• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.320-320
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• 2016

Nanocrystalline Carbon thin films have numerous applications in different areas such as mechanical, biotechnology and optoelectronic devices due to attractive properties like high excellent hardness, low friction coefficient, good chemical inertness, low surface roughness, non-toxic and biocompatibility. In this work, we studied the comparison of pure DC power and pulsed DC power in plasma sputtering process of carbon thin films synthesis. Using a close field unbalanced magnetron sputtering system, films were deposited on glass and Si wafer substrates by varying the power density and pulsed DC frequency variations. The plasma characteristics has been studied using the I-V discharge characteristics and optical emission spectroscopy. The films properties were studied using Raman spectroscopy, Hall effect measurement, contact angle measurement. Through the Raman results, ID/IG ratio was found to be increased by increasing either of DC power density and pulsed DC frequency. Film deposition rate, measured by Alpha step measurement, increased with increasing DC power density and decreased with pulsed DC frequency. The electrical resistivity results show that the resistivity increased with increasing DC power density and pulsed DC frequency. The film surface energy was estimated using the calculated values of contact angle of DI water and di-iodo-methane. Our results exhibit a tailoring of surface energies from 52.69 to $55.42mJ/m^2$ by controlling the plasma parameters.

• Proceedings of the Korean Vacuum Society Conference
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• 2001.07a
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• pp.152-152
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• 2001

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.175.1-175.1
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• 2016

In recent, tract infections such as atopic dermatitis, allergic rhinitis and a respiratory disease are increasing, giving rise to the atmospheric pollution, inflow of micro-size dust and side effect of humidifier disinfectant. In this context, the environment-friendly technology is required to eliminate airborne pathogens. We propose solution of the previous problems, making use of Radical Mist Generator (RMG). Existing technologies of air purification using a gas discharge produce harmful substances such as ozone, NOx, etc. However, the RMG uses a pure water as a plasma forming material. The RMG sprays the water mist, which contains reactive radicals to sterilize microorganisms. RMG is comprised of a power supply, plasma electrodes and a nozzle. In order to analyze the electrical characteristic and concentrations of reactive radicals, we employ an oscilloscope and a titration method. To test the sterilization effect of RMG, we used E.coli. We confirmed that E.coli was killed over 90%. Eventually, we expect that RMG can be promising tool for a purified system.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.236-236
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• 2011

Silicon oxynitride (SiON) was deposited for gas barrier film on polyethylene terephthalate (PET) using octamethylycyclodisiloxane (Si4O4C8H24, OMCTS) precursor by plasma enhanced chemical vapor deposition (PECVD) at low temperature. The ion flux and substrate temperature were measured by oscilloscope and thermometer. The chemical bonding structure and barrier property of films were characterized by Fourier transform infrared (FT-IR) spectroscopy and the water vapor transmission rate (WVTR), respectively. The deposition rate of films increases with RF bias and nitrogen dilution due to increase of dissociated precursor and nitrogen ion incident to the substrate. In addition, we confirmed that the increase of nitrogen dilution and RF bias reduced WVTR of films. Because, on the basis of FT-IR analysis, the increase of the nitrogen gas flow rate and RF bias caused the increase of the C=N stretching vibration resulting in the decrease of macro and nano defects.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.209.2-209.2
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• 2016

Up to now, Plasma applications are thought as a leading technology in industrial, chemical and even medical and biological field. Especially, Due to direct discharge in liquid with reaction in ambient solution, plasma in liquid is useful plasma technology. Such as electro-surgery, water purification, radical generation for synthesis. For using those plasma applications efficiently, plasma characteristics should be understood in advance. But discharge in liquid is not much well-known about its characteristics. And plasma discharge in solution is difficult to generate and analysis due to electrolysis, vaporization and radical generation. So, We make stable plasma discharge in solution(saline 0.9%) without input gas. We also analyze new type of plasma source in thermal and electrochemical view. And we check characteristics of plasma in liquid. For example, plasma density and radical density(OH) with optical emission, thermal energy with thermometer, electrical energy with oscilloscope and so on. And we try to explain the bubble and plasma formation with circuit analysis.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.147-147
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• 2012

Cutoff probe has been used for measuring a plasma density using the cutoff peak which is located at the plasma frequency in the low pressure plasma. However, research on analysis of low frequency region of transmission microwave frequency (TMF) spectrum does not performed even though important plasma parameters are located in the low frequency region, i.e., ion plasma frequency and collision frequency. In this research, we analyzed the low frequency region of the TMF spectrum. Experimental results reveal the effect of plasma parameters on the low frequency region on the TMF spectrum. Based on the response of TMF spectrum from changing of plasma parameters, deduction of the plasma parameters was tried. This comprehensive analysis of TMF spectrum expands applicable area of cutoff probe.

