• Korean Journal of Optics and Photonics
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• v.16 no.3
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• pp.239-247
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• 2005

In this study, we have used newly developed dual-beam shearography which is based on laser speckle that includes various information about an object. Among the several shearing techniques, we used Michelson shearing interference technique which is the most powerful. Acrylate plate was used as a sample, which has inner defects and low thermal conductivity. Michelson shearing interferometer was used for obtaining speckle fringes. We also used phase shifting technique to get a phase map. Using single beam illumination, we could obtain mixture of deformation components of both in-plane and out-of-plane. In order to separate the two components, we have used dual-beam shearography technique. We have obtained a speckle pattern of both before and after deformation. Through LS filtering and unwrapping processes, we could find a position and a shape of the inner defects easily. Deformation of the acrylate plate due to thermal heating has occurred mainly in z-direction(out-of-plane) because it has low thermal conductivity. The acrylate plate was deformed only at the restricted area where the electrical heat applied.

• Journal of the Korean Geotechnical Society
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• v.21 no.10
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• pp.85-97
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• 2005

Despite a number of advantages of reinforced earth walls over conventional concrete retaining walls, there exist concerns over long-term residual deformation when subjected to repeated and/or cyclic loads, especially when used as part of permanent structures. In view of these concerns, in this paper time-dependent deformation characteristics of geosynthetic reinforced soil under sustained and/or repeated loads were investigated using a series of plane strain compression tests on geogrid reinforced weathered granite soil specimens. The results indicate that sustained or repeated loads can yield appreciable magnitudes of residual deformations, and that the residual deformations are influenced not only by the loading characteristics but by the mechanical properties of geogrid. It is also found that the preloading technique can be effectively used in controlling residual deformations of reinforced soils subjected to sustained and/or repeated loads.

• Transactions of the Korean Society of Mechanical Engineers
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• v.13 no.5
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• pp.911-920
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• 1989

It this study, beam-type bend specimen is used to evaluate the interlaminar fracture toughness of laminated composite under mixed-mode deformations. The specimen is loaded under three-point bending and hence produced mixed-mode deformations in the vicinity of the crack tip according to the variation of the thickness ratio on delamination plane. Total energy release rate is obtained by elementary beam theory considering the effect of shear deformation. The partitioning of total value into mode-I and mode-II components is also performed. The mixed-mode interlaminar fracture toughness is evaluated by experiments on specimens with several thickness ratios of delamination plane. As the part of delamination plane is thicker, the effect of shear deformation on total energy release rate is increased. Beam-type bend specimen men may be applied to obtain informations on the mixed-mode interlaminar fracture behavior of laminated composites.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.5
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• pp.563-571
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• 2012

In 3D integration package using TSV technology, bonding is the core technology for stacking and interconnecting the chips or wafers. During bonding process, however, warpage and high stress are introduced, and will lead to the misalignment problem between two chips being bonded and failure of the chips. In this paper, a finite element approach is used to predict the warpages and stresses during the bonding process. In particular, in-plane deformation which directly affects the bonding misalignment is closely analyzed. Three types of bonding technology, which are Sn-Ag solder bonding, Cu-Cu direct bonding and SiO2 direct bonding, are compared. Numerical analysis indicates that warpage and stress are accumulated and become larger for each bonding step. In-plane deformation is much larger than out-of-plane deformation during bonding process. Cu-Cu bonding shows the largest warpage, while SiO2 direct bonding shows the smallest warpage. For stress, Sn-Ag solder bonding shows the largest stress, while Cu-Cu bonding shows the smallest. The stress is mainly concentrated at the interface between the via hole and silicon chip or via hole and bonding area. Misalignment induced during Cu-Cu and Sn-Ag solder bonding is equal to or larger than the size of via diameter, therefore should be reduced by lowering bonding temperature and proper selection of package materials.

• Proceedings of the Korean Geotechical Society Conference
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• 2003.06a
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• pp.155-164
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• 2003

• Proceedings of the KSME Conference
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• 2001.06c
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• pp.251-256
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• 2001

Deformation analysis of injection molded articles whose geometry is considered as the assembly of the thin flat plates has been conducted. For the in-mold analysis, thermo-viscoelastic stress calculation of rheologically simple amorphous polymer and in-mold deformation calculation considering the in-plane mold constraint has been done. Free volume theory has been used for the non-equilibrium density state by the fast cooling. At ejection, the redistribution of stress together with instantaneous deformation has been considered. During out-of-mold cooling after ejection, thermoelastic model based on the effective temperature has been adopted for the calculation of deformation. Two typical mold geometries are used to test the numerical simulation.

