to and beyond one atmosphere of Ne/Xe mixtures. Also the design of analogous microplasma devices in ceramic multilayer structures or plastic substrates is disccussed.

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Study for Enhanced Skin Penetration of Cosmetics by Plasma-Sono Stimuli (플라즈마-초음파 자극에 의한 화장품의 피부 침투 증진 연구)

  • Yoonho Hwang;Hyeyoun Cho;Yujin Park;Hwijin Jang;Sanghyo Park;Jaehong Key
    • Journal of Biomedical Engineering Research
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    • v.44 no.4
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    • pp.275-283
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    • 2023
  • The demand for skincare has increased due to the end of the COVID-19 pandemic, leading to a focus on skincare devices and technologies designed to improve the delivery of cosmetics. Among these technologies, skincare medical devices that utilize plasma therapy (Plasma) and sonophoresis (Sono) are commonly used in dermatology clinics. However, there is still a lack of quantitative analysis for transdermal absorption effects of Plasma and Sono skincare medical devices. In this study, we quantified enhanced transdermal absorption effects of Plasma and Sono devices through in-silico and ex-vivo studies. The Sono treatment demonstrated an increased transdermal absorption effect, showing a 10~13% difference in penetration compared to the control group in the in-silico experiment, and 159% and 184% increase in the ex-vivo experiment. The Plasma treatment revealed increased transdermal absorption effects, with a 1.0~2.5% penetration difference in the in-silico experiment, and a 124% increase in the ex-vivo experiment compared to the control group. We also observed a synergistic effect from the combined treatment of Plasma and Sono, as indicated by the highest increases of 197% and 242% in penetration. Furthermore, we have determined the optimal device settings and treatment conditions for Plasma-Sono skincare medical devices. Notably, higher on/off durations (Intensity levels) and longer Sono treatments resulted in greater transdermal absorption effects.

Application of Pulsed Plasmas for Nanoscale Etching of Semiconductor Devices : A Review (나노 반도체 소자를 위한 펄스 플라즈마 식각 기술)

  • Yang, Kyung Chae;Park, Sung Woo;Shin, Tae Ho;Yeom, Geun Young
    • Journal of the Korean institute of surface engineering
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    • v.48 no.6
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    • pp.360-370
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    • 2015
  • As the size of the semiconductor devices shrinks to nanometer scale, the importance of plasma etching process to the fabrication of nanometer scale semiconductor devices is increasing further and further. But for the nanoscale devices, conventional plasma etching technique is extremely difficult to meet the requirement of the device fabrication, therefore, other etching techniques such as use of multi frequency plasma, source/bias/gas pulsing, etc. are investigated to meet the etching target. Until today, various pulsing techniques including pulsed plasma source and/or pulse-biased plasma etching have been tested on various materials. In this review, the experimental/theoretical studies of pulsed plasmas during the nanoscale plasma etching on etch profile, etch selectivity, uniformity, etc. have been summarized. Especially, the researches of pulsed plasma on the etching of silicon, $SiO_2$, and magnetic materials in the semiconductor industry for further device scaling have been discussed. Those results demonstrated the importance of pulse plasma on the pattern control for achieving the best performance. Although some of the pulsing mechanism is not well established, it is believed that this review will give a certain understanding on the pulsed plasma techniques.

Applications of Plasma Modeling for Semiconductor Industry

  • Efremov, Alexandre
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.3-6
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    • 2002
  • Plasma processing plays a significant role in semiconductor devices technology. Development of new plasma systems, such as high-density plasma reactors, required development of plasma theory to understand a whole process mechanism and to be able to explain and to predict processing results. A most important task in this way is to establish interconnections between input process parameters (working gas, pressure, flow rate, input power density) and various plasma subsystems (electron gas, volume and heterogeneous gas chemistry, transport), which are closely connected one with other. It will allow select optimal ways for processes optimization.

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Effect of Active Species Generated from Flexible Plasma Patch on Polysaccharide Surface (플렉서블 플라즈마 패치에서 발생되는 활성종이 다당류 표면에 미치는 영향)

  • Lee, Yu Ri;Lee, Seunghun;Kim, Do-Geun
    • Journal of the Korean institute of surface engineering
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    • v.51 no.2
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    • pp.133-137
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    • 2018
  • Plasma devices such as jets, pencils, and torches have been developed as new tools that help penetration of target agents and applied to plasma medicine. However, these devices cannot be used in a large area. Therefore, we introduced a flexible plasma device, which can be treated of large area and designed as bendable plasma. In additional, in vitro model based on agarose gel was prepared that can be show effectiveness in the depth of penetration. Plasma treatment conditions such as power, time and distance can be optimized on the agarose gel wound model. The chemical structure of changed polysaccharides was predicted due to reactive excited atoms and molecules, UV photons, charged particles and reactive oxygen and nitrogen species (RONS).

