• Particle and aerosol research
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• v.6 no.3
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• pp.131-138
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• 2010

Flexible electronics are the electronics on flexible substrates such as a plastic, fabric or paper, so that they can be folded or attached on any curved surfaces. They are currently recognized as one of the most innovating future technologies especially in the area of portable electronics. The conventional vacuum deposition and photolithographic patterning methods are well developed for inorganic microelectronics. However, flexible polymer substrates are generally chemically incompatible with resists, etchants and developers and high temperature processes used in conventional integrated circuit processing. Additionally, conventional processes are time consuming, very expensive and not environmentally friendly. Therefore, there are strong needs for new materials and a novel processing scheme to realize flexible electronics. This paper introduces current research trends for flexible electronics based on (a) nanoparticles, and (b) novel processing schemes: nanomaterial based direct patterning methods to remove any conventional vacuum deposition and photolithography processes. Among the several unique nanomaterial characteristics, dramatic melting temperature depression (Tm, 3nm particle~$150^{\circ}C$) and strong light absorption can be exploited to reduce the processing temperature and to enhance the resolution. This opens a possibility of developing a cost effective, low temperature, high resolution and environmentally friendly approach in the high performance flexible electronics fabrication area.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.216-216
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• 2009

This paper describes a novel processing technique for the fabrication of polymer-derived SiCN (silicone carbonitride) microstructures for extreme microelectromechanical system (MEMS) applications. A polydimethylsiloxane (PDMS) mold was formed on an SU-8 pattern using a standard UV photolithographic process. Next, the liquid precursor, polysilazane, was injected into the PDMS mold to fabricate free-standing SiCN microstructures. Finally, the solid polymer SiCN microstructure was cross-linked using hot isostatic pressure at $400^{\circ}C$ and 205 bar. The optimal pyrolysis and annealing conditions to form a ceramic microstructure capable of withstanding temperatures over $1400^{\circ}C$ were determined. Using the optimal process conditions, the fabricated SiCN ceramic microstructure possessed excellent characteristics includingshear strength (15.2 N), insulation resistance ($2.163{\times}10^{14}\;{\Omega}$, and BDV (1.2 kV, minimum). Since the fabricated ceramic SiCN microstructure has improved electrical and physical characteristics compared to bulk Si wafers, it may be applied to harsh environments and high-power MEMS applications such as heat exchangers and combustion chambers.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.1
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• pp.87-93
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• 2004

Recently, with the development of bio-technology the interests in the micro-fluidic devices for analysis in the fields of biology and medical science have been steadily increasing. Although polymer is considered as one of the best materials for micro-fluidic devices. glass or silicon molds fabricated by photo-lithographic technique have been commonly used. However, it is generally perceived that the conventional photolithographic technique has the limitation for fabricating micro-channels for micro-fluidic devices. In this work, the possibility of fabrication of micro-fluidic channels on PDMS by using the mechano-chemical process and the effect of surface states on the fluid flow were investigated. Experimental results revealed that PDMS mold fabricated by the mechano-chemical process could be used effectively to replicate micro-fluidic channels with high reproducibility and dimensional accuracy. It was also found that the fluid flow generation and flow speed were largely affected by the hydrophilicity and the surface roughness of the micro-channel surfaces.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.80-80
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• 2006

As the size scale of features continue to shrink in devices, the use of self-assembly, i.e. a "bottom up" approach, for device fabrication becomes increasingly important. Yet, simple self-assembly alone will not be sufficient to meet the increasing demands place on the registry of structures, particularly nanostructured materials. Several criteria are key in the rapid advancement and technology transfer for self-assembling systems. Specifically, the assembly processes must be compatible with current $^{\circ}{\infty}top\;down^{\circ}{\pm}$ approaches, where standard photolithographic processes are used for device fabrication. Secondly, simple routes must be available to induce long-range order, in either two or three dimensions, in a rapid, robust and reliable manner. Thirdly, the in-plane orientation and, therefore, ordering of the structures, must be susceptible to a biasing by an external, macroscopic means in at least one, if not two directions, so that individual elements can be accessed in a reliable manner. Block copolymers, specifically block copolymers having a cylindrical microdomain morphology, are one such material that satisfy many, if not all, of the criteria that will be necessary for device fabrication. Here, we discuss several routes by which these versatile materials can be used to produce arrays of nanoscopic elements that have high aspect ratios (ideal for templating and scaffolding), that exhibit long-range order, that give access to multiple length scale structuring, and that are amenable to being biased by macroscopic features placed on a surface.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1625-1628
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• 2006

Two different negative-type photosensitive polyimides were synthesized and characterized for an application as an interdielectric layer in TFTLCD array. In the case of photocurable polyimides, the photosensitive moiety, 2-HHSP, was synthesized through 3 step reaction, and then was incorporated into side chains of polyimide precursor by post reaction. Optimum compositions of negative-type photocurable polyimde were also formulated. For photopolymerizable polyimides, two novel UV monomers containing imide linkages were prepared. An aqueous alkaline developable polymer matrix was synthesized by free radical copolymerization. A negative photoresist formulation was developed utilizing synthesized UV monomers containing imide linkage, photoinitiator, UV oligomer, and alkali developable polymer matrix. It was found that viaholes with good resolution, high transmittance and thermal resistance could be obtained by photolithographic process utilizing the negative-type photoresist formulations.

