• Title/Summary/Keyword: Plasma Technology

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The Behavior of Negative Ions in Silane Plasma Chemical Vapor Deposition (실란 플라즈마 화학증착에서의 음이온거동)

  • Kim, Kyo-Seon
    • Journal of Industrial Technology
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    • v.14
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    • pp.63-75
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    • 1994
  • The objective of this research is to analyze the phenomena of negative ion behavior in silane plasma chemical vapor deposition. Based on the plasma chemistry, the model equations for the formation and transport of negative ions were proposed and solved. The evolutions of gaseous species along the reactor were presented for several conditions of process variables such as reactor pressure, total gas flow rate, and electric field. Based on the model results, it is found that : (1) The concentration profiles of positive ions show the sharp peaks at the center of plasma reactor. (2) Most of negative ions are located in bulk plasma region, because the negative ions are excluded from the sheath region by electrostatic repulsion.

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Influence of Plasma Treatment on Hydrogen Chloride Removal of Activated Carbon Fibers

  • Park, Soo-Jin;Kim, Byung-Joo;Ryu, Seung-Kon
    • Carbon letters
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    • v.5 no.3
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    • pp.103-107
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    • 2004
  • The atmospheric pressure plasma treatments ($Ar/O_2$ and $Ar/N_2$) of activated carbon fibers (ACFs) were carried out to introduce hydrophilic functional groups on carbon surfaces in order to enhance the hydrogen chloride gas (HCl) adsorption. Surface properties of the ACFs were determined by XPS and SEM. $N_2$/77 K adsorption isotherms were investigated by BET and D-R (Dubinin-Radushkevich) plot methods. The HCl removal efficiency was confirmed by HCl detecting tubes (range:1~40 or 40~1000 ppm). As experimental results, it was found that all plasma-treated ACFs showed the decrease in the pore volume, but the HCl removal efficiency showed higher level than that of the untreated ACFs. This result indicated that the plasma treatments led to the conformation of hydrophilic functional groups on the carbon surfaces, resulting in the increase of the interaction between the ACFs and HCl gas.

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The effect of ferrite cores on the inductively coupled plasma driven at 13.56MHz (13.56MHz 유도 결합 플라즈마에서의 강자성체 페라이트 코어의 효과)

  • Lee, Won-Ki;Lee, Kyeong-Hyo;Chung, Chin-Wook
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2005.09a
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    • pp.197-202
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    • 2005
  • Due to high permeability of the ferrite core, the characteristics of the ICP are expected to be greatly improved. We investigated the effect of the ferrite cores on conventional inductively coupled plasma. It was observed that the current and voltage in ike ICP antenna are slightly decreased and the power transfer efficiency is increased. However, due to eddy current and hysterisis loss, plasma density in the ICP with the ferrite cores is not increased. It seems that the ICP with the ferrite cores at low frequency (${\~}$100kHz) will be greatly improved since the losses at the low frequency can be negligible.

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Development of Atmospheric Pressure Plasma Equipment and It's Application to Flip Chip BGA Manufacturing Process (대기압 플라즈마 설비 개발 및 Flip Chip BGA 제조공정 적용)

  • Lee, Ki-Seok;Ryu, Sun-Joong
    • Journal of the Semiconductor & Display Technology
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    • v.8 no.2
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    • pp.15-21
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    • 2009
  • Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

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Study on SiN and SiCN film production using PE-ALD process with high-density multi-ICP source at low temperature

  • Song, Hohyun;Seo, Sanghun;Chang, Hongyoung
    • Current Applied Physics
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    • v.18 no.11
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    • pp.1436-1440
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    • 2018
  • SiN and SiCN film production using plasma-enhanced atomic layer deposition (PE-ALD) is investigated in this study. A developed high-power and high-density multiple inductively coupled plasma (multi-ICP) source is used for a low temperature PE-ALD process. High plasma density and good uniformity are obtained by high power $N_2$ plasma discharge. Silicon nitride films are deposited on a 300-mm wafer using the PE-ALD method at low temperature. To analyze the quality of the SiN and SiCN films, the wet etch rate, refractive index, and growth rate of the thin films are measured. Experiments are performed by changing the applied power and the process temperature ($300-500^{\circ}C$).

Plasma Corrosion and Breakdown Voltage Behavior of Ce Ion Added Sulfuric Acid Anodizing According to Electrolyte Temperature (Ce ion이 첨가된 황산 아노다이징의 온도 변화에 따른 내플라즈마 특성)

  • So, Jongho;Yun, Ju-Young;Shin, Jae-Soo
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.1
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    • pp.37-41
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    • 2021
  • We report on the formation of anodic aluminum oxide (AAO) film using sulfuric acid containing cerium salt. When the temperature of the sulfuric acid containing cerium salt changes from 5 ℃ to 20 ℃, the current density and the thickness growth rate increase. The surface morphology of the AAO film change according to the temperature of the electrolytes. And that affected the breakdown voltage and the plasma etch rate. The breakdown voltage per unit thickness was the highest at 15 ℃, and the plasma etch rate was the lowest at 10 ℃ at 2.80 ㎛/h.

