• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.11-18
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• 2011

The quantitative interfacial adhesion energy of the Cu-Cu direct bonding layers was evaluated in terms of the bonding temperature and Ar+$H_2$ plasma treatment on Cu surface by using a 4-point bending test. The interfacial adhesion energy and bonding quality depend on increased bonding temperature and post-annealing temperature. With increasing bonding temperature from $250^{\circ}C$ to $350^{\circ}C$, the interfacial adhesion energy increase from $1.38{\pm}1.06$ $J/m^2$ to $10.36{\pm}1.01$ $J/m^2$. The Ar+$H_2$ plasma treatment on Cu surface drastically increase the interfacial adhesion energy form $1.38{\pm}1.06$ $J/m^2$ to $6.59{\pm}0.03$ $J/m^2$. The plasma pre-treatment successfully reduces processing temperature of Cu to Cu direct bonding.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.8
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• pp.479-483
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• 2017

The effect of $NH_3$ plasma treatment on device characteristics was confirmed for an optimized thin film transistor of poly-Si formed by ELA. When C-V curve was checked for MIS (metal-insulator-silicon), Dit of $NH_3$ plasma treated and MIS was $2.7{\times}10^{10}cm^{-2}eV^{-1}$. Also in the TFT device case, it was decreased to the sub-threshold slope of 0.5 V/decade, 1.9 V of threshold voltage and improved in $26cm^2V^{-1}S^{-1}$ of mobility. Si-N and Si-H bonding reduced dangling bonding to each interface. When gate bias stress was applied, the threshold voltage's shift value of $NH_3$ plasma treated device was 0.58 V for 1,000s, 1.14 V for 3,600s, 1.12 V for 7,200s. As we observe from this quality, electrical stability was also improved and $NH_3$ plasma treatment was considered effective for passivation.

• Advanced Composite Materials
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• v.17 no.2
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• pp.167-175
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• 2008

Vapor grown carbon fibers (VGCF) were treated with atmospheric plasma enhancing the surface area in order to improve the bonding to the matrix in epoxy composites. The changes in the mechanical properties of VGCF/epoxy nanocompostes, such as tensile modulus and tensile strength were investigated in this study. VGCF with and without atmospheric plasma treatment for surface modification were used in this investigation. The interdependence of these properties on the VGCF contents and interfacial bonding between VGCF/epoxy matrix were discussed. The mechanical properties of atmospheric plasma treated (APT) VGCF/epoxy were compared with raw VGCF/epoxy. The tensile strength of APT VGCF/epoxy nanocomposites showed higher value than that of raw VGCF. The tensile strength was increased with atmospheric plasma treatment, due to better adhesion at VGCF/epoxy interface. The tensile modulus of raw VGCF and APT VGCF/epoxy matrix were of the similar value. The dispersion of the VGCF was investigated by scanning electron microscopy (SEM), SEM micrographs showed an excellent dispersion of VGCF in epoxy matrix by ultrasonic method.

• Transactions of the Korean Society of Automotive Engineers
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• v.10 no.3
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• pp.130-135
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• 2002

This study investigates the effect of curing method on the bonding strength of aluminum/CFRP composites. The surface of aluminum panel was treated by DC plasma. Lap shear tests and T-peel tests were performed based on the procedure of ASTM 906-94a and ASTMD1876-95, respectively. Test samples were fabricated by using the co-curing method and the secondary curing method. The results showed that the shear strength of test samples made by the co-curing method was 2.5 times greater than that of test samples made by the secondary curing method. The T-peel strength of the co-curing method case was almost 2 times greater than that of the secondary curing method case.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.12
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• pp.1981-1987
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• 2001

This paper documents the effect of surface treatment of aluminum on the bonding strength of aluminum/CFRP composites. The surface of aluminum panel was treated by DC plasma. The optimal treatment condition of the aluminum was determined by measuring the contact angle and T-peel strength as functions of mixture ratio of acetylene gas to nitrogen gas. The mixture ratios used were 1:9, 3:7, 5:5, 7:3, and 9:1 Lap shear tests and T-peel tests were performed using surface-treated alumiunm/CFRP composites and regular alumiunm/CFRP composites. The results showed that the contact angle was minimized and the T-peel strength was maximized iota the mixture ratio of 5:5. The results also showed that the shear strength of surface-treated alumiunm/CFRP composites was 34% greater than that of regular alumiunm/CFRP composites. The T-peel strength of surface-treated alumiunm/CFRP composites was also 5 times greater than that of regular alumiunm/CFRP composites.

