• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.73-77
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• 2015

This paper presents integrated polymeric spectrometer module which offers compact size, easily-fabricated structure and low cost. The proposed spectrometer module includes the nano diffraction grating with non-uniform pitch and planar optical waveguide with concave mirror to be fabricated by UV imprint lithography. To increase the reflection efficiency, we designed the nano diffraction grating with triangular profiles. The polymeric planar spectrometer includes a spectral bandwidth of 700 nm, resolution of 10 nm and precision below 5 nm. This polymeric planar spectrometer is well-suited for sensor system.

• Korean Journal of Optics and Photonics
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• v.28 no.2
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• pp.53-58
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• 2017

This paper presents the design and fabrication of a planar nano-diffraction grating for an integrated miniature spectrometer module. The proposed planar nano-diffraction grating consists of nonuniform periods, to focus the reflected beams from the grating's surface, and an asymmetrical V-shaped groove profile, to provide uniform diffraction efficiency in the wavelength range from 400 to 650 nm. Also, to fabricate the nano-diffraction grating using low-cost UV-NIL technology, we analyzed the FT-IR spectrum of a uvcurable resin and optimized the conditions for the UV curing process. Then, we precisely fabricated the polymeric nano-diffraction grating within 5 nm in dimensional accuracy. The integrated spectrometer module using the fabricated polymeric planar nano-diffraction grating provides spectral resolution of 5 nm and spectral bandwidth of 250 nm. Our integrated spectrometer module using a polymeric planar nano-diffraction grating serves as a quick and easy solution for many spectrometric applications.

• Journal of Institute of Control, Robotics and Systems
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• v.5 no.3
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• pp.324-337
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• 1999

In this work, a new 3-PSP type spatial 3-degree-of-freedom parallel mechanism is proposed. And a 6 DOF hybrid manipulator which consists of a 3-PPR type planar 3 DOF parallel mechanism and a new 3-PSP type spatial 3-degree-of-freedom parallel mechanism is proposed. Both 3 DOF mechanism modules have closed-form forward position solutions and particularly, 3-PSP spatial module has unique forward position solution. Firstly, the closed-form position analysis and first-order kinematic analysis for the proposed 3-PSP type module are carried out, and the first-order kinematic characteristics are examined via maximum singular value and the isotropic index of the mechanism. It is shown through these analyses that the mechanism has excellent isotrpic property throughout the workspace. Secondly, position and kinematic analysis of the 3-PPR planar module are briefly described. Thirdly, the forward position analysis for the 3-PPR 3-PSP type 6 degree-of-freedom hybrid mechanism consisting of a 3-PPR planar module and a 3-PSP spatial module is performed along with the analysis of the workspace size and first-order kinematic characteristics. The kinematic characteristics of the proposed hybrid manipulator are compared to those of geometrically similar Stewart manipulator.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1106-1107
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• 2007

Planar magnetic based design technologies have been widely applied to power design for better cooling and ease of fabrication. The planar transformer and the planar inductor have a low profile characteristics compare to the conventional transformer which would be more cubical in volume. High frequency operation of magnetic components is a main key to achieve high power density of the power module. However, at a high frequency, the skin effect and the proximity effect have to be considered very significantly in magnetic design and also the parasitics in the converter cannot be ignored. This paper deals with the design and the experiment of planar integrated magnetic component. The optimal design for planar magnetics is summarized.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.3
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• pp.241-246
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• 2012

A layered planer SOFC module was designed from planar-type SOFC. It was prepared by multi-layered ceramic technology. To form the cathode and the anode in the layered structure, reliable channels should be made on the both side of electrolyte perpendicularly. However, monolithic SOFC using multi-layered ceramic technology hasn't been studied another group, and the warpage of electrolyte in the channel, also, hasn't been studied, when electrode is printed on the electrolyte. In this study, the channels are prepared with electrode printing, and their warpage are evaluated. In the case of YSZ without electrode, the warpages are nothing in the limit of measurement using optical microscope. The warpage of 'YSZ-NiO printed' increases than that of 'NiO printed', and also, the case of 'double electrode printed' is similar to 'YSZ-NiO printed'. It is thought that, in the printed electrolyte, the warpage is related to the difference of the sintering behavior of each material.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.10
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• pp.826-831
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• 2009

