• Transactions on Electrical and Electronic Materials
• /
• 제17권4호
• /
• pp.196-200
• /
• 2016

We have developed new electrostatic discharge (ESD) protection devices with, bidirectional flip chip transient voltage suppression. The devices differ in their epitaxial (epi) layers, which were grown by reduced pressure chemical vapor deposition (RPCVD). Their ESD properties were characterized using current-voltage (I-V), capacitance-voltage (C-V) measurement, and ESD analysis, including IEC61000-4-2, surge, and transmission line pulse (TLP) methods. Two BD-FCTVS diodes consisting of either a thick (12 μm) or thin (6 μm), n-Si epi layer showed the same reverse voltage of 8 V, very small reverse current level, and symmetric I-V and C-V curves. The damage found near the corner of the metal pads indicates that the size and shape of the radius governs their failure modes. The BD-FCTVS device made with a thin n- epi layer showed better performance than that made with a thick one in terms of enhancement of the features of ESD robustness, reliability, and protection capability. Therefore, this works confirms that the optimization of device parameters in conjunction with the doping concentration and thickness of epi layers be used to achieve high performance ESD properties.

• 한국의학물리학회지:의학물리
• /
• 제3권2호
• /
• pp.67-81
• /
• 1992

방사선영상의 충실도를 저하시키는 것에는 여러가지 물리적현상이 있다. 가장 보편적인 저하타입은 해상력의 상실과 노이즈의 증가이다. 본 논문은 해상력과 해상력에 미치는 인자, 그리고 그 인자들의 특성을 다룬다. 영상을 흐리게 하는 일반적인 현상때문에 생기는 해상력 상실을, 일차원및 이차원 신호를 대상으로 그림과 수학으로 설명한다. 점분산함수, 선분산함수, 컨볼루션 적분함수및 모둘전달함수등을 논의한다. 또한 퓨리에 변환을 사용해서 주파수영역의 연산개념을 언급한다.

• Current Photovoltaic Research
• /
• 제2권2호
• /
• pp.63-68
• /
• 2014

In recent years, discoloration defects, called as snail trail, have been observed at many crystalline photovoltaic modules after a period of time ranging from several months to several years after initial installation. It has been reported that this phenomenon doesn't impact on the performance of photovoltaic modules, but it can be detected through simple visual inspection. The origin and detailed mechanism for the formation have not been identified. In this study, non-destructive analysis by Raman spectroscopy has been carried out to investigate the origin of this phenomenon. In parallel, destructive analysis by scanning electron microscopt and transmission electron microscopy was also performed in order to confirm the results from non-destructive method. Through the extensive analysis, it was found that the main cause for discoloration is the formations of $Ag_2CO_3$ and $AgC_2H_3O_2$. Detailed mechanism for the formation of these particles was indentified through systematic studies.

• 한국신뢰성학회지:신뢰성응용연구
• /
• 제16권1호
• /
• pp.41-47
• /
• 2016

Purpose: The purpose of this study was to evaluate electrical and structural degradation of flexible CIGS sollar cell exposed to high temperature and humid atmosphere. Method: Accelerated degradation was performed for various time under $85^{\circ}C/85%RH$ and then electrical and structural properties were analyzed by 4-point probe method, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD). Results: Sheet resistance of the top ITO layer increased with exposure time to the high temperature and humid atmosphere. Blunting of the protrusion morphology of ITO layer was observed for the degraded specimen, while no phase change was detected by XRD. Oxygen was detected at the edge area after 300 hours of exposure. Conclusion: Increase in electrical resistance of the degraded CIGS solar cell under high temperature and humid environment was attribute to the oxygen or water absorption.

• Nonlinear Functional Analysis and Applications
• /
• 제28권3호
• /
• pp.793-800
• /
• 2023

In this paper, we propose a generalization of Lindley distribution (GLD) via a special structure that is concern with progressively Type-II right censoring and time failure data. We study the modern properties that we have built by such combination, for example, survival function, hazard function, moments, and estimation by non-Bayesian methods. Application on some selected data related to Lindley distribution (LD) and (ED) have been employed to find out the best distribution that can fit data comparing with the GLD.

• 한국신뢰성학회지:신뢰성응용연구
• /
• 제17권1호
• /
• pp.78-82
• /
• 2017

Purpose: The purpose of this study is to evaluate failure characteristic and mechanism of four commercial water-repellent coatings for elevated temperature machinery applications. Method: Thermal degradation was performed for up to 64 thermal cycles. 1 cycle consists of 15 minute holding at 523K under 300rpm revolution and 15 minute-natural cooling. Contact angle was measured and microstructure of the coating layer was observed by using a scanning electron microscope. Results: Four kinds of commercial repellent coating showed hydrophobic or super-hydrophobic property implying that all coatings are suitable for room temperature application. Contact angle of three kinds of commercial coatings decreased rapidly after thermal exposure, while only one specimen having hydrophobic surface showed extremely slow degradation. Conclusion: Observed decrease in contact angle of the coatings were attributed to formation of macro-sized pores and disappearance of micro-protrusion during thermal exposure. Optimum water-repellent coating needs to be selected under the consideration of initial contact angle as sell as service temperature.