A Study on the Electrode formation of an Organic EL Devices using the RF Plasma (RF 플라즈마를 이용한 유기 EL 소자의 전극형성에 관한 연구)

  • 이은학
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.17 no.2
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    • pp.228-235
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    • 2004
  • In this thesis, it is designed efficient electrode formation on the organic luminescent device. ITO electrode is treated with $O_2$plasma. In order to inject hole efficiently, there is proposed the shape of anode that inserted plasma polymerized films as buffer layer between anode and organic layer using thiophene monomer. It is realized efficiently electron injection to aluminum due to introduce the quantum well in cathode. In the case of device inserted the buffer layer by using the plasma poiymerization after $O_2$plasma processing for ITO transparent electrode, since it forms the stable interface and reduce the moving speed of hole, the recombination of hole and electronic ate made in the omitting layer. Compared with the devices without buffer layer, the turn-on voltage was lowered by 1.0(V) doc to the introduction of buffer layer Since the quantum well structure is formed in front of cathode to optimize the tunneling effect, there is improved the power efficiency more than two times.

Modelling of Optimum Design of High Vacuum System for Plasma Process

  • Kim, Hyung-Taek
    • International journal of advanced smart convergence
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    • v.10 no.1
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    • pp.159-165
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    • 2021
  • Electronic devices used in the mobile environments fabricated under the plasma conditions in high vacuum system. Especially for the development of advanced electronic devices, high quality plasma as the process conditions are required. For this purpose, the variable conductance throttle valves for controllable plasma employed to the high vacuum system. In this study, we analyzed the effects of throttle valve applications on vacuum characteristics simulated to obtain the optimum design modelling for plasma conditions of high vacuum system. We used commercial simulator of vacuum system, VacSim(multi) on this study. Reliability of simulator verified by simulation of the commercially available models of high vacuum system. Simulated vacuum characteristics of the proposed modelling agreed with the observed experimental behaviour of real systems. Pressure limit valve and normally on-off control valve schematized as the modelling of throttle valve for the constant process-pressure of below 10-3 torr. Simulation results plotted as pump down curve of chamber, variable valve conductance and conductance logic of throttle valve. Simulated behaviors showed the applications of throttle valve sustained the process-pressure constantly, stably, and reliably in plasma process.

Modifications of ITO Surfaces in Organic EL Devices by $O_2$ Plasma Treatment (O$_2$ 플라즈마 처리에 의한 ITO 표면개질 변화에 따른 유기 EL 소자 특성)

  • 박상무;김형권;이덕출
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.52 no.6
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    • pp.261-266
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    • 2003
  • We investigated the effect of oxygen plasma treatment of indium-tin oxide(ITO) surface on the performance of electroluminescence(EL) devices. ITO surface treated oxygen plasma has been analyzed using atomic force microscope(AFM) and X-ray photoelectron spectroscopy(XPS), to investigate the relations between the properties of the ITO surface and the properties of the current-voltage-luminance(I-V-L) characteristics of the fabricated OLED with the structure of ITO(plasma treatment) / TPD / Alq$_3$/ Al. It is found that the oxygen plasma treatment of ITO anode improve the hole injection of the OLED due to the modification of the surface states. The treated ITO anode nay be low voltage with high luminance efficiency.

The Evaluation for Reliability Characteristics of MOS Devices with Different Gate Materials by Plasma Etching Process (게이트 물질을 달리한 MOS소자의 플라즈마 피해에 대한 신뢰도 특성 분석)

  • 윤재석
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.4 no.2
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    • pp.297-305
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    • 2000
  • It is observed that the initial properties and degradation characteristics on plasma of n/p-MOSFET with polycide and poly-Si as different gate materials under F-N stress and hot electron stress are affected by metal AR(Antenna Ratio) during plasma process. Compared to that of MOS devices with poly-Si gate material, reliability properties on plasma of MOS devices with polycide gate material are improved. This can be explained by that fluorine of tungsten polycide process diffuses through poly-Si into gate oxide and results in additional oxide thickness. The fact that MOS devices with polycide gate material can reduce damages of plasma process shows possibility that polycide gate material can be used as gate material for next generation MOS devices.

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Applications of Plasma Modeling for Semiconductor Industry

  • Efremov, Alexandre
    • Electrical & Electronic Materials
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    • v.15 no.9
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    • pp.10-14
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    • 2002
  • Plasma processing plays a significant role in semiconductor devices technology. Development of new plasma systems, such as high-density plasma reactors, required development of plasma theory to understand a whole process mechanism and to be able to explain and to predict processing results. A most important task in this way is to establish interconnections between input process parameters (working gas, pressure flow rate input power density) and a various plasma subsystems (electron gas, volume and heterogeneous gas chemistry, transport), which are closely connected one with other. It will allow select optimal ways for processes optimizations.

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