• Journal of Advanced Marine Engineering and Technology
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• 제38권10호
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• pp.1244-1250
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• 2014

The temperature of the main engine cabin of commercial vessel is very high. The material SS-316L undergoes creep damage at temperatures exceeding $450^{\circ}C$. It is essential to maintain the highly stressed engine cabin below the creep regime. Hence, seawater is employed in this kind of maritime vehicles as cooling liquid. It obtains the thermal energy at the cooling pipe line after passing through main engine cooling system. To harness the energy in the seawater, a turbine can be installed to absorb the energy in the seawater before being released into the sea. In this study, a cooling pipe line is selected to apply the tubular type hydro turbine for transferring the energy. Numerical analysis for investigating the performance and the internal flow characteristics of the tubular turbine is conducted. The results show that the maximum efficiency of 85.8% is achieved although the efficiency drops rapidly at partial flow rate condition. The efficiency descends slowly at the condition of excess flow rate. There is a relatively wide operating range of flow rate of this turbine to keep high efficiency at the excess flow rate condition. For the internal flow of the turbine, there is uniform streamline on the suction and pressure sides of the blade at the design point. However, the secondary flow appears at the suction and pressure sidesat the excess flow rate.In addition, it appears only at pressure side at the partial flow rate condition.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2008년도 추계학술대회 논문집
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• pp.422-429
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• 2008

The objective of the present study is to develope a propultion unit cooling system for the next-generation High-speed EMU. The propulsion power control unit consists of some IGBT semiconductors. In general, those power semiconductors are very sensitive to temperatures and need a cooling system to keep them at a proper operational conditions in the range of $50{\sim}100^{\circ}C$. In this first year of study, we tried to focuss on the understanding of fundamental technologies for each of the two different cooling systems and collecting basic data for design and manufacturing for both cases. For the water cooling system, a heat sink with multi channels of liquid flow was considered and a model unit was designed and performance test was conducted. For the heat pipe cooling system, a Loop Heat Pipe(LHP) was considered as an element to transport heat from IGBT to environment air flow and a model unit was designed and performance test was conducted. The analysis using SINDA/FLUINT showed that those design parameters are good enough for the LHP to properly operate under a heat load up to around 360W.

• 대한기계학회논문집B
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• 제22권6호
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• pp.734-749
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• 1998

A numerical study t predict the characteristics on transient operation of the heat pipe cooling system with multiple heaters for electronic system has been performed. The heat pipe cooling system of 45 cm length and 16 mm diameter was composed of evaporator section with four heaters which simulate electronic components, insulated transport section, and condenser section with a conductor which was cooled under the constant heat flux boundary condition. Two test cases were investigated in present study; Case 1 indicated that the 1st and 2nd heaters among four heaters were heated off, while the 3rd and the 4th heaters were heated on. Case 2 was the inverse situation switched from heating locations of Case 1. Case 3 indicated that the 1st and 4th heaters among four heaters were heated off, while the 2nd and 3rd heaters were heated on. The results showed that the transient time to reach the steady state is shorter for Case 1 than for Case 2. Especially, the maximum temperature among the heaters which simulate electronic components during switching operation is relatively small compared to the maximum allowable operating temperature in electronic system. It is concluded that the heat pipe cooling system in present study operate with the good thermal reliability even for sudden switching situation of the heaters.

• 한국정밀공학회지
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• 제23권9호
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• pp.164-173
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• 2006

The cooling capacity of a micro-heat pipe is mainly governed by the magnitude of capillary pressure induced in the wick structure. For microchannel wicks, a higher capillary pressure is achievable for narrower and deeper channels. In this study, a metallic micro-heat pipe adopting high-aspect-ratio microchannel wicks is fabricated. Micromachining of high-aspect-ratio microchannels is done using the laser-induced wet etching technique in which a focused laser beam irradiates the workpiece placed in a liquid etchant along a desired channel pattern. Because of the direct writing characteristic of the laser-induced wet etching method, no mask is necessary and the fabrication procedure is relatively simple. Deep microchannels of an aspect ratio close to 10 can be readily fabricated with little heat damage of the workpiece. The laser-induced wet etching process for the fabrication of high-aspect-ratio microchannels in 0.5mm thick stainless steel foil is presented in detail. The shape and size variations of microchannels with respect to the process variables, such as laser power, scanning speed, number of scans, and etchant concentration are closely examined. Also, the fabrication of a flat micro-heat pipe based on the high-aspect-ratio microchannels is demonstrated.

