• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.7-13
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• 2007

In the optical module for optical communications, the flip chip bonding is used fer the precise alignment of the optical fiber and optical device. In flip chip bonding, the optical device is aligned and welded while observing the alignment mark of substrate and chip by using flip chip bonder in order to bond the optical device at the exact position. In this research, optical passive alignment method of photodiode(PD) flip chip bonding is suggested for low cost optical subassembly. By using the visible He-Ne laser (633nm wavelength), photodiode is easily aligned with emitting spot on the optical fiber with the help of stereoscopic alignment system. We compensated wavelength dependent deviation about 4m to find out real alignment position of 1550nm input laser by ray tracing. The maximum optical coupling efficiency between the optical fiber and photodiode was about 23.3%.

• ETRI Journal
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• v.28 no.1
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• pp.103-106
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• 2006

We have fabricated a planar lightwave circuit (PLC) hybrid-integrated optical sub-assembly of a triplexer using a thin film filter (TFF)-attached wavelength division multiplexer (WDM) and photodiode (PD) carriers. Two types of TFFs were attached to a diced side of a silica-terraced PLC platform, and the PD carriers with a $45^{\circ}$ mirror on which pin-PDs were bonded were assembled with the platform. A clear transmitter eye-pattern and minimum receiver sensitivity of -24.5 dBm were obtained under 1.25 Gb/s operation for digital applications, and a second-order inter-modulation distortion (IMD2) of -70 dBc was achieved for an analog receiver.

• The Journal of the Korea institute of electronic communication sciences
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• v.11 no.12
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• pp.1219-1224
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• 2016

The current wireless power charge technologies are based on induction coupling, magnetic resonant coupling, electromagnetic wave, etc. However, the current wireless power charge technologies has several disadvantages including short transfer range, electromagnetic interference, etc. In this paper, we investigate and demonstrate a laser wireless power charge technology. A laser source is used in the transmitter to convert from electric power to optical power and a solar cell or a photodiode is used in the receiver to convert from optical power to electric power. The laser wireless power charge technology may be the most efficient wireless power charge technology in the long distance over than 10 meters. Our experimental results show a transfer efficiency of 2.15% at the 70-m long distance with a 100 mW laser transmitter and a photodiode receiver.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.28 no.1
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• pp.10-18
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• 2017

In this paper, we designed and implemented a visible light identification(VLID) system consisting of a VLID reader and a tag which backscatters incident lights from the reader. A VLID tag sends its ID to the reader by switching an LCD shutter which is located on its surface. The VLID reader consists of six LEDs and a photodiode(PD). The LEDs emit visible light and a PD located in a center position of LEDs receives backscattered light from the VLID tag. A microcontroller and a commercial liquid crystal display(LCD) shutter for 3D-TV glasses are used to implement a VLID tag. Experiments were conducted to confirm VLID system performance. We successfully demonstrated experiments to send NRZ-OOK signal of 100 bps over a distance of 35 cm at daytime. Also, we suggested the theoretical maximum transmission rate and the various methods to enhance the separation distance between a VLID reader and a tag.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.38C no.8
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• pp.706-712
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• 2013

In this paper, channel modeling of VLC(Visible Light Communication) was investigated under indirect lightning circumstance which was the way that all phontons started from LED(Light Emitting Diode) were reached on the floor with NLOS paths. I supposed width(6m), depth(4m), height(2.2m) cube room circumstance for VLC communication channel and supposed that 4 LEDs were located at 2m height, which emitted photons at the direction of wall and ceiling. Channel characteristics, which were power attenuation and delayed receiving of light signal, were abstracted from receivers(PDs) which were located at 0.5m above from floor. The availability of channel was verified via BPSK based communication simulation.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.11 no.4
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• pp.203-207
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• 2011

LED is in the spotlight as next generation's lighting due to the fact that it has good efficiency on converting electricity to light and has long life time. Recently it expands the scope up to taillight of car, signal lamp and indoor light. Additionally it can send data information simultaneously with lighting, which is called lighting-communication convergence. In this paper, the channel characteristics of LED wireless communication is studied in the condition that indoor is latticed with 1mm span and photons started from LED are firstly arrived at each lattice after that these move as straight line before meeting photodiode(PD).

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.2
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• pp.212-216
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• 1999

SiC(3C) photodiodes (PDs) were fabricated on p-type Si(111) substrates using chemical vapor deposition (CVD) technique by pyrolyzing tetramethylsilane (TMS) with $H_{2}$ carrier gas. Electrical properties of SiC(3C) were investigated by Hall measurement and current-voltage (I-V) characteristics. SiC(3C) layers exhibited n-type conductivity. Ohmic contact was formed by thermal evaporation Al metal through a shadow-mask. The optical gain $(G_{op})$ of the SiC(3C)/Si PD was measured as a function of the incident wavelength. For the analysis of the photovoltaic detection of the Sic(3C) n/p PD, the spectral response (SR) has calculated by using the electrical parameters of the SiC(3C) layer and the geometric structure of the PD. The peak response calculated for properly chosen parameters was about 0.75 near 550 nm. We expect a good photoresponse in the SiC(3C) heterostructure for the wavelength range of 400~600 nm. The SiC(3C) photodiode can detect blue and near ultraviolet (UV) radiation.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.2 s.95
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• pp.74-81
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• 1999

The integrated chip of optical micro-encoder was fabricated and the feasibility as displacement measurement device was confirmed. The geometry of micro-encoder was designed to utilize the optical interference effect on the second order of diffracted beams. The hybrid-type micro-encoder consisted with light emitting diode, photodiode, polyimide wave-guide and micro-lens provides stable micro-encoding results for high speed displacements. The measurement shows the resolution of displacement of 1.00 +/- 0.02 ${\mu}m$ for the grating with scale pitch of 2.0${\mu}m$.

• Journal of Sensor Science and Technology
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• v.9 no.6
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• pp.448-454
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• 2000

This paper describes the implementation of a multi-subject, multi-channel optical telemetry system for the short range measurement of electrocardiograms (EKGs) a system which receives command signals and transmits physiological signals to the external system using LED (Light Emitting Diode) and PD (Photodiode). This system decreases the dependency of power supply voltage to the CMOS IC chips and a new enforced synchronization technique using infrared bi-directional communication has also been proposed. The telemetry IC with the size of $5.1{\times}5.1mm^2$ has the following functions: receiving of command signal, initialization of internal state of all functional blocks, decoding of subject selection signal, time division multiplexing of 4-channel modulated physiological signals, transmission of modulated signals to external system, and auto power down control.

• Proceedings of the KIEE Conference
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• 1996.11a
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• pp.439-441
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• 1996

A simple coupling method between APD(avalanche photodiode) arrays and SMF(single mode fiber) arrays on a Silicon carrier composed of V-grooves is proposed and carried out. Jacketed fibers embedded in V-grooves are used as alignment marks instead of patterned pedestals or solder bumps and a optical receiver module are packaged.