• Journal of Korea Society of Digital Industry and Information Management
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• v.12 no.1
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• pp.51-61
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• 2016

Because the Apple Pay which created by U.S's Apple Inc. and launch of Samsung pay in last August in domestic, people have high interest in Pin-Tech industries and new method of easy payment. In this paper, it will study newly introduced Pin-Tech industries and marketability of Pin-Tech industries. Also it will propose safe use of Pin-Tech services based on cases in domestic and overseas. This paper is organized as follows. In Chapter 2, it will study concept of Pin-Tech services and status of Pin-Tech services in domestic and overseas. In Chapter 3, it will look technical trends of Pin-Tech services. In Chapter 4, it will propose direction based on analysis of cases of Pin-Tech services. This paper will finish with conclusion in Chapter 5. Given the global trends, Korea is now just took the first steps in new Pin-Tech era. The Pin-Tech services are in situations that it is not yet activated in domestic due to the various financial regulations and procedures. In this paper, it will shows cases of concerns of Pin-Tech services and domestic authentication which relates to easy payment certification. If Pin-Tech services are develop with easy payment certification and adapt to domestic environment and develop based on stability and security as mentioned in this paper, domestic Pin-Tech services and security technology will grow to the world level. Also it requires unceasing research and efforts from relevant government officials, security companies and Pin-Tech ICT companies.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.24 no.6
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• pp.647-652
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• 2015

A probe pin is a key component of LED inspection equipment. The probe pin makes contact with the LED electrodes and supplies an electric current. Because the mechanical and electrical homogeneity of the probe surface affects the service life and reliability, its characterization is essential. For this study, the hardness was measured using a micro-Vickers hardness test. Moreover, the thicknesses of the plating at different locations and the elemental compositions were examined using an FE-SEM. The uniformity of the plating was found to be acceptable because palladium was detected consistently throughout the tested domain. In addition, the hardness of the surface was determined to be higher than that of the typical palladium range, which is attributed to the use of undercoated nickel.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.6
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• pp.29-34
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• 2002

This paper presents formation of ejector-pin hollowness in injection molding. Injection molding process is widely used in production of plastic part for good dimensional accuracy and high productivity. However, the injection molding leaves ejector-pin hollowness on pal, which causes bad part surface and quality. Dimensions and profiles of ejector-pin hollowness are measured for formation or ejector-pin hollowness. The formation of ejector-pin hollowness is traced with dimensions and profiles of ejector-pin hollowness. The compression force and moment cause ejector-pin to form hollowness on part surface.

• Journal of the Korea Institute of Information Security & Cryptology
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• v.27 no.4
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• pp.843-853
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• 2017

In the case of electronic payment, the obligation to use the certificate-based authentication was abolished. As Fin-tech service providers gain autonomy, various authentication methods are provided. SMS, ARS, PIN, Text-passwords, Fingerprints are popular authentication methods in the mobile Fin-tech services. In this study evaluate the usability and security of authentication methods in a unified mobile environment. We evaluate the usability through SUS and interview. Also we evaluate the security level of authentication methods through NIST guideline. At the result of the usability evaluation, Fingerprint authentication method had been determined as the highest usability, also Fingerprint authentication method had been determined as the safest authentication method by obtaining Security Level 4.

• Journal of the Korea Institute of Information Security & Cryptology
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• v.27 no.5
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• pp.1033-1047
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• 2017

Traditional explicit authentication, which requires awareness of the user's authentication process, is a burden on the user, which is one of main reasons why users tend not to employ authentication. In this paper, we try to reduce such cost by employing implicit authentication methods, such as biometrics and location based authentication methods. We define the 4-level security assurance model, where each level is mapped to an explicit authentication method. We implement our model as an Android application, where the implicit authentication methods are touch-stroke dynamics-based, face recognition based, and the location based authentication. From user experiment, we could show that the authentication cost is reduced by 14.9% compared to password authentication-only case and by 21.7% compared to the case where 6-digit PIN authentication is solely used.

