• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.5
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• pp.265-269
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• 2000

$(Ba, Sr)TiO_3$thin films were etched with a magnetically enhanced inductively coupled plasma (MEICP) at different CF4/Ar gas mixing ratios. Experimental was done by varying the etching parameters such as rf power, dc bias and chamber pressure. The maximum etch rate of the BST films was $1800{AA}/min$ under $CF_4/(CF_4+Ar)$ of 0.1, 600 W/350 V and 5 mTorr. The selectivity of BST to Pt and PR was 0.6, 0.7, respectively. X-ray photoelectron spectroscopy (XPS) results show that surface reaction between Ba, Sr, Ti and C, F radicals occurs during the (Ba, Sr)TiO3 etching. To analyze the composition of surface residue after the etching, films etched with different CF_4/Ar$ gas mixing ratio were investigated using XPS and secondary ion mass spectroscopy (SIMS).

• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1382-1384
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• 1995

In order to study the structure of RF glow discharge driven at 13.56MHz in argon, the discharge voltage, current and phase shift between them will be measured over a wide range of discharge parameters(gas pressure between 1mTorr and 50mTorr with discharge power between 20mW and 200W). In this paper, the dc glow discharge characteristics and plasma parameters of both FTS and CPMS systems are studied experimentally. It is found that for CPMS system discharge is stablized under wider ranges of magnetic field and pressure than for FTS system. The plasma density and electron temperature of the plasma for these two systems are in the range of $10^{10}{\sim}7{\times}10^{11}[cm^{-3}]$ and $3.5{\sim}6.5$[eV], respectively.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.4
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• pp.197-201
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• 2001

The influence of argon, oxygen, and nitrogen admixtures on the dissociation of $Cl_2$ molecules in a glow discharge low-temperature plasma under the constant pressure conditions was investigated. For $Cl_2/Ar$ and $Cl_2/O_2$mixtures, the concentration of chlorine atoms was observed to be a practically constant at argon or oxygen concentrations up to 50%. This invariability is a most pro bably explained by relative increase in rate of $Cl_2$ direct electron impact dissociation due to the changes in electrophysical parameters of plasma such as EEDF, electron drift rate and mean energy. For all the considered mixtures, the contribution of stepwise dissociation involving active species from gas additives (metastable atoms and molecules, vibrationally excited molecules) was found to be negligible.

• Korean Journal of Computational Design and Engineering
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• v.9 no.2
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• pp.102-111
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• 2004

In this paper, the efficient layout method for generating common and continuous cutting path of flat-bar profile. The ‘flat -bar’ is a stiffener and has long rectangular shape. This paper describes a fast nesting algorithm of the flat-bar, and a procedure to generate cutting path of gas/plasma torch, which is operated by a NC (numerically controlled) gas/plasma cutting machine. By using this common and continuous path, the machining-time for cutting and the maintenance-cost of plasma-torch could be reduced. Proposed procedures are written in C-language and applied to the Interactive Flat-Bar-Nesting System executable on Open VMS with X-Window system.

• Journal of Surface Science and Engineering
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• v.33 no.2
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• pp.69-76
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• 2000

The rf plasma chemical vapor deposition is a common method employed for diamond or amorphous carbon deposition. Diamond possesses the strongest bonding, as exemplified by a number of unique properties-extraordinary hardness, high thermal conductivity, and a high melting tempera tore. Therefore, it is very important to investigate the synthesis of semiconducting diamond and its use as semiconductor devices. An inductively coupled rf plasma CVD system for producing amorphous carbon films were developed. Uniform temperature and concentration profiles are requisites for the deposition of high quality large-area films. The system consists of rf matching network, deposition chamber, pumping lines for gas system. Gas mixtures with methane, and hydrogen have been used and Si (100) wafers used as a substrate. Amorphous carbon films were deposited with methane concentration of 1.5% at the process pressure of S torr~20 torr, and process temperature of about $750^{\circ}C$. The nucleation and growth of the amorphous carbon films have been characterized by several methods such as SEM and XRD.

