• Korean Journal of Materials Research
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• v.20 no.4
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• pp.223-227
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• 2010

Recently, one-dimensional semiconducting nanomaterials have attracted considerable interest for their potential as building blocks for fabricating various nanodevices. Among these semiconducting nanomaterials,, $SnO_2$ nanostructures including nanowires, nanorods, nanobelts, and nanotubes were successfully synthesized and their electrochemical properties were evaluated. Although $SnO_2$ nanowires and nanobelts exhibit fascinating gas sensing characteristics, there are still significant difficulties in using them for device applications. The crucial problem is the alignment of the nanowires. Each nanowire should be attached on each die using arduous e-beam or photolithography, which is quite an undesirable process in terms of mass production in the current semiconductor industry. In this study, a simple process for making sensitive $SnO_2$ nanowire-based gas sensors by using a standard semiconducting fabrication process was studied. The nanowires were aligned in-situ during nanowire synthesis by thermal CVD process and a nanowire network structure between the electrodes was obtained. The $SnO_2$ nanowire network was floated upon the Si substrate by separating an Au catalyst between the electrodes. As the electric current is transported along the networks of the nanowires, not along the surface layer on the substrate, the gas sensitivities could be maximized in this networked and floated structure. By varying the nanowire density and the distance between the electrodes, several types of nanowire network were fabricated. The $NO_2$ gas sensitivity was 30~200 when the $NO_2$ concentration was 5~20ppm. The response time was ca. 30~110 sec.

• Transactions of Materials Processing
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• v.15 no.1 s.82
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• pp.3-8
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• 2006

The demand fer small and high-capacity optical data storage devices has rapidly increased. The areal density of optical disk is increased by using higher numerical aperture objective lens and shorter wavelength source. A wafer-scale stacked micro objective lens with a numerical aperture of 0.85 and a focal length of 0.467mm for the 405nm blue- violet laser was designed and fabricated. A diffractive optical element (DOE) was used to compensate the spherical aberration of the objective lens. Among the various fabrication methods for micro DOE, the UV-replication process is more suitable fur mass-production. In this study, an 8-stepped DOE pattern as a master was fabricated by photolithography and reactive ion etching process. A flexible mold was fabricated for improving the releasing properties and shape accuracy in UV-replication process. In the replication process, the effects of exposing time and applied pressure on the replication quality were analyzed. Finally, the surface profiles of master, mold and molded pattern were measured by optical scanning profiler. The geometrical deviation between the master and the molded DOE was less than $0.1{\mu}m$. The diffraction efficiency of the molded DOE was measured by DOE efficiency measurement system which consists of laser source, sample holder, aperture and optical power meter, and the measured value was $84.5\%$.

• Journal of Sensor Science and Technology
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• v.29 no.4
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• pp.255-260
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• 2020

In this study, we developed a method of improving the surface-enhanced Raman spectroscopy (SERS) response characteristics by depositing a nanoporous Ag metal thin film through cluster source sputtering after forming a pyramidal texture structure on the Si substrate surface. A reactive ion etching (RIE) system with a metal mesh inside the system was used to form a pyramidal texture structure on the Si surface without following a complicated photolithography process, unlike in case of the conventional RIE system. The size of the texture structure increased with the RIE process time. However, after a process time of 60 min, the size of the structure did not increase but tended to saturate. When the RF power increased from 200 to 250 W, the size of the pyramidal texture structure increased from 0.45 to 0.8 ㎛. The SERS response characteristics were measured by depositing approximately 1.5 ㎛ of nanoporous Ag metal thin film through cluster sputtering on the formed texture structure by varying the RIE process conditions. The Raman signal strength of the nanoporous Ag metal thin film deposited on the Si substrate with the texture structure was higher than that deposited on the general silicon substrate by up to 19%. The Raman response characteristics were influenced by the pyramid size and the number of pyramids per unit area but appeared to be influenced more by the number of pyramids per unit area. Therefore, further studies are required in this regard.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.35-40
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• 2005

The demand for small and high-capacity optical data storage devices has rapidly increased. The areal density of optical disk is increased using higher numerical aperture objective lens and shorter wavelength source. A wafer-scale stacked micro objective lens with a numerical aperture of 0.85 and a focal length of 0.467mm for the 405nm blue- violet laser was designed and fabricated. A diffractive optical element (DOE) was used to compensate the spherical aberration of the objective lens. Among the various fabrication methods for micro DOE, the UV-replication process is more suitable for mass-production. In this study, an 8-stepped DOE pattern as a master was fabricated by photolithography and reactive ion etching process. A flexible mold was fabricated for improving the releasing properties and shape accuracy in UV-molding process. In the replication process, the effects of exposing time and applied pressure on the replication quality were analyzed. Finally, the shapes of master, mold and molded pattern were measured by optical scanning profiler. The deviation between the master and the molded DOE was less than 0.1um. The efficiency of the molded DOE was measured by DOE efficiency measurement system which consists of laser source, sample holder, aperture and optical power meter, and the measured value was $84.5\%$.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.124-130
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• 2023

Recently, fan out wafer level packaging, which enables high integration, miniaturization, and low cost, is being rapidly applied in the semiconductor industry. In particular, FOWLP is attracting attention in the mobile and Internet of Things fields, and is recognized as a core technology that will lead to technological advancements such as 5G, self-driving cars, and artificial intelligence in the future. However, as chip density and package size within the package increase, FOWLP warpage is emerging as a major problem. These problems have a direct impact on the reliability and electrical performance of semiconductor products, and in particular, cause defects such as vacuum leakage in the manufacturing process or lack of focus in the photolithography process, so technical demands for solving them are increasing. In this paper, warpage simulation according to the thickness of FOWLP material was performed using finite element analysis. The thickness range was based on the history of similar packages, and as a factor causing warpage, the curing temperature of the materials undergoing the curing process was applied and the difference in deformation due to the difference in thermal expansion coefficient between materials was used. At this time, the stacking order was reflected to reproduce warpage behavior similar to reality. After performing finite element analysis, the influence of each variable on causing warpage was defined, and based on this, it was confirmed that warpage was controlled as intended through design modifications.