• Radioisotope journal
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• v.21 no.4
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• pp.55-65
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• 2006

A passive type radon monitor adopting two silicon PIN detector as radiation detector has been developed, manufactured and test-evaluated. A radiation signal processing circuit has been electronically tested and then the radiation detection characteristics of this instrument has been performance-tested by using reference radon concentration and a reference photon radiation field. As a result, in a electronic performance test, radiation signals from each detector were well observed in each signal processing circuit. The radiation detection sensitivity of this instrument after several test-irradiations to a Cs-137 gamma radiation source and a standard radon concentration appeared to be 1.37 cph/$\mu$Svh-1 and 1.66 pCi/L respectively. The developed radon monitor in this paper could be used conveniently in monitoring of radon concentration in buildings which population utilize in Korea.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1004-1005
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• 2006

The effect of tempering temperature and microstructure on dry sliding wear behavior of quenched and tempered PM with 0.3% graphite and 1-2% Ni steels was investigated. The sintered specimens were quenched from $890^{\circ}C$ and then tempered at $200^{\circ}C$ and $600^{\circ}C$ for 1 hr. Wear tests were carried out on the quenched$\neq$tempered specimens under dry sliding wear conditions using a pin-on-disk type machine at constant load and speed. The experimental results showed that the wear coefficient effectively increased with increasing tempering temperature and decreased with increasing Ni content.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.10
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• pp.74-80
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• 2020

Crawler-type hydraulic devices facilitate forward and backward driving of construction equipment by converting power into mechanical energy. The existing hydraulic device performance test process is time- and labor-intensive. This study aims to improve efficiency and productivity by automating the hydraulic device production performance test processes, which have been separately conducted so far. We also used SolidWorksⓇ, a 3D modeling program, and ANSYSⓇ, a structural analysis tool, for structural analysis and to verify the suitability of fixing pins required for connecting a hydraulic device to performance test equipment. Our results that employing an automated hydraulic device performance test process improves efficiency.

• Journal of Korea Society of Digital Industry and Information Management
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• v.13 no.4
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• pp.107-113
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• 2017

Open platform technology in the banking industry is anticipated to impact the market very positively together with the activation of Fin Tech services. The domestic environment of payment services has been rapidly changing into the mobiles and multiple new payment services have been introduced from a variety of vendors. However, the convenience of payment always causes worsening the security, and the accidents on the security have been continued to occur such as leakage of personal information, hacking and so on upon the expansion of the industry and the market size. This study aims to analyze the status of Fin Tech open platforms and various problems of the related standard technologies, and to suggest the possible solutions. Upon the analysis results, it was confirmed that multiple solutions were required to improve the main security protocols of open platforms and to process the security functions diversely. In conclusion, the results of this study will be helpful to determine the direction of the solution on the security issues in the open platform environment of the current industry.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.27 no.12
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• pp.1084-1096
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• 2016

This paper presents method of design and analysis of a high-speed serial interface connector with a data rate of 12.5 Gbps. A high-speed serial interface connector is composed of various material and complex structures. It is very difficult to match the impedance of each discontinuous portion of connector. Therefore, this paper proposes the structure of a connector line that be simplified a connector. In the structure of proposed connector line, this research presents a method for extracting R, L, C and G parameters, analyzing the differential mode impedance, and minimizing the impedance discontinuity using time domain transmissometry and time domain reflectometry. This paper applies the proposed methods in the connector line to the high-speed serial interface connector. The proposed high-speed serial interface connector, which consists of forty-four pins, is analyzed signal transmission characteristics by changing the width and spacing of the four pins. According to the analysis result, as the width of the ground pin increases, the impedance decreases slightly. And as the distance between the ground pin and the signal pin increases, the impedance increases. In addition, as the width of the signal pin increases, the impedance decreases. And as the distance between the signal pin and the signal pin increases, the impedance decreases. The impedance characteristic of initial connector presents ranges from 96 to $139{\Omega}$. Impedance characteristic after applying the structure of proposed connector is shown as a value between 92.6 to $107.5{\Omega}$. This value satisfies the design objective $100{\Omega}{\pm}10%$.