• Korean Journal of Acupuncture
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• 제24권3호
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• pp.105-116
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• 2007

Objectives : This study was performed to determine whether a pulse analyzer using array piezoresistive sensor was useful to characterize the variables of pulse wave of hypertentive patients (HT) , compared with those of healthy subjects. Methods : One hundred twenty two subjects participated in this study. Sixty nine subjects had hypertension and fifty three subjects had no specific history or disease associated with hypertension. We used automatic pulse analyzer with array piezoreslstive sensor. Results : Calibrated in Chon, no specific differences was between HT group and the healthy group. Calibrated in Gwan. sum of pulse pressure (SPP) of HT group was higher than that of the healthy group. Calibrated in Cheek, mean of height of main peak (Mm) and height of main peak (h1) of HT group were higher than those of the healthy group. Conclusions : Pulse analyzer was useful to determine the risk degree or development possibility of hypertension.

• 센서학회지
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• 제8권3호
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• pp.253-258
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• 1999

본 논문은 일기에 관한 대표적인 정보인 온도, 습도, 그리고 기압의 변화를 감지하여 일기를 예측하는 일기예보시스템을 개발함으로써, 가정에서 쉽게 일기에 대한 정보를 얻을 수 있도록 하는데 목적이 있다. 이를 위해 기상청으로부터 기상정보와 일기와의 관계를 분석하여, 차후 측정된 기상정보로부터 일기예보를 하는데 필요한 판단기준을 마련하였다. 또한, 자체적인 데이터 수집을 위해 반도체 압저항성을 이용한 압력센서와 온습도센서를 제작하고, 마이크로프로세서를 이용하여 시스템을 제작하였다.

• 한국마린엔지니어링학회:학술대회논문집
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• 한국마린엔지니어링학회 2000년도 춘계학술대회 논문집(Proceeding of the KOSME 2000 Spring Annual Meeting)
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• pp.105-109
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• 2000

Micronization of sensor is a trend of the silicon sensor development with regard to a piezoresistive silicon pressure sensor the size of the pressure sensor diaphragm have become smaller year by year and a microaccelerometer with a size less than 200-300${\mu}m$ has been realized. In this paper we study some of the micromachining processes of SOI(silicon on insulator)for the microaccelerometer and their subsequent processes which might affect thermal loads. The finite element method(FEM) has been a standard numerical modeling technique extensively utilized in structural engineering discipline for design of SOI wafers. Successful thermal behaviors analysis and design of the SOI wafers based on the tunneling current concept using SOI wafer depend on the knowledge abut normal mechanical properties of the SCS(single crystal silicon)layer and their control through manufacturing process

• 동력기계공학회지
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• 제5권4호
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• pp.11-17
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• 2001

Micronization of sensor is a trend of the silicon sensor development with regard to a piezoresistive silicon pressure sensor, the size of the pressure sensor diaphragm have become smaller year by year, and a microaccelerometer with a size less than $200{\sim}300{\mu}m$ has been realized, In this paper, we study some of the bonding processes of SCS(single crystal silicon) insulator wafer for the microaccelerometer. and their subsequent processes which might affect thermal loads. The finite element method(FEM) has been a standard numerical modeling technique extensively utilized in micro structural engineering discipline for design of SCS insulator wafers. Successful temperature distribution analysis and design of the SCS insulator wafers based on the tunneling current concept using microaccelerometer depend on the knowledge about normal mechanical properties of the SCS and $SiO_2$ layer and their control through manufacturing processes.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2015년도 제46회 하계학술대회
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• pp.1229-1230
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• 2015

Monitoring of mechanical properties of tissues as well as direction/quantities of forces is considered as an essential way for disease diagnosis and haptic feedback systems. There are extensively increasing interests for measuring normal/shear force and touch feelings, especially for surgery systems. Highly sensitive and flexible tactile sensor is needed in palpation for detecting cancer cyst as well as real time pressure monitoring in minimally invasive surgery (MIS). Importantly, MEMS technique with miniaturized fabrication technique is essential for the on-chip integration with biopsy and biomedical grasper. Here, we propose the flexible tactile sensor with high sensitivity based on piezoresistive effect. We analyzed the sensitivity according to the pressure and directions and showed the ability of discrimination of the different materials surfaces, illustrating the feasibility of the flexible tactile sensor for biomedical grasper by mimicking human skin.

• 전기전자학회논문지
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• 제1권1호
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• pp.1-10
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• 1997

It is well-known that rectangular bulk-Si sensors prepared by etch or epi etch-stop micromachining technology are already in practical use today, but the conventional bulk-Si sensor shows some drawbacks such as large chip size and limited applications as silicon sensor device is to be miniaturized. We consider a circular-shape SOI(Silicon-On-Insulator) micro-cavity technology to facilitate multiple sensors on very small chip, to make device easier to package than conventional sensor like pressure sensor and to provide very high over-pressure capability. This paper demonstrates the cross-functional results for stress analyses(targeting $5{\mu}m$ deflection and 100MPa stress as maximum at various applicable pressure ranges), for finding permissible diaphragm dimension by output sensitivity, and piezoresistive sensor theory from two-type SOI structures where the double SOI structure shows the most feasible deflection and small stress at various ambient pressures. Those results can be compared with the ones of circular-shape bulk-Si based sensor$^{[17]}. The SOI micro-cavity formed the sensors is promising to integrate with calibration, gain stage and controller unit plus high current/high voltage CMOS drivers onto monolithic chip.