• 대한기계학회논문집A
• /
• 제38권12호
• /
• pp.1379-1385
• /
• 2014

제품의 수명시험 전에 소요될 시험시간을 대강이라도 예측할 수 있으면 비용을 측정하여 시험을 어떻게 진행할지 판단하는데 도움이 된다. 기계부품의 경우의 신뢰도예측은 시스템의 고장 혹은 열화 메커니즘이 복잡하고 보편적인 데이터베이스가 존재하지 않기 때문에 수행이 난해하다. 본 연구는 유압 액추에이터와 공압 액추에이터에 각각 설치되는 탄성 U 형 씰을 대상으로 수명예측을 NSWC에서 제안하는 고장물리를 고려한 고장률 모형과 현장 데이터베이스를 활용하여 수행하였다. 그 결과들을 검증하기 위해 예측된 수명과 시험된 수명데이터들을 비교하였다. 본 연구는 고장률 모형에 포함된 각종 계수 값들을 결정하는 과정과 씰의 수명에 영향을 주는 인자들의 개별 민감도를 분석하고 그 미비점을 고찰하였다.

• International Journal of Internet, Broadcasting and Communication
• /
• 제7권1호
• /
• pp.75-92
• /
• 2015

This paper presents the application of the bond valence method to estimate the valence charge distribution in several perovskite systems: $La_{{\tilde{1}}x}Pb_xMnO_3$ (x=0.1-0.5), $La_{0.6}Sr_{0.{\tilde{4}}x}Ti_xMnO_3$ (x=0.0-0.25) and $La_{{\tilde{1}}x}Sr_xCoO_3$ (x=0.1-0.5); the reviewing of their crystal structures is also incorporated. The results showed the failure of the elastic bonding mechanism in all studied systems and revealed the general deficit of the valence charge in their unit cells. This valence deficit was not associated with the structural defects and was not equally localized in all coordination spheres. As the content of substitution increased, the charge deficit declined systematically from balanced level, signifying the transfer of valence charge from the ${\tilde{B}}O_6$ to ${\tilde{A}}O_{12}$ spheres. This transfer depended on the valence deviation of spheres and the average reached near 2 electron per unit cell. The possible impact of the limitted accuracy of the available structural data on the bond valence results has also been considered.

• Wind and Structures
• /
• 제39권1호
• /
• pp.1-14
• /
• 2024

Widespread damages from extreme winds have attracted lots of attentions of the resilience assessment of power distribution systems. With many related environmental parameters as well as numerous power infrastructure components, such as poles and wires, the increased challenge of power asset management before, during and after extreme events have to be addressed to prevent possible cascading failures in the power distribution system. Many extreme winds from weather events, such as hurricanes, generate widespread damages in multiple areas such as the economy, social security, and infrastructure management. The livelihoods of residents in the impaired areas are devastated largely due to the paucity of vital utilities, such as electricity. To address the challenge of power grid asset management, power system clustering is needed to partition a complex power system into several stable clusters to prevent the cascading failure from happening. Traditionally, system clustering uses the Binary Decision Diagram (BDD) to derive the clustering result, which is time-consuming and inefficient. Meanwhile, the previous studies considering the weather hazards did not include any detailed weather-related meteorologic parameters which is not appropriate as the heterogeneity of the parameters could largely affect the system performance. Therefore, a fragility-based network hierarchical spectral clustering method is proposed. In the present paper, the fragility curve and surfaces for a power distribution subsystem are obtained first. The fragility of the subsystem under typical failure mechanisms is calculated as a function of wind speed and pole characteristic dimension (diameter or span length). Secondly, the proposed fragility-based hierarchical spectral clustering method (F-HSC) integrates the physics-based fragility analysis into Hierarchical Spectral Clustering (HSC) technique from graph theory to achieve the clustering result for the power distribution system under extreme weather events. From the results of vulnerability analysis, it could be seen that the system performance after clustering is better than before clustering. With the F-HSC method, the impact of the extreme weather events could be considered with topology to cluster different power distribution systems to prevent the system from experiencing power blackouts.

• 대한금속재료학회지
• /
• 제47권12호
• /
• pp.842-851
• /
• 2009

The long-term reliability of Sn-0.3wt%Ag-0.7wt%Cu solder joints was evaluated and compared with Sn-3.0wt%Ag-0.5wt%Cu under thermal shock conditions. Test vehicles were prepared to use Sn-0.3Ag-0.7Cu and Sn-3.0Ag-0.5Cu solder alloys. To compare the shear strength of the solder joints, 0603, 1005, 1608, 2012, 3216 and 4232 multi-layer ceramic chip capacitors were used. A reflow soldering process was utilized in the preparation of the test vehicles involving a FR-4 material-based printed circuit board (PCB). To compare the shear strength degradation following the thermal shock cycles, a thermal shock test was conducted up to 2,000 cycles at temperatures ranging from $-40^{\circ}C$ to $85^{\circ}C$, with a dwell time of 30 min at each temperature. The shear strength of the solder joints of the chip capacitors was measured at every 500 cycles in each case. The intermetallic compounds (IMCs) of the solder joint interfaces werealso analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). The results showed that the reliability of Sn-0.3Ag-0.7Cu solder joints was very close to that of Sn-3.0Ag-0.5Cu. Consequently, it was confirmed that Sn-0.3Ag-0.7Cu solder alloy with a low silver content can be replaced with Sn-3.0Ag-0.5Cu.