• Journal of Mechanical Science and Technology
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• v.14 no.2
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• pp.251-258
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• 2000

Thermal deformation in an electronic package due to thermal strain mismatch is investigated. The warpage and the in-plane deformation of the package after encapsulation is analyzed using the laminated plate theory. An exact solution for the thermal deformation of an electronic package with circular shape is derived. Theoretical results are presented on the effects of the layer geometries and material properties on the thermal deformation. Several applications of the exact solution to electronic packaging product development are illustrated. The applications include lead on chip package, encapsulated chip on board and chip on substrate.

• Journal of Mechanical Science and Technology
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• v.20 no.5
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• pp.621-633
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• 2006

To reflect the size effect of material $(1\sim15{\mu}m)$ during plastic deformation of polycrystalline copper, a constitutive equation which includes the strain gradient plasticity theory and intrinsic material length model is coupled with the finite element analysis and applied to plane strain deformation problem. The method of least square has been used to calculate the strain gradient at each element during deformation and the effect of distributed force on the strain gradient is investigated as well. It shows when material size is less than the intrinsic material length $(1.54{\mu}m)$, its deformation behavior is quite different compared with that computed from the conventional plasticity. The generation of strain gradient is greatly suppressed, but it appears again as the material size increases. Results also reveal that the strain gradient leads to deformation hardening. The distributed force plays a role to amplify the strain gradient distribution.

• Structural Engineering and Mechanics
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• v.48 no.4
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• pp.547-567
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• 2013

Nonlinear behavior of functionally graded material (FGM) plates under thermal loads is investigated here using an efficient sinusoidal shear deformation theory. The displacement field is chosen based on assumptions that the in-plane and transverse displacements consist of bending and shear components, and the shear components of in-plane displacements give rise to the sinusoidal distribution of transverse shear stress through the thickness in such a way that shear stresses vanish on the plate surfaces. Therefore, there is no need to use shear correction factor. Unlike the conventional sinusoidal shear deformation theory, the proposed efficient sinusoidal shear deformation theory contains only four unknowns. The material is graded in the thickness direction and a simple power law based on the rule of mixture is used to estimate the effective material properties. The neutral surface position for such FGM plates is determined and the sinusoidal shear deformation theory based on exact neutral surface position is employed here. There is no stretching-bending coupling effect in the neutral surface-based formulation, and consequently, the governing equations and boundary conditions of functionally graded plates based on neutral surface have the simple forms as those of isotropic plates. The non-linear strain-displacement relations are also taken into consideration. The thermal loads are assumed as uniform, linear and non-linear temperature rises across the thickness direction. Closed-form solutions are presented to calculate the critical buckling temperature, which are useful for engineers in design. Numerical results are presented for the present efficient sinusoidal shear deformation theory, demonstrating its importance and accuracy in comparison to other theories.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.13 no.1
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• pp.105-113
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• 2000

Seismic behavior of 3-dimensional setback structures showing abrupt reductions of the floor size within the structure height and the effect of in-plane deformations of floor slabs on the seismic behavior of those structures are investigated. To find out general seismic behavior of 3-dimensional setback structures two parameters, level of setback(L/sub s/) and degree of setback(R/sub s/) are used. Analysis results obtained from forty eight setback structures show that a sudden change in story shear near setback level is occurred for irregular setback structures. The effect of in-plane deformation of floor slabs on the seismic behavior of setback structures is greatly influenced by the arrangement of lateral load resisting elements and it is more pronounced for frame-shear wall system showing large difference in stiffness among the lateral load resisting elements. The in-plane deformation of floor slabs results in reduced base shear, especially for FW-type structures with L/sub s/=1.0. Also, it brings about reduced story shear for the lateral load resisting element with shear wall and increase in story shear lot the lateral load resisting element without shear wall. The in-plane deformation of floor slabs at the base portion and/or tower portion due to difference in stiffness among the lateral load resisting elements brings about increment of floor displacements at all floor level.