• 센서학회지
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• 제31권3호
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• pp.139-144
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• 2022

Advanced tactile sensors are receiving significant attention in various industries such as extended reality, electronic skin, organic user interfaces, and robotics. The capabilities of advanced tactile sensors require a variety of functions, including position sensing, pressure sensing, and material recognition. Moreover, they should comsume less power and be bio-friendly with human contact. Recently, a tactile sensor based on the triboelectrification effect was developed. Triboelectric tactile sensors have the advantages of wide material availability, simple structure, and low manufacturing cost. Because they generate electricity by contact, they have low power consumption compared to conventional tactile sensors such as capacitive and piezoresistive. Furthermore, they have the ability to recognize the contact material as well as execute position and pressure sensing functions using the triboelectrification effect. The aim of this study is to introduce the progress of research on triboelectrification-based tactile sensors with various functions such as position sensing, pressure sensing and contact material recognition.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.888-891
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• 2003

This paper describes on the fabrication and characteristics of micro ceramic thin-film type pressure sensors based on Ta-N strain-gauges for high-temperature applications. The Ta-N thin-film strain-gauges are deposited onto thermally oxidized Si diaphragms by RF sputtering in an argon-nitrogen atmosphere($N_2$ gas ratio: 8 %, annealing condition: $900^{\circ}C$, 1 hr.), Patterned on a wheatstone bridge configuration, and use as pressure sensing elements with a high stability and a high gauge factor. The sensitivity is $1.097{\sim}1.21mV/V.kgf/cm^2$ in the temperature range of $25{\sim}200^{\circ}C$ and the maximum non-linearity is 0.43 %FS. The fabricated pressure sensor presents a lower TCR, non-linearity than existing Si piezoresistive pressure sensors. The fabricated micro ceramic thin-film type pressure sensor is expected to be usefully applied as pressure and load sensors that is operable under high-temperature environments.

• 센서학회지
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• 제7권3호
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• pp.171-178
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• 1998

SDB 웨이퍼를 이용하여 실리콘 압저항형 절대압센서를 제조하고 이를 가스누출 감지시스템에 응용하였다. 이 경우 센서는 $0{\sim}600\;mmH_{2}O$, $0{\sim}100^{\circ}C$의 압력, 온도범위에서 정상적으로 동작하여야 하고 다이아프램이 파괴되었을 때 가스가 소자 외부로 누출되어서는 안된다. 따라서 다이아프램 내의 공극을 유리(Pyrex7740)와 진공중($10^{-4}$ torr)에서 양극 접합을 행하였다. 제조된 센서는 압력에 대하여 우수한 선형특성을 보였고, 압력감도는 대기압이상 $0{\sim}600\;mmH_{2}O$의 압력범위에서 $4.06{\mu}V/VmmH_{2}O$ 이었다. 온도보상 일체화 조건을 조사하기 위해 Al 박막저항을 제조하여 온도보상을 행하였는데 오프셋의 온도 drift는 80 %이상, 감도의 온도의존성은 95 %이상 보강 효과를 얻었다. 또한 다이오드(PXIN4001)를 이용한 온도보상시 오프셋의 온도 drift는 98 %이상, 감도의 온도의존성은 90%이상 보상 효과를 나타내었다.

• 감성과학
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• 제24권2호
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• pp.65-74
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• 2021

최근 ICT 산업의 기술혁신이 일어남에 따라 생체신호을 인식하고 이에 대해 대응을 하기 위한 웨어러블 센싱 장치에 대한 수요가 증가하고 있다. 이에 따라 본 연구에서는 단순한 함침과정을 통해 3차원 스페이서(3D spacer)직물을 단일벽 탄소나노튜브(SWCNT)분산용액에 함침공정을 진행해 단일층(monolayer) 압전 저항형 압력 센서(piezoresistive pressure sensor)를 개발하였다. 3D 스페이서 원단에 전기전도성을 부여하기 위해 시료를 SWCNT 분산용액에 함침공정을 진행한 후 건조하는 과정을 거쳤다. 함침된 시료의 전기적 특성을 파악하기 위해 UTM (Universal Testing Machine)과 멀티미터를 이용해서 압력의 변화에 따른 저항의 변화를 측정하였다. 또한 센서의 전기적 특성의 변화를 관찰하기 위해 분산용액의 농도, 함침횟수, 시료의 두께를 다르게 해서 시료의 센서로서의 성능을 평가했다. 그 결과 wt0.1%의 SWCNT 분산용액에 함침공정을 2번 진행한 시료가 센서로서 가장 뛰어난 성능을 나타냄을 알 수 있었다. 두께별로는 7mm 두께의 센서가 가장 높은 GF를 보이고 13mm 두께의 센서가 작동범위가 가장 넓음을 확인했다. 본 연구를 통해 3D spacer 원단으로 제작한 스마트 텍스타일 센서는 공정과정이 단순하면서도 센서로서 성능이 뛰어나다는 장점을 확인할 수 있었다.