• The korean journal of orthodontics
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• v.31 no.2 s.85
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• pp.261-270
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• 2001

The purpose of this study was to evaluate the clinical usefulness of plasma arc light which can reduce the curing time dramatically compared by shear bond strengths and failure patterns of the brackets bonded with visible light in direct bracket bonding. Some kinds of brackets were bonded with the Transbond$^{\circledR}$ to the human premolars which were embedded in the resin blocks according to the various conditions. After bonding, the shear bond strength was tested by Instron universal testing machine and in addition , the amount of residual adhesive remaining on the tooth after debonding was measured by the stereoscope and assessed with adhesive remnant index(ARI). The results were as follows : 1. When plasma arc light was used for bonding the brackets, the shear bond strength was clinically sufficient in both metal and ceramic brackets, but resin brackets showed significantly lower bond strength but which was clinically useful. 2. When metal brackets were bonded using visible light, there was no significant difference in shear bond strength due to the light-curing time and the bond strength was clinically sufficient. 3. When the adhesive failure patterns of brackets bonded with plasma arc light were observed by using the adhesive remnant index, the bond failure of the metal and resin bracket occurred more frequently at bracket-adhesive interface but the failure of the ceramic bracket occurred more frequently at enamel-adhesive interface. 4. There was no statistically significant difference of the shear bond strength and adhesive failure pattern between metal bracket bonded for 2 seconds by curing with plasma arc light and 10 seconds by curing with visible light. 6. When metal brackets were bonded using plasma arc light, the shear bond strength decreased as the distance from the light source increased. The above results suggest that plasma arc light can be clinically useful for bonding the brackets without fear of the decrease of the shear bond strength.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.733-734
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• 2011

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.197-197
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• 2012

Device 제작에 사용된 graphene은 일반적인 lithography 공정에서 resist residue에 의한 오염을 피할 수 없으며 이로 인하여 graphene의 pristine한 성질을 잃어버린다. 본 연구에서는 graphene을 저밀도의 argon inductively coupled plasma (Ar-ICP)를 통해 처리함으로서 graphene based back-gated field effect transistor (G-FET)의 특성변화를 유도한 결과에 대해서 보고한다. Argon capacitively coupled plasma (Ar-CCP)은 에 노출된 graphene은 강한 ion bombardment energy로 인하여 쉽게 planar C-C ${\pi}$ bonding (bonding energy: 2.7 eV)이 breaking되어 graphene의 defect이 발생되었다. 하지만 우리의 경우 저밀도의 Ar-ICP가 적용될 때 graphene의 defect이 제한되며 이와 동시에 contamination 만을 제거할 수 있었다. 소자의 전기적 측정 (Gsd-Vbg)을 통하여 contamination으로 인하여 p-doping된 graphene은 pristine 상태로 회복되었으며 mobility도 회복됨이 확인되었다. Ar-ICP를 이용한 graphene cleaning 방법은 저온공정, 대면적 공정, 고속공정을 모두 만족시키며 thermal annealing, electrical current annealing을 대체하여 graphene 기반 소자를 생산함에 있어 쉽고 빠르게 적용할 수 있는 강점이 있다.

• Elastomers and Composites
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• v.34 no.4
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• pp.299-314
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• 1999

Bonding metal and textile components to rubber has always posed a problem. In this paper, an attempt had been made to modify textile and metal surfaces for bonding with rubber. The metal surfaces were modified using silane coupling agents and textile fibers were modified using plasma polymerization techniques. Some results on adhesion of metals to a range of sulfur-cured rubber compounds using a combination of organofunctional silanes are given here. The treatment was not only effective for high-sulfur compounds but also for low-sulfur com pounds as used in engine mounts and even for some semi-EV compounds. Coatings of plasmapolymerized pyrrole or acetylene were deposited on aramid and polyester tire cords. Standard pull-out force adhesion measurements were used to determine adhesion of tire cords to rubber compounds. The plasma coatings were characterized by various techniques and the performance results are explained in an interpenetrating network model.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.19-26
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• 2007

This study was focused on the feasibility of ultrasonic bonding of Au flip chip bumps for a practical complementary metal oxide semiconductor (CMOS) image sensor with electroplated Au substrate. The ultrasonic bonding was carried out with different bonding pressures and times after the atmospheric pressure plasma cleaning, and then the die shear test was performed to optimize the ultrasonic bonding parameters. The bonding pressure and time strongly affected the bonding strength of the bumps. The Au flip chip bumps were successfully bonded with the electroplated Au substrate at room temperature, and the bonding strength reached approximate 73 MPa under the optimum conditions.