• Title/Summary/Keyword: Pin shape factor

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Development of Side Forming Technology for the Tooth Part Using B.T.Pin in Cold Forming Process (B.T.Pin을 이용한 치형부품의 측면 냉간성형공법 개발)

  • Lee, J.S.;Park, S.J.;Kim, B.M.;Kim, D.H.
    • Transactions of Materials Processing
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    • v.26 no.2
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    • pp.95-100
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    • 2017
  • In this study, the method of process design for side forming of a tooth part used for a component of automobile transmission was suggested using FE-simulations. To develop the side forming for the tooth part, in this paper, the shape factors of B.T.Pin was considered as design parameters. The shape factors of B.T.Pin were selected to be the round of pin, reinforced angle and reinforced length. Based on FE simulation results, appropriate shape factor without causing any defects was selected. In addition, to increase the strength of pin, the combination of shape factor having minimum stress after side forming was selected using FE-simulation. In addition, with design of a die set, cold side forming of the tooth part was experimented to estimate effectiveness of the designed B.T.Pin. From experiments, it was found that the tooth part with complete formation of the tooth was obtained without making any forming defects and punch fracture.

Precision Measurement of Silicon Wafer Resistivity Using Single-Configuration Four-Point Probe Method (Single-configuration FPP method에 의한 실리콘 웨이퍼의 비저항 정밀측정)

  • Kang, Jeon-Hong;Yu, Kwang-Min;Koo, Kung-Wan;Han, Sang-Ok
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.60 no.7
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    • pp.1434-1437
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    • 2011
  • Precision measurement of silicon wafer resistivity has been using single-configuration Four-Point Probe(FPP) method. This FPP method have to applying sample size, shape and thickness correction factor for a probe pin spacing to precision measurement of silicon wafer. The deference for resistivity measurement values applied correction factor and not applied correction factor was about 1.0 % deviation. The sample size, shape and thickness correction factor for a probe pin spacing have an effects on precision measurement for resistivity of silicon wafer.

SHAPE OPTIMIZATION OF INTERNAL COOLING CHANNEL WITH STEPPED CIRCULAR PIN-FINS (단을 가진 원형 핀휜이 부착된 냉각유로의 형상 최적 설계)

  • Moon, M.A.;Kim, K.Y.
    • 한국전산유체공학회:학술대회논문집
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    • 2008.03a
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    • pp.229-232
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    • 2008
  • This study presents a numerical procedure to optimize the shape of stepped circular pin-fins to enhance turbulent heat transfer. The KRG method is used as an optimization technique with Reynolds-averaged Navier-Stokes analysis of fluid flow and heat transfer with shear stress transport turbulent model. The objective function is defined as a linear combination of heat transfer and friction loss related terms with a weighting factor. Ten training points are obtained by Latin Hypercube Sampling for two design variables. Optimum shape has been successfully obtained with the increased objective function.

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SHAPE OPTIMIZATION OF INTERNAL COOLING CHANNEL WITH STEPPED CIRCULAR PIN-FINS (단을 가진 원형 핀휜이 부착된 냉각유로의 형상 최적 설계)

  • Moon, M.A.;Kim, K.Y.
    • 한국전산유체공학회:학술대회논문집
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    • 2008.10a
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    • pp.229-232
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    • 2008
  • This study presents a numerical procedure to optimize the shape of stepped circular pin-fins to enhance turbulent heat transfer. The KRG method is used as an optimization technique with Reynolds-averaged Navier-Stokes analysis of fluid flow and heat transfer with shear stress transport turbulent model. The objective function is defined as a linear combination of heat transfer and friction loss related terms with a weighting factor. Ten training points are obtained by Latin Hypercube Sampling for two design variables. Optimum shape has been successfully obtained with the increased objective function.

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Stress Analysis and Lead Pin Shape Design in PGA (Pin Grid Array) Package (PGA (Pin Grid Array) 패키지의 응력해석 및 Lead Pin 형상설계)

  • Cho, Seung-Hyun;Choi, Jin-Won
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.2
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    • pp.29-33
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    • 2011
  • Research about the geometry design of lead pin was carried based on the normal or shear stress of the interface between a lead pin and a PCB in terms of delamination failure. The taguchi method with four design factors of three levels and FEA(Finite element Analysis) are carried under $20^{\circ}$ bending and 50 ${\mu}m$ tension of lead pin. The contact width, d2, between head round and copper pad in PCB is the highest affection factor among design factors by analysis of contribution analysis. Equivalent von Mises stress of 18.7% reduction design is obtained by the parameter design of the taguchi method. Maximum normal stress occurred at contact position between solder outer surface and a Cu pad in PCB. Also, maximum shear stress happened at contact position between solder outer surface and SR layer of PCB. From these calculated results, delamination of the PGA package may be occurred from outer interface of solder to inner interface of solder.