• Korean Journal of Materials Research
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• v.8 no.9
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• pp.871-875
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• 1998

High aspect ratio microstructures were fabricated by photolithography. The material for the microstructure was photosensitive glass which has good mechanical and electrical insulation properties. The photosensitive glass was exposed to ultraviolet light at 312nm through a chromium mask in which the structures are drawn. After heat treatment process over $500^{\circ}C$, the photosensitive glass was etched in a 10% hydrofluoric acid solution with ultrasonic conditions. Final dimension of the micro-framework was greatly dependent on the thickness of photosensitive glass, mask pattern, ultraviolet light exposure and etching conditions. The maximum aspect ratio of the micro-framework obtained from this work was over 30.

• Proceedings of the KOSOMBE Conference
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• v.1997 no.11
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• pp.333-336
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• 1997

The adhesion of activated and normal platelets to fibrinogen requires the receptor binding site of GPIIb/IIIa. These recognition sites exists in the A ${\alpha}$ chain(RGDS at 572-575 and RGDF at 95-98) and the carboxy-terminal of ${\gamma}$ chain (HHLGGAKQAGDV at 400-411) of fibrinogen. In this study, we developed RGDF-immobilized surface to detect the unctional state of platelet. RGDF-immobilized surface was prepared on the glass using photolithographic technology. Platelet adhesion to RGDF-immobilized surface was observed by staining platelets with mepacrine using a fluorescence microscope using mepacrine. Using the RGDF peptide of fragment E, we observed that the platelets pretreated with PGE1 interacted incompletely with RGDF-immobilized surface, whereas ADP activated platelets interacted with the surface extensively. These results show that the distinct selectivity of RGDF-immobilized micro-patterned surface can be used to detect the unctional state of platelets.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.40-43
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• 2004

Stamps for microcontact processing are fabricated by casting elastomer such as PDMS on a master with a negative of the desired pattern. After curing, the PDMS stamp is peeled away from the master and exposed to a solution of ink and then dried. Transfer of the ink from the PDMS stamp to the substrate occurs during a brief contact between stamp and substrate. Generally, negative-tone masters, which are used for making positive-tone PDMS stamps, are fabricated by using photolithographic technique. The shortcomings of photolithography are a relative high-cost process and require extensive processing time and heavy capital investment to build and maintain the fabrication facilities. The goal of this study is to fabricate a negative-tone master by using Nano-indenter based patterning technique. Various sizes of V-grooves and U-groove were fabricated by using the combination of nanoscratch and HF isotropic etching technique. An achieved negative-tone structure was used as a master in the PDMS replica molding process to fabricate a positive-tone PDMS stamp.

• Journal of Sensor Science and Technology
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• v.15 no.1
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• pp.53-57
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• 2006

This paper describes a novel processing technique for fabrication of polymer-derived SiCN (silicone carbonitride) microstructures for super-temperature MEMS applications. PDMS (polydimethylsiloxane) mold is fabricated on SU-8 photoresist using standard UV photolithographic process. Liquid precursor is injected into the PDMS mold. Finally, solid polymer structure is cross-linked using HIP (hot isostatic pressure) at $400^{\circ}C$, 205 bar. Optimum pyrolysis and annealing conditions are determined to form a ceramic microstructure capable of withstanding over $1400^{\circ}C$. The fabricated SiCN ceramic microstructure has excellent characteristics, such as shear strength (15.2 N), insulation resistance ($2.163{\times}10^{14}{\Omega}$) and BDV (min. 1.2 kV) under optimum process condition. These fabricated SiCN ceramic microstructures have greater electric and physical characteristics than bulk Si wafer. The fabricated SiCN microstructures would be applied for supertemperature MEMS applications such as heat exchanger and combustion chamber.

• Journal of the Korean Institute of Telematics and Electronics
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• v.21 no.5
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• pp.17-26
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• 1984

This paper reports the design methods and fabrication processes developed for a TV-lF SAW filter. The windowing method, the frequency sampling method, and the time sampling method were studied and compared to obtain a satisfactory initial impulse response. To obtain high attenuation near the trap frequency, diffraction effects were compensated. The 4fo sampling technique was used for avoiding multiple reflections at finger edges and obtaining an asymmetrical frequency response, and effective photolithographic techniques were used for electrode fingers with 11.2$\mu$ width. The developed filter is of sufficiently small size to be cost-effective and satisfies the industry specifications required for mass production.