In this paper, a high power RF amplifier module using AlN substrate of high thermal conductivity has been proposed. This RF amplifier module has the advantage of compact size and effective heat dissipation for the packaging of high power chip. To fabricate the thru-hole and scribing line on AlN substrate, the key parameters of $CO_2$ laser were experimented. And then, microstrip lines and spiral planar inductors were fabricated on an AlN substrate using the thin-film process. The fabricated microstrip lines on the AlN substrate has an attenuation value of 0.1 dB/mm up to 10 GHz. The fabricated spiral planar inductor has a high quality factor, a maximum of about 62 at 1 GHz for a 5.65 nH inductor. Packaging of a RF power amplifier was implemented on an AlN substrate with thru-hole. From the measured results, the gain is 24 dB from 13 to 15 GHz and the output power is 33.65 dBm(2.3 W).

• Journal of IKEEE
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• v.17 no.3
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• pp.360-364
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• 2013

The maximum breakdown voltage's characteristic within the Super Junction MOSFET structure comes from N-Drift and P-Pillar's charge balance. By developing P-Pillar from Planar MOSFET, it was confirmed that the breakdown voltage is improved through charge balance, and by setting the gate voltage at 10V, the characteristic comparisons of Planar MOSFET and Super Junction MOSFET are shown in picture 6. The results show that it had the same breakdown voltage as Planar MOSFET which increased temperature resistance by 87.4% at $.019{\Omega}cm^2$ which shows that by the temperature resistance increasing, the power module's power dissipation improved.

• Journal of Korean Institute of Industrial Engineers
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• v.23 no.2
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• pp.359-370
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• 1997

We consider a facility layout problem with the objective of minimizing total transportation distance, which is the sum of rectilinear distances between facilities weighted by the frequency of trips between the facilities. It is assumed that facilities are required to have rectangular shapes and there is no empty space between the facilities in the layout. In this study, a graph theoretic heuristic is developed for the problem. In the heuristic, planar graphs are constructed to represent adjacencies between the facilities and then the graphs are converted to block layouts on a continual plane using a layout construction module. (Therefore, each graph corresponds to a layout.) An initial layout is obtained by constructing a maximal weighted planar graph and then the layout is improved by changing the planar graph. A simulated annealing algorithm is used to find a planar graph which gives the best layout. To show the performance of the proposed heuristic, computational experiments are done on randomly generated test problems and results are reported.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.24 no.12A
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• pp.1932-1938
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• 1999

In this paper, planar duplexer module combined with power amplifier is described. This new scheme is to enhance power efficiency as well as to minimize the size of RF circuit in CDMA phone. Each filter which was a part of duplexer, was realized with planar type and rearranged into the power amplifier module on the multilayer board. Each electrical specifications of existing power amplifier and duplexer were satisfied. Especially, ACPR performances measured at output power of 24dBm which is 2dB lower than that of a conventional one, meet IS-95 for a power amplifier of CDMA phone. Overall current about 80mA has been successfully saved as a result of new scheme. In addition, the module size has been reduced to be as small as 1.08CC.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.12
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• pp.866-870
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• 2014

In solid oxide fuel cell system, yttria-stabilized zirconia is generally adopted as the electrolyte, which has high strength and superior oxygen ion conductivity, and the air electrode and the fuel electrode are attached to this. Recently, new structure of 'layered planar SOFC module' was suggested to solve the reliability problem due to the high temperature stability of a sealing agent and a binding material. In this study to materialize the air electrode in a layered planar SOFC module, the LSM ink was coated to form homogeneous electrode in the channel after the ink preparation. As the porosity control agent, PMMA or active carbon powder was adopted with use of a commercial dispersant in ethanol. The optimal amounts of both the porosity control agents and the dispersant were determined. Four (4) vol% of the dispersant for the LSM-PMMA case and 15 vol% for LSM-carbon powder showed the lowest viscosities respectively to indicate the best dispersed states of the slurries. With PMMA and carbon powder, sintered LSM ink shows the relatively homogeneous distributions of pores and with increases of the agents, the porosities increased in both cases. From this, it can be thought that the amount of the PMMA or carbon powder could be used to control the porosity of the LSM ink.