• Transactions of the Korean Society of Mechanical Engineers B
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• v.39 no.5
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• pp.449-453
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• 2015

Recently, surfaces with micro and nano structures are the focus of various research and engineering fields to enhance wetting characteristics of the surfaces. Hydrophilic surfaces with hierarchical structures are generally characterized by the interfacial behavior of water droplets. In this study, the interfacial behavior of water droplets is experimentally investigated considering the scale of structures. Using the dry etching and conventional lithography method, quantitative hierarchical structured surfaces are developed. The behavior of the liquid-vapor interface on the test sections is visualized using an automatic goniometer and a high-speed camera. On the basis of the visualized data, the interfacial behavior of water droplets is intensively investigated according to surface geometrical characteristics.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.9
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• pp.2197-2202
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• 2014

In this paper, we report on an investigation of highly sensitive sensing performance of a hydrogen sensor composed of palladium (Pd) nanowires. The Pd nanowires have been grown by electrodeposition into nanochannels and liberated from the anodic aluminum oxide (AAO) template by dissolving in an aqueous solution of NaOH. A combination of photo-lithography, electron beam lithography and a lift-off process has been utilized to fabricate the sensor using the Pd nanowire. The hydrogen concentrations for 2% and 0.1% were obtained from the sensitivities (${\Delta}R/R$) for 1.92% and 0.18%, respectively. The resistance of the Pd nanowires depends on absorption and desorption of hydrogen. Therefore, we expect that the Pd nanowires can be applicable for detecting highly sensitive hydrogen gas at room temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.11-11
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• 2007

1차원 구조체인 반도체 나노선은 앙자제한효과 (quantum confinement effect) 등을 이용하여 고밀도/고효율의 소자 개발이 기대되고 있다. GaN는 상온에서 3.4 eV의 밴드갭 에너지를 갖는 III-V 족 반도체 재료로써 박막의 경우 광전자 소자로 폭넓게 응용되고 있다. 최근 GaN 나노선의 합성에 성공하면서 발광소자, 고효율의 태양전지, HEMT 등으로의 응용을 위한 많은 연구가 활발히 이루어지고 있다. 하지만, 아직까지 GaN 나노선의 전기적 특성을 제어하는 기술은 확립되지 않고 있다. 본 연구에서는 Vapor solid (VS)법을 이용하여 GaN 나노선을 합성하였으며, GaN 분말과 함께 $Mg_2N_3$ 분말을 첨가하여 (Ga,Mg)N 나노선을 성공적으로 합성하였다. 합성시에 GaN와 Mg 소스간의 거리 변화를 통해 Mg 도핑농도를 제어하고자 하였다. 이 같은 방법으로 합 된 (Ga,Mg)N 나노선의 Mg 도핑농도에 따른 결정학적 특성을 알아보고, (Ga,Mg)N 나노선을 이용하여 소자를 제작한 후 그 전기적 특성을 살펴보고자 한다. X-ray diffraction (XRD)과 high-resolution transmission electron microscopy (HRTEM), EDX를 이용하여 합성된 나노선의 결정학적 특성과 Mg의 도핑 농도를 확인하였다. Photo lithography와 e-beam lithography법을 이용하여 (Ga,Mg)N 나노선 field-effect transistor (FET)를 제작하고, channel current-drain voltage ($I_{ds}-V_{ds}$) 와 channel current-gate voltage ($I_{ds}-V_g$) 측정을 통해 (Ga,Mg)N 나노선이 도핑 농도에 따라 n형에서 p형으로 전기적 특성이 변화함을 확인하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.475-475
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• 2010

We have generated Ar plasma in dense plasma focus device with coaxial electrodes for extreme ultraviolet (EUV) lithography and investigated an emitted visible light for electro-optical plasma diagnostics. We have applied an input voltage 4.5 kV to the capacitor bank of 1.53 uF and the diode chamber has been filled with Ar gas of pressure 8 mTorr. The inner surface of the cylindrical cathode has been attatched by an acetal insulator. Also, the anode made of tin metal. If we assumed that the focused plasma regions satisfy the local thermodynamic equilibrium (LTE) conditions, the electron temperature and density of the coaxial plasma focus could be obtained by Stark broadening of optical emission spectroscopy (OES). The Lorentzian profile for emission lines of Ar I of 426.629 nm and Ar II of 487.99 nm were measured with a visible monochromator. And the electron density has been estimated by FWHM (Full Width Half Maximum) of its profile. To find the exact value of FWHM, we observed the instrument line broadening of the monochromator with a Hg-Ar reference lamp. The electron temperature has been calculated using the two relative electron density ratios of the Stark profiles. In case of electron density, it has been observed by the Stark broadening method. This experiment result shows the temporal behavior of the electron temperature and density characteristics for the focused plasma. The EUV emission signal whose wavelength is about 6 ~ 16 nm has been detected by using a photo-detector (AXUV-100 Zr/C, IRD). The result compared the electron temperature and density with the temporal EUV signal. The electron density and temperature were observed to be $10^{16}\;cm^{-3}$ and 20 ~ 30 eV, respectively.