Mechanical Properties of DLC Films and Duplex Plasma Nitriding/DLC Coating Treatment Process (DLC 박막과 복합처리(Nitriding/DLC)한 박막의 기계적 특성 비교)

  • Park, Hyun-Jun;Kim, Min-Chae;Kim, Sang-Sub;Moon, Kyoung-Il
    • Journal of the Korean institute of surface engineering
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    • v.53 no.6
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    • pp.306-311
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    • 2020
  • In this work, diamond-like carbon (DLC) films are coated onto plasma nitrided AISI 4140 steel by DC-pulsed PECVD. One problem of DLC films is their very poor adhesion on steel substrates. The purpose of the nitriding was to enhance adhesion between the substrate and the DLC films. The white layer formation is avoided. Plasma nitriding increased adhesion from 8 N for DLC coating to 25 N for duplex coating. Duplex plasma nitriding/DLC coating was proven to be more effective in improving the adhesion. The purpose of the bond layer was to enhance adhesion between the substrate and the DLC films.

Improving Hydrophilic and Finishing Performance of Dyeable PP through Atmospheric Pressure Plasma Treatment (플라즈마 처리를 통한 가염PP의 친수화도 및 가공성능 향상)

  • Cho, Hang Sung
    • Textile Coloration and Finishing
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    • v.34 no.3
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    • pp.165-172
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    • 2022
  • Polypropylene(PP) is a textile material with various functions such as eco-friendliness, lightness, and elasticity. Although most synthetic fibers can be dyed and finished, but original PP is difficult to dye or finish due to its extremely hydrophobic properties, so its application expansion is limited. In order to solve this problem, dyeable PP was developed, and various researches on textiles for clothing such as mass production technology, fine fiberization and performance improvement are in progress. Plasma treatment is a processing method for modifying the surface of fabrics, and has effects such as hydrophilization, deepening color, improving adhesion, and surface polymerization. In this study, plasma treatment was applied to study changes in hydrophilization properties of dyeable PP, surface changes before and after plasma treatment and performance according to hydrophilization.

A hybrid cutting technology using plasma and end mill for decommissioning of nuclear facilities

  • Choi, Min-Gyu;Lee, Dong-Hyun;Jeong, Sang-Min;Figuera-Michal, Darian;Seo, Jun-Ho
    • Nuclear Engineering and Technology
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    • v.54 no.3
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    • pp.1145-1151
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    • 2022
  • A hybrid cutting using both plasma and end mill was developed for safe and efficient dismantling of nuclear facilities. In this cutting method, a moving arc plasma heats up the workpiece before milling. Thermally softened part of the workpiece is then removed quickly and deeply with an end mill. For the cutting experiments, a three-axis numerical control (NC) milling machine was combined with a commercialized arc plasma torch and used to cut 25 mm thick stainless steel plates. Experimental results revealed that pre-heating by arc plasmas can improve the cutting volume per unit time higher than 40% by reducing the cutting load and increasing the cuttable depth when using an end mill without cutting fluids. These advantages of a hybrid cutting process are expected to contribute to quick and safe segmentations of metal structures with radioactively contaminated inner surfaces.

Micro Structure and the Coefficient of Friction with $H_2S$ and $C_3H_8$ Gas Addition During Plasma Sulf-nitriding of SM45C Carbon Steel (SM45C 탄소강의 플라즈마 침류질화 처리 시 $H_2S$, $C_3H_8$ 가스 첨가에 따른 미세조직 및 마찰계수의 변화)

  • Ko, Y.K.;Moon, K.I.;Lee, W.B.;Kim, S.W.;You, Y.Z.
    • Journal of the Korean Society for Heat Treatment
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    • v.20 no.5
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    • pp.237-242
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    • 2007
  • Friction coefficient of SM45C steel was surprisingly reduced with $H_2S$ and $C_3H_8$ gas during plasma sulf-nitriding. During the plasma sulf-nitriding, 100-700 sccm of $H_2S$ gas and 100 sccm of $C_3H_8$ gas were added and working pressure and temperature were 2 torr, $500-550^{\circ}C$, respectively. As $H_2S$ gas amount increased over 500 sccm, flake-like structures were developed on top of the nitriding layer and grain size of the nitriding layer were about 100 nm. The friction coefficient for the sample treated plasma sulf-nitriding under $N_2-H_2S$ gas was 0.4 - 0.5. The structure became more finer and amorphous-like along with $N_2-H_2S-C_3H_8$ gas and the nano-sized surface microstructures resulted in high hardness and significantly low friction coefficient of 0.2.