• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.1
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• pp.41-46
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• 2004

In this paper, we present a new combined field integral equation (CFIE) formulation for the analysis of electromagnetic scattering from arbitrarily shaped three-dimensional perfectly conducting and piecewise homogeneous dielectric composite body. The conducting/dielectric structures are approximated by planar triangular patches, which have the ability to conform to any geometrical surface. The surface covering the conducting body is replaced by an equivalent surface electric current and the surface of the dielectric by equivalent electric and magnetic currents. The all equivalent currents are approximated in terms of RWG (Rao, Wilton, Glisson) functions. The objective of this paper is to illustrate that the CFIE is a valid methodology in removing defects, which occur at a frequency corresponding to an internal resonance of the structure. Numerical results are presented and compared with solutions obtained using other formulations.

• Transactions of Materials Processing
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• v.9 no.2
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• pp.128-139
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• 2000

Wrinkling is one of the major defects in sheet metal products and may be also attributable to the wear of the tool. The initiation and growth of wrinkles are influenced by many factors such as stress state, mechanical properties of the sheet material, geometry of the body, and contact condition. It is difficult to analyze the wrinkling initiation and growth considering the factors because the effects of the factors are very complex and the wrinkling behavior may show a wide variation for small deviations of the factors. In this study, the bifurcation theory is introduced for the finite element analysis of wrinkling initiation and growth. All the above mentioned factors are conveniently considered by the finite element method. The finite element formulation is based on the incremental deformation theory and elastic-plastic elements considering the planar anisotropy of the sheet metal. The proposed method is verified by employing a column buckling problem. And then, the initiation and growth of wrinkling in deep drawing of cylindrical cup are analyzed.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.567-568
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• 2006

We investigate the structures and the formation energy of inversion domain boundaries (IDBs) using the Tersoff empirical potential. Four kinds of IDBs ( A and B types for IDB* and Holt ) are considered. The IDBs with A type are energetically favorable compared to B type with the structural instability. The IDB* is also more stable than the Holt type in spite of fourfold and eightfold rings of bonds. We calculate the atomic configurations of the Holt IDBs induced by the interactions of the IDB* with the stacking faults $I_1$ and $I_2$. The stacking fault $I_2$ interacted with $I_1$ on the IDB induces the structural transformation from IDB* to Holt type.

• Journal of the Korean Society for Nondestructive Testing
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• v.31 no.1
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• pp.32-39
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• 2011

The object of this study is to evaluate and discriminate nondestructively the dislocation substructures of Cu and Cu-Zn alloy subjected to the low-cycle-fatigue. The ultrasonic wave velocity, electrical resistivity and positron annhilation lifetime(PAL) were measured to the nondestructive testing. Cyclic fatigue test of Cu and Cu-Zn alloy with much different stacking fault energies was conducted and the correlations between dislocation behavior and nondestructive parameters were studied. Dislocation cell substructure was developed in Cu, while planar array of dislocation structure was developed in Cu-35Zn alloy only increasing dislocation density with fatigue cycles. Decrease in ultrasonic wave velocity, increase in electrical resistivity and PAL were shown because of the development of lattice defects, dislocations and vacancies, by cyclic fatigue at room temperature. In contrast to Cu-Zn alloy of the planar-array dislocation substructure showing continuous changes in the nondestructive parameters, it does not make any noticeable changes in the nondestructive parameters after the evolution of dislocation cell substructure in Cu.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.4 no.3
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• pp.713-719
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• 2000

In order to Prepare the$Ge_xSi_{1-x}/Si$(111) heterosructure by solid phase epitaxy (SPE), about 1000A of Au and about 1000A Ge were sequentially deposited on the Si(111) substrate. The resulting Ge/Au/Si(111) samples were isochronically annealed in the high vacuum condition. The behaviors of Au and Ge during thermal annealing and the structural Properties of $Ge_xSi_{1-x}$ films were characterized by Auger electron spectroscopy (AES), X-ray diffraction (XRD) and high resolution transmission electron microscopy (TEM). The a-Ge/Au/Si(111) structure was converted to the Au/GeSi/Si(111) structure. Defects such as stacking faults, point defects and dislocations were found at the GeXSil-X(111) interface, but the film was grown epitaxially with the matching face relationship of $Ge_xSi_{1-x}/$(111)/Si(111). Twin crystals were also found in the $Ge_xSi_{1-x}/$(111) matrix.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2022.10a
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• pp.570-573
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• 2022