A Study on The Prediction of Workpiece Shape of The Electrochemical Machining by Boundary Element Method (경계요소법에 의한 전해가공물의 형상예측에 관한 연구)

  • 강대철;양재봉;김헌영;전병희
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2003.05a
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    • pp.443-447
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    • 2003
  • The BEM (Boundary Element Method) is a computational technique for the approximate solution of problems in continuum mechanics. In the BEM both volume and surface integrals transformed into boundary integral equations. So, we applied the ECM (Electrochemical Machining) process to boundary problem, because our focus is only deformed shape. The ECM process is modeled as a two-dimensional problem assuming constant properties of electrolyte, and an incremental formulation is used with automatic mesh regeneration. As a result the final shape is roughly agreed with experimental shape. But, it has an error of exact shape, because a chemically factor is not considered

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Shape Optimization of a Rotating Cooling Channel with Pin-Fins (핀휜이 부착된 회전하는 냉각유로의 최적설계)

  • Moon, Mi-Ae;Husain, Afzal;Kim, Kwang-Yong
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.34 no.7
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    • pp.703-714
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    • 2010
  • This paper describes the design optimization of a rotating rectangular channel with staggered arrays of pin-fins by Kriging metamodeling technique. Two non-dimensional variables, the ratio of the height to the diameter of the pin-fins and the ratio of the spacing between the pin-fins to the diameter of the pin-fins are chosen as the design variables. The objective function that is a linear combination of heat transfer and friction loss related terms with a weighting factor is selected for the optimization. To construct the Kriging model, objective function values at 20 training points generated by Latin hypercube sampling are evaluated by a three-dimensional Reynolds-averaged Navier-Stokes (RANS) analysis method with the SST turbulence model. The Kriging model predicts the objective function value that agrees well with the value calculated by the RANS analysis at the optimum point. The objective function is reduced by 11% by the optimization of the channel.

Criticality benchmark of McCARD Monte Carlo code for light-water-reactor fuel in transportation and storage packages

  • Jang, Junkyung;Lee, Hochul;Lee, Hyun Chul
    • Nuclear Engineering and Technology
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    • v.50 no.7
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    • pp.1024-1036
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    • 2018
  • In this paper, McCARD code was verified using various models listed in the NUREG/CR-6361 benchmark guide, which provides specifications for single pin-cells, single assemblies, and the whole core classified depending on the nuclear properties and structural characteristics. McCARD code was verified by comparing its results with those of SCALE code for single pin-cell and single assembly benchmark problems. The difference in the multiplication factor obtained through the two codes did not exceed 90 pcm. The benchmark guide treats a total of 173 whole core experiments. The experiments are categorized as simple lattices, separator plates, reflecting walls, reflecting walls and separator plates, burnable absorber fuel rods, water holes, poison rods, and borated moderator. As a result of numerical simulation using McCARD, the mean value of the multiplication factors is 1.00223 and the standard deviation of the multiplication factors is 285 pcm. The difference between the multiplication factors and the experimental value is in the range of -665 pcm to + 1609 pcm. In addition, statistics of results for experiments categorized by reactor shape, additional structure, burnable poison, etc., are detailed in the main text.

Experimental Study on the Corona Discharge Characteristics of the Pin-plate Electrode Geometries (핀이 부착된 와이어형 방전극의 형상에 따른 코로나 방전특성에 대한 연구)

  • Cheong Seongir;Lee Jaekeun;Chung Dongkyu;Ahn Youngchull
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.30 no.2 s.245
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    • pp.95-100
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    • 2006
  • Electrostatic precipitators(EPs) have low pressure drop and high dust collection efficiency and are widely used for industrial dust collectors. The current-voltage characteristics, which are important to maintain high dust collection efficiency, depend on several factor: discharge electrode shape, gas flow property, dust loading etc. In this study, experiments are performed to investigate the current-voltage characteristics of the corona discharge of various electrode geometries and an empirical model is proposed to predict current-voltage characteristics of the corona discharge. The corona onset voltage correction coefficient$(\alpha)$ and the geometry correction coefficient$(k_g)$ are used to the conventional equation for wire-plate type discharge electrode. The corona onset voltages are -6.3kV and almost constant when the numbers of discharge pins are varied from 3 to 9. The length of discharge pins has very sensitive effects on the corona onset voltage. They are increased from -6.3 to -7.8kV when the discharge pin length are 8.5 and 4.5mm, respectively. The empirical model shows good agreement with experimental results and can predict the effects of discharge pin length and number.

Observation of Dynamic Movement of Probing Pin on PCB Pad Using Electrical Reliability Test (인쇄회로 기판의 전기검사에서의 미세 탐침과 패드의 동적 거동 현상 관측)

  • Song, Seongmin;Cha, Gangil;Kim, Myungkyu;Jeon, Seungho;Yu, SangSeok
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.39 no.3
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    • pp.245-251
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    • 2015
  • In an electrical reliability test of a printed circuit board (PCB), the impact of the micro probing pins on the PCB needs to be checked to ascertain the quality of the circuit. In this study, the impact of the dynamic movement of the probing pin on the pad was observed. As a misaligned pin can exert horizontal force on the pad of the PCB, this study focused on the behavior of a misaligned probing pin. The parameters of observation were the circular and flat edges of the probing pin. The effects of the speed of movement, diameter, and the length of projection of the probing pin were also investigated. The results demonstrated that slippage angle is strongly affected by the shape of the edge of the probing pin, and that projection length is an important factor affecting pin slippage. In contrast, the speed of movement of the probing pin was able to double the slippage angle.