• Tribology and Lubricants
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• v.12 no.4
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• pp.60-70
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• 1996

Scuffing and severe wear of the highly stressed sliding components have been very critical problems in the development of a rotary compressor. In order to improve durability and reliability of the compressor, plasma ion-nitriding was applied on the shaft and the vane surface. The effects of different treatment conditions on the mechanical and tribological properties of the ion-nitrided surfaces were investigated. Ion-nitrided surfaces showed better tribological performances than untreated surfaces. The best wear performance was observed when the shaft was nitrided in the condition of 450$\circ$C, 7 hours, $N_2:H_2=1:4$ gas mixture by forming a ductile nitrided layer which has $\gamma'$ phase microstructure. As nitrogen gas pressure increased, $\varepsilon$ phase layer was formed. This hard phase layer was observed to be more beneficial for the vane in reducing friction and wear.

• Journal of Power Electronics
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• v.9 no.6
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• pp.884-891
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• 2009

An address voltage stabilization circuit for the single-side driving (SSD) method for AC plasma display panels (PDP) is proposed. The single-side driving method, which eliminates a common sustaining driver, uses only two electrodes in a three electrode AC PDP structure. The high-impedance (Hi-Z) mode operation of the data drive ICs during the sustaining period is needed for surface gas-discharge without misfiring in the SSD method but it produces the problem that the address voltage increases up to the breakdown voltage. The proposed circuit based on a flyback converter can stabilize the address voltage under the breakdown voltage and provide better surface gas-discharge performance without any misfiring in the SSD scheme.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.62-65
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• 2001

$SrBi_2Ta_2O_{9}$ thin films were etched in inductively coupled $Cl_{2}$/$CF_{4}$/Ar plasma. The maximum etch rate was 1060 $\AA\textrm{m}$/min in $Cl_{2}$/$CF_{4}$/Ar (80). The chemical reactions on the etched surface were studied with x-ray photoelectron spectroscopy. The etching of SBT thin films in $Cl_{2}$/$CF_{4}$/Ar were etched by chemically assisted reactive ion etching. The small addition of $Cl_2$ into $CF_4$(20)/Ar(80) plasma will decrease the fluorine radicals and the increase Cl radical.

• Journal of the Semiconductor & Display Technology
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• v.2 no.3
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• pp.7-11
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• 2003

In this research, the etching characteristics of via contact and deep contact hole have been studied using multi-pole inductively coupled plasma(MICP) etching system. We investigated Plasma density of MICP source using the Langmuir probe and etching characteristics with RF frequency, wall temperature, chamber gap, and gas chemistry containing Carbon and Fluorine. As the etching time increases, formation of the polymer increases. To improve the polymer formation, we controlled the temperature of the reacting chamber, and we found that temperature of the chamber was very effective to decrease the polymer thickness. The deep contact etch profile and high selectivity(oxide to photoresist) have been achieved with the optimum mixed gas ratio containing C and F and the temperature control of the etching chamber.

• Journal of the Korean Vacuum Society
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• v.8 no.4A
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• pp.476-481
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• 1999

Characteristics of platinum dry etching were investigated in a cryogenic magnetized inductively coupled plasma (MICP). The problem with platinum etching is the redeposition of sputtered platinum on the sidewall. Because of the redeposits on the sidewall, the etching of patterned platinum structure produces feature sizes that exceed the original dimension of the PR size and the etch profile has needle-like shape [1]. The main object of this study was to investigate a new process technology for fence-free Pt etching As bias voltage increased, the height of fence was reduced. In cryogenic etching, the height of fence was reduced to 20% at-$190^{\circ}C$ compared with that of room temperature, however the etch profile was not still fence-free. In Ar/$SF_6$ Plasma, fence-free Pt etching was possible. As the ratio of $SF_6$ gas flow is more than 14% of total gas flow, the etch profile had no fence. Chemical reaction seemed to take place in the etch process.