• Journal of the Microelectronics and Packaging Society
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• v.8 no.2
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• pp.37-42
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• 2001

The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• Journal of Korean society of Dental Hygiene
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• v.11 no.4
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• pp.595-602
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• 2011

Objectives : This study purpose were the effect of toothbrushing for decreasing halitosis for gingivitis and periodontitis patients. Methods : The university staffs were examined oral condition and analysised a change of oral health state score after using 3 types of toothbrushing. Results : The results were as followed : OHI-S shows that the decreasing effect takes place in the M. bass method and Tooth pick method, but shows no differences by each method. GI for Self test method shows decreasing effect after 2nd week during education while the M. bass method and Tooth pick method shows after 1st week during education. The M. bass method shows much greater effect of halitosis amongst 3 kind of method. PI for Self test method and Tooth pick method show decreasing effect. Decreasing effect during education shows until 2nd week by 3 kind of method, but it shows no differences after 3rd week. VSC(ppb) for M. bass method and Tooth pick method show decreasing effect. Decreasing effect during education shows after 3rd week by 3 kind of method, but it shows no differences until 2nd week. PHP for Self test method, M. bass method and Tooth pick method show decreasing effect after 2nd week during education. But, there is no differences of decreasing effect by among 3 kind of method. Conclusions : This study reports that it is necessary to carry outt further studies on the improvement of oral health management of adults based on the development of oral health education.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.5
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• pp.451-457
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• 2008

Flat Panel Display(FPD) is widely used a video display terminals to consumer products of LCD and PDP. The contamination and damage were affected by using the previous contact conveyor's method. In this paper, it analyzes the FPD deflection to develop the non-contact FPD transfer process using lift force. Each conveyor's equipment is called a horizontal conveyor, vertical conveyor and robot pick-up equipment. As result of an analysis of FPD panel's deflection, a robot pick-up equipment has performed according to under the present conditions like panel's weight and loaded glass to move FPD panel from one place to other places properly. Results of the analysis showed 0.474 mm, 0.424 mm and 1.237 mm. Those values are lower than a predicted optimum values : 2 mm for both horizontal and vertical conveyers; 5 mm for robot pick-up equipment. Therefore, those results verify each equipment have safety and reliability.

• Journal of Biosystems Engineering
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• v.38 no.2
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• pp.138-148
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• 2013

Purpose: Determining an appropriate path is a top priority in order for a robot to maneuver in a dynamically efficient way especially in a pick-and-place task. In a non-standardized work environment, current robot arm executes its motion based on the kinematic displacements of joint variables, though resulting motion is not dynamically optimal. In this research we suggest analyzing and applying motion patterns of the human arm as an alternative to perform near optimum motion trajectory for arbitrary pick-and-place tasks. Methods: Since the motion of a human arm is very complicated and diverse, it was simplified into two links: one from the shoulder to the elbow, and the other from the elbow to the hand. Motion patterns were then divided into horizontal and vertical components and further analyzed using kinematic and dynamic methods. The kinematic analysis was performed based on the D-H parameters and the dynamic analysis was carried out to calculate various parameters such as velocity, acceleration, torque, and energy using the Newton-Euler equation of motion and Lagrange's equation. In an attempt to assess the efficacy of the analyzed human motion pattern it was compared to the virtual motion pattern created by the joint interpolation method. Results: To demonstrate the efficacy of the human arm motion mechanical and dynamical analyses were performed, followed by the comparison with the virtual robot motion path that was created by the joint interpolation method. Consequently, the human arm was observed to be in motion while the elbow was bent. In return this contributed to the increase of the manipulability and decrease of gravity and torque being exerted on the elbow. In addition, the energy required for the motion decreased. Such phenomenon was more apparent under vertical motion than horizontal motion patterns, and in shorter paths than in longer ones. Thus, one can minimize the abrasion of joints by lowering the stress applied to the bones, muscles, and joints. From the perspectives of energy and durability, the robot arm will be able to utilize its motor most effectively by adopting the motion pattern of human arm. Conclusions: By applying the motion pattern of human arm to the robot arm motion, increase in efficiency and durability is expected, which will eventually produce robots capable of moving in an energy-efficient manner.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.8
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• pp.4815-4820
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• 2014