• Journal of the Korean institute of surface engineering
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• v.39 no.1
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• pp.1-8
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• 2006

In this study, effect of sputtering after plasma nitriding and before PVD coating on the microstucture, microhardness, surface roughness and the adhesion strength of CrN thin films were investigated. Experimental results showed that this sputtering process not only removed surface compound layer which formed during a plasma nitriding process but also induced an alteration of the surface of plasma nitrided substrate in terms of microhardness distribution and surface roughness, which in turn affected the adhesion strength of PVD coatings. After sputtering, microhardness distribution showed general decrease and the surface roughness became increased slightly. The critical shear stress measured from the scratch test on the CrN coatings showed an approximately twice increase in the binding strength through the sputtering prior to the coating and this could be attributed to a complete removal of compound layer from the plasma nitrided surface and to an increase in the surface roughness after sputtering.

• Journal of the Semiconductor & Display Technology
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• v.19 no.4
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• pp.28-33
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• 2020

Plasma etching process employs high density plasma to create surface chemistry and physical reactions, by which to remove material. Plasma chamber includes silicon-based materials such as a focus ring and gas distribution plate. Focus ring needs to be replaced after a short period. For this reason, there is a need to find materials resistant to erosion by plasma. The developed chemical vapor deposition processing to produce silicon carbide parts with high purity has also supported its widespread use in the plasma etch process. Silicon carbide maintains mechanical strength at high temperature, it have been use to chamber parts for plasma. Recently, besides the structural aspects of silicon carbide, its electrical conductivity and possibly its enhanced life time under high density plasma with less generation of contamination particles are drawing attention for use in applications such as upper electrode or focus rings, which have been made of silicon for a long time. However, especially for high purity silicon carbide focus ring, which has usually been made by the chemical vapor deposition method, there has been no study about quality improvement. The goal of this study is to reduce surface roughness and depth of damage by diamond tool grit size and tool dressing of diamond tools for precise dimensional assurance of focus rings.

• Journal of the Korean institute of surface engineering
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• v.34 no.5
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• pp.475-480
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• 2001

Diffusion of Cu into the low-k para-xylene based plasma polymer (pXPP) thin films deposited by plasma-enhanced chemical vapor deposition using the para-xylene precursor was comparatively measured using various methods. Cu layer was deposited on the surfaces of pXPPs treated by $N_2$ plasma generated in a magnetically enhanced inductively coupled plasma reactor. Diffusion characteristics of Cu into pXPPs were measured using Rutherford backscattering spectroscopy (RBS), secondary ion mass spectroscopy (SIMS), cross-sectional transmission electron microscopy (XTEM), and current-voltage (I-V) measurements for the vacuum-annealed Cu/pXPPs for 1 hour at $450^{\circ}C$ and were compared. The results showed a correlation between the I-V measurement and SIMS data are correlated and have a sensitivity enough to evaluate the dielectric properties but the RBS or XTEM measurements are not sufficient to conclude the electrical properties of low-k dielectrics with Cu in the film bulk. The additional results indicate that the pXPP layers are quite resistant to Cu diffusion at the annealing temperature of $450^{\circ}C$ compared to the other previously reported organic low-k materials.

• Journal of Ceramic Processing Research
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• v.20 no.6
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• pp.589-596
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• 2019

Pigments with minute particle sizes, such as carbon black (CB) and pigment red 48:2 (P.R.48:2), are the most important types of pigment and have been widely used in many industrial applications. However, minute particles have large surface areas, high oil absorption and low surface energy. They therefore tend to be repellent to the vehicle and lose stability, resulting in significant increases in viscosity or reaggregation in the vehicle. Therefore, finding the best way to improve the dispersion properties of minute particle size pigments presents a major technical challenge. In this study, minute particle types of CB and P.R.48:2 were treated with nitrogen gas plasma generated via radio frequency-plasma enhanced chemical vapor deposition (RF-PECVD) to increase the dispersion properties of minute particles in deionized (DI) water. The morphologies and particle sizes of untreated and plasma treated particles were evaluated using scanning electron microscopy (SEM) and atomic force microscopy (AFM). The average distributions of particle size were measured using a laser particle sizer. Fourier transform infrared spectroscopy was carried out on the samples to identify changes in molecular interactions during plasma processing. The results of our analysis indicate that N2 plasma treatment is an effective method for improving the dispersibility of minute particles of pigment in DI water.