• Korean Journal of Materials Research
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• v.20 no.7
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• pp.370-373
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• 2010

In fabricating plasma display panels, the photolithographic process is used to form patterns of barrier ribs with high accuracy and high aspect ratio. It is important in the photolithographic process to control the refractive index of the photosensitive paste. The composition of this paste for photolithography is based on the $B_2O_3-SiO_2-Al_2O_3$ glass system, including additives of alkali oxides and rare earth oxides. In this work, we investigated the density, structure and refractive index of glasses based on the $B_2O_3-SiO_2-Al_2O_3$ system with the addition of $Li_2O$, $K_2O$, $Na_2O$, CaO, SrO, and MgO. The refractive index of the glasses containing K2O, Na2O and CaO was similar to that of the [BO3] fraction while that of the SrO, MgO and Li2O containing glasses were not correlated with the coordination fraction. The coordination number of the boron atoms was measured by MAS NMR. The refractive index increased with a decrease of molar volume due to the increase in the number of non-bridging oxygen atoms and the polarizability. The lowest refractive index (1.485) in this study was that of the $B_2O_3-SiO_2-Al_2O_3-K_2O$ glass system due to the larger ionic radius of $K^+$. Based on our results, it has been determined that the refractive index of the $B_2O_3-SiO_2-Al_2O_3$ system should be controlled by the addition of alkali oxides and alkali earth oxides for proper formation of the photosensitive paste.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.321-321
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• 2008

To obtaingood resolution in PDP, one of the important factors is to achieve the accuracy of barrier ribs. The photolithographic process can be used to form patterns of barrier rib with high accuracy and a high aspect ratio. The composition for photolithography is based on the $B_2O_3-SiO_2-Al_2O_3$ glass system including additives such as alkali oxides and alkali earth oxides. The refractive index and thermal properties in glass system are changed by amount of alkali oxides and alkali earth oxides. Therefore, it is important that additives are controlled to have proper refractive index and thermal properties. The additives are contributed to non-bridging oxygen within the glass network, causing a change of density. In addition to a change of the structural cross-link density, the refractive index, dielectric and thermal properties glass are correlated with ionic radius and polarizability of cations. In this study, we investigated the refractive index and the thermal properties such as glass transition temperature, glass softening temperature and coefficient of thermal expansion by changing composition in the $B_2O_3-SiO_2-Al_2O_3$ glass system.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.25-29
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• 2014

In this study, an optical PCB was proposed which can overcome the limitations of the conventional PCB, and a new structure with pluggable lens was considered for a high-efficient passive alignment. The structure was a lens-added optical waveguide for the improvement of misalignment between the lens and the waveguide in the alignment. Also, as it had a barrier-type structure to prevent the surface damage of the lens by desorption, the high-efficient passive alignment can be realized. The structure was designed by optimizing the simulation and the fabrication process of the pluggable lens structure was conducted using the repetitive photolithography and the thermal reflow. The optical waveguide with the lens-integrated pluggable interconnection was fabricated by the imprint process using the polydimethylsiloxane(PDMS) replica mold. Therefore, we confirmed the possibility of pluggable lens-added optical waveguide structure fabrication for high-efficient passive alignment.

• Journal of the Korean Magnetics Society
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• v.6 no.6
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• pp.367-374
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• 1996

The developmement of electronic machine industries requires miniature of size as well as increasement of driving frequency in electronic parts, recently. To realize micro-struture of magnetic devices, in this study, we fabricated thin film inductors by using thin film manufacturing techniques such as photolithography and wet etching process, and these devices are measured at high frequency range of 1 MHz~1 GHz. The results are as follows. The accurate measuring technique by using network analyzer system having microstrip line was established. The manufactured inductors are fabricated with several ten micrometers by means of wet etching process known as easier and more economic than dry etching process. VVhen the device size of two types (spiral, meander) is the same, inductance value L and quality factor Q of spiral type devices are larger than those of meander type, but driving frequency of spiral type is lower than that of meander type due to increasement of inductance L. It is necessary to decrease resistance value R by increasing cross section of the conductor film coil. Thus high frequency measuring method would be a very useful for another measuring fields of the range over several hundreds MHz.

• Journal of the Semiconductor & Display Technology
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• v.14 no.3
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• pp.1-5
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• 2015

In photolithography process, resolution enhancement techniques such as optical proximity correction (OPC) and phase shift mask (PSM) have been applied to improve resolution. Especially, sub-resolution assist feature (SRAF) is one of the most important OPC to enhance image quality including depth of focus (DOF). However, imaging performance of the mask could be varied with the diffraction order amplitude changed by inserting SRAF. Therefore, in this study, we investigated the imaging properties and process margin of attenuated PSM with SRAF. Reflectivities of attenuated PSMs at 13.5 nm were 3, 6, 9% and simulation was performed by $PROLITH^{TM}$. As a result, aerial image properties and DOF as well as diffraction efficiency were improved by increasing the reflectivity of attenuated PSM. Additionally, printed critical dimension variations depending on SRAF width and space error were also reduced for attenuated PSM with high reflectivity. However, SRAF could be printed when reflectivity of attenuated PSM is high enough. In conclusion, optimization of reflectivity of attenuated PSM and SRAF to prevent side-lobe from being printed is needed to be considered.