As semiconductor chips are on a small scale, large content and high integratation, it is essential to develop the device of pick and place at the system of the semiconductor test handler to ensure its high precision and durability. In this study, inspection equipment frame model of a semiconductor test handler picker was investigated by vibration analysis with the property of the natural frequency and harmonic response. As 3 kinds of analysis case models, the device of pick and place was located at the left side (Case 1), the center (Case 2) and the right side (Case 3) of the upper guideline. The range of natural frequencies until the 6th order on this frame model ranges from 80Hz to 500Hz. As the analysis of the harmonic response when the frame is resonant, Case 2 showed the maximum equivalent stress of 52.802 MPa more than Cases 1 or 3. Case 2 was the most intensive among the three cases. Using the analysis result of this study, the design of the frame model, which can be applied to the safe working environment of the system is believed to be possible.

• 제어로봇시스템학회:학술대회논문집
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• 1988.10a
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• pp.501-506
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• 1988

This paper describes an experimental system for automatic robot programming, The SNU-ARPS (Seoul National University Automatic Robot Programming System). The SNU-ARPS generates executable robot programs for pick and place operation and some simple mechanical assembly tasks by menudriven dialog. It is intended to enable the user to concentrate on the overall operation sequence instead of the knowledge regarding the details of robot languages. To convert task specifications into manipulator motions, the SNU-ARPS uses an internal representation of the world. This representation initially consists of geometric database from CAD system and is updated at each operation step to reflect the state changes of the world.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.8
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• pp.1043-1050
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• 2013

Parallel robots used in industry require high stiffness or high speed because of their structural characteristics. Nowadays, the importance of rapid transportation has increased in the distribution industry. In this light, an industrial parallel robot has been developed for high-speed transfer. The developed parallel robot can handle a maximum payload of 3 kg. For a payload of 0.1 kg, the trajectory cycle time is 0.3 s (come and go), and the maximum velocity is 4.5 m/s (pick amp, place work, adept cycle). In this motion, its maximum acceleration is very high and reaches approximately 13g. In this paper, the design, analysis, and performance test results of the developed parallel robot system are introduced.

• The Journal of the Korea institute of electronic communication sciences
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• v.17 no.3
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• pp.507-514
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• 2022

Mobile manipulators are getting lime light in the field of home automation due to their mobility and manipulation capabilities. In this paper, we developed a small size manipulator system that can be mounted on a mobile robot as a preliminary study to develop a mobile manipulator. The developed manipulator has four degree-of-freedom. At the end-effector of manipulator, there are a camera and a gripper to recognize and manipulate the object. One of four degree-of-freedom is linear motion in vertical direction for better interaction with human hands which are located higher than the mobile manipulator. The developed manipulator was designed to dispose the four actuators close to the base of the manipulator to reduce rotational inertia of the manipulator, which improves stability of manipulation and reduces the risk of rollover. The developed manipulator repeatedly performed a pick and place task and successfully manipulate the object within the workspace of manipulator.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.6
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• pp.561-566
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• 2015

In this paper, the operating stiffness of a parallel robot used to handle heavy packages is optimized. Because the studied model, called a "pick and place robot," is applied for packaging logistics, it is important for the robot to be lightweight so that it may respond rapidly and have high stiffness to allow sufficient operating precision. However, these two requirements of low weight and high stiffness are mutually exclusive. Thus, the dynamic characteristics of the robot are analyzed through multibody dynamics analysis, and topology optimization is conducted to achieve this exclusive performance. Lastly, the reliability of the topology optimization is verified by applying the optimized design to the parallel robot.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.27-34
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• 2001

The BGA Package has been the area array package of choice for several rears. Recently, the transition has been to finer pitch configuration called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch, requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and piece equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.