• Journal of the Korean Magnetics Society
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• v.25 no.5
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• pp.149-155
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• 2015

The ECR (Electron Cyclotron Resonance) Ar ion milling was manufactured to fabricate the device of thin film. The ECR ion milling system applied to the device etching operated by a power of 600W, a frequency of 2.45 GHz, and a wavelength of 12.24 cm and transferred by a designed waveguide. In order to match one resonant frequency, a magnetic field of 908 G was applied to a cavity inside of ECR. The Ar gas intruded into a cavity and created the discharged ion beam. The surface of target material was etched by the ion beam having an acceleration voltage of 1000 V. The formed devices with a width of $1{\mu}m{\sim}9{\mu}m$ on the GMR-SV (Giant magnetoresistance-spin valve) multilayer after three major processes such as photo lithography, ion milling, and electrode fabrication were observed by the optical microscope.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.6
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• pp.1099-1103
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• 2007

TFT's have been intensively researched for possible electronic and display applications. Through tremendous engineering and scientific efforts, a-Si:H TFT fabrication process was greatly improved. In this paper, the reason on defects occurring at a-Si:H TFT fabrication process is analyzed and solved, so a-Si:H TFT's yield is increased and reliability is improved. The a-Si:H TFT of this paper is inverted staggered type TFT. The gate electrode is formed by patterning with length of $8{\mu}m{\sim}16{\mu}m$ and width of $80{\sim}200{\mu}m$ after depositing with gate electrode (Cr). We have fabricated a-SiN:H, conductor, etch-stopper and photo-resistor on gate electrode in sequence, respectively. We have deposited n+a-Si:H, NPR(Negative Photo Resister) layer after forming pattern of Cr gate electrode by etch-slower pattern. The NPR layer by inverting pattern of upper Sate electrode is patterned and the n+a-Si:H layer is etched by the NPR pattern. The NPR layer is removed. After Cr layer is deposited and patterned, the source-drain electrode is formed. The a-Si:H TFT made like this has problems at photo-lithography process caused by remains of PR. When sample is cleaned, this remains of PR makes thin chemical film on surface and damages device. Therefor, in order to improve this problem we added ashing process and cleaning process was enforced strictly. We can estimate that this method stabilizes fabrication process and makes to increase a-Si:H TFT's yield.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.8
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• pp.5586-5590
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• 2015

In this paper, the directed alignment methode of the DNA molecule between the Au electrodes was suggested for the application of nano devices. To fabricate the nano device coated DNA, 2-Aminoethanthiol(AET) was coated on Au electrodes which was formed using photo-lithography process on $SiO_2/Si$ substrates. In general, the AET that was a positive charge with $NH^{3+}$ was strongly combined under the electrostatic interaction with DNA molecule which had to be a negative charge. The DNA molecules could be easily aligned between Au electrodes coated with AET. The structures of the DNA molecules were investigated using AFM(Atomic force microscope), they were changed from single types to bundle according to the AET concentrations.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.39.1-39.1
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• 2009

본 실험은 연성과 광 투명도가 뛰어난 아크릴 (PMMA) 과 폴리카보네이트 (Polycabonate) 기판의 축전 결합형 플라즈마 (CCP) 건식 식각 연구에 관한 것이다. 특히 식각 반응기 내부의 압력 변화에 따른 두 기판의 건식 식각 특성 분석에 초점을 맞추었다. 실험에 사용된 기판은 두께 1mm의 아크릴 (PMMA) 과 폴리카보네이트 (Polycabonate)를 $1.5\times1.5\;cm^2$로 절단하여 Photo-lithography 공정을 통하여 감광제 (Photo-resist)로 패턴하였다. 식각 반응기 내부에 패턴 된 아크릴(PMMA) 과 폴리카보네이트 (Polycabonate)를 넣은 후 반응기 내부 진공 상태로 만들었다. 그 후 5 sccm $O_2$ 가스를 유량조절기 (Mass flow controller)를 통하여 식각 반응기 내부로 유입하여 실험을 하였다. 이때 식각 공정 변수는 식각 반응기 내부 압력과 샘플 척 파워이다. 특성평가 항목은 식각 후 기판 (Substrate)의 식각율 (Etch rate), 식각 선택비 (Selectivity) 그리고 기판 표면 거칠기 (RMS roughness)이다. 실험 결과는 표면 단차 분석기(Surface profiler)를 이용하여 기판 (Substrate)의 표면을 분석