• 설비공학논문집
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• 제18권3호
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• pp.231-239
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• 2006

An experimental investigation of a Reversible Loop Heat Pipe (RLHP) was conducted to determine the operating limits and performance characteristics as functions of the thermophysical parameters, the heat input, and the cooling intensity. Variations in both temperature and heat transport capacity were measured and analyzed in order to accurately evaluate the transient operating characteristics. In addition, the maximum heat transport as a function of the mean evaporator temperature, the ratio of heat transport to heater input power as a function of the mean evaporator temperature, and the overall thermal resistance as a function of the overall heat transport capacity were examined as well. Results indicated that the cooling intensity played an important role on the operating characteristics and performance limitation. The maximum heat transports corresponding to cooling intensity $72W/^{\circ}C$ and $290W/^{\circ}C$ were 446 W and 924 W, respectively. Also, observation of the startup characteristics indicated that the mean evaporator temperature should be maintained between $40^{\circ}C$ and $60^{\circ}C$, and overall thermal resistance were measured as $0.02^{\circ}C/W$.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.1241-1246
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• 2004

The heat flux on a chip is rapidly increasing with decreasing the size of one. It is necessary to properly cool the high heat flux chip. One of the promising cooling methods is to apply CPL heat pipes with porous materials, for example PVA, polyethylene, and powder sintered metal plate and with microchannels in the evaporator. A small scale CPL heat pipe with PVA as wick was designed and manufactured. Since the height difference between the evaporator and the condenser is a crucial parameter in the CPL heat pipes, the performance of the heat pipes depending on the parameter was investigated. The parameter is higher the performance is better. However, the improvement rate of the performance does not increase the increase rate of the height. In addition to, the parameter effect depending on heat input was investigated.

• 설비공학논문집
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• 제13권8호
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• pp.796-802
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• 2001

The purpose of the present study is to examine the heat transfer characteristics of the U-shape heat pipe for the cooling of semiconductor in subway train. Perflouro-carbon(PFC) was used as working fluid. Temperature distribution on the surface and heat transfer coefficients were investigated according to the working fluid volume percent and heating rate. The results were as follows; Optimum volumetric percent of working fluid was from 80% to 90%, and hat transfer coefficients of evaporation and condensation were as follows, respectively. $\hbar_ie=0.37\times(\frac{P_i}{P_O})$l_c}^0.3$,$\hbar_ic-4.2(\frac{\kappa_l^3p_l^2gh_fg}{\mu_lq_c_l_c}^\frac{1}{3}

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회B
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• pp.2137-2143
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• 2008

This paper investigates the plate loop heat pipe system with an evaporator mounted with fin-wick structure to dissipate effectively the heat generated by the electronic components. The heat transfer formulation is modeled and predicted through thermal resistance analysis of the fin-wick structure in the evaporator. The experimental approach measures the thermal resistances and the operating characteristics. These results gathered in this investigation have been used to the objective of the information to improve the LHP system design so as to apply as the future cooling devices of the electronic components.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2002년도 봄 학술발표회 논문집
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• pp.439-444
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• 2002

Geothermal or ground source heat pumps(GSHPs) are electrically powered systems that take advantage of the earth's relatively constant temperature to provide heating, cooling, and hot water for homes and commercial buildings. The buried pipe, or ground loop, is the most recent technical advance in heat pump technology. The idea to bury pipe in the ground to gather heat energy began in the 1940s. Only recently, however, have new heat pump designs and improved buried pipe materials been combined to make GHP systems the most efficient heating and cooling systems available. The aim of the study is application of the GSHP system in korea. Our environments for economy, politics and society are different from other countries. For a case, the progressive tax rate of home electricity is represented.

• 전기학회논문지
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• 제64권11호
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• pp.1626-1630
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• 2015

This paper reflected the Temperature test value and compare the Computational Fluid Dynamic analysis value on particular characteristics of the multi-winding transformer's cooling apparatus equipped by heat pipe with excellent heat transfer ability on design Particularly if you look at multi-winding transformers that supply high-quality Direct current power to silicon production apparatus, heat generation due to high current supply is excessive thus, an innovative cooling apparatus is required in particular for reduced size transformer.