This paper presents the identification of void diameters for a cast-resin transformer using an artificial neural network (ANN) model. A PD signal was measured by the Rogowski coil sensor which has the planar and thin structures fabricated on a printed circuit board (PCB), and the PD electrode system was fabricated to simulate a PD defect by a void. In addition, void samples with different diameters were fabricated by injecting air in a cylindrical aluminum frame using a syringe during the epoxy curing process. To identify the diameter of void defects, PD characteristics such as the discharge magnitude, pulse count, and phase angle were extracted and back propagation algorithm (BPA) was designed using virtual instrument (VI) based on the Labview program. From the experimental results, the BPA algorithm proposed in this paper has over 90% accurate rate to identify the diameter of void defects and is expected to use reference data of maintenance and replacement of insulation for cast-resin transformers in the on-site PD measurement.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.39-46
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• 2017

This paper presents the fabrication of ceramic insulation layer on metallic heat spreading substrate, i.e. an insulated metal substrate, for planar type heater. Aluminum alloy substrate is preferred as a heat spreading panel due to its high thermal conductivity, machinability and the light weight for the planar type heater which is used at the thermal treatment process of semiconductor device and display component manufacturing. An insulating layer made of ceramic dielectric film that is stable at high temperature has to be coated on the metallic substrate to form a heating element circuit. Two technical issues are raised at the forming of ceramic insulation layer on the metallic substrate; one is delamination and crack between metal and ceramic interface due to their large differences in thermal expansion coefficient, and the other is electrical breakdown due to intrinsic weakness in dielectric or structural defects. In this work, to overcome those problem, selected metal oxide buffer layers were introduced between metal and ceramic layer for mechanical matching, enhancing the adhesion strength, and multi-coating method was applied to improve the film quality and the dielectric breakdown property.

• ETRI Journal
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• v.32 no.2
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• pp.265-272
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• 2010

To supply a power distribution network with stable power in a high-speed mixed mode system, simultaneous switching noise caused at the multilayer PCB and package structures needs to be sufficiently suppressed. The uni-planar compact electromagnetic bandgap (UC-EBG) structure is well known as a promising solution to suppress the power noise and isolate noise-sensitive analog/RF circuits from a noisy digital circuit. However, a typical UC-EBG structure has several severe problems, such as a limitation in the stop band's lower cutoff frequency and signal quality degradation. To make up for the defects of a conventional EBG structure, a partially located EBG structure with decoupling capacitors is proposed in this paper as a means of both suppressing the power noise propagation and minimizing the effects of the perforated reference plane on the signal quality. The proposed structure is validated and investigated through simulation and measurement in both frequency and time domains.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.22 no.3
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• pp.688-694
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• 1998

The ability to locate the defects in materials is one of the major attrations of the acoustic emission(AE) technique. The most conventional method for planar AE source localization is to place three or more AE sensors on the plate and to determine the source position by measuring the differences in the arrival times of the AE wave at the sensors, which is called as triangulation method. But this method can not be applied in the material of which elastic wave propagtion velocity is not known. In this paper, we propose two methods, vector method and error minimization method, for AE source location on the material with unknown AE wave velocity. In this method, it is not needed to know the propagation velocity previously, that is, we can apply this method to arbitrary material of which properties are not known exactly. Also, in this paper, the robustness to the error in the measurement of time differences are discussed for both methods. Finally, in order to evaluate the actual performances, experiments using a pencil lead break as the AE source were carried out on the aluminum plate.

• The Journal of the Korea Contents Association
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• v.10 no.5
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• pp.20-28
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• 2010

In this paper, we propose a hand gesture interface for the manipulation of augmented objects in 3D space using a camera. Generally a marker is used for the detection of 3D movement in 2D images. However marker based system has obvious defects since markers are always to be included in the image or we need additional equipments for controling objects, which results in reduced immersion. To overcome this problem, we replace marker by planar hand shape by estimating the hand pose. Kalman filter is for robust tracking of the hand shape. The experimental result indicates the feasibility of the proposed algorithm for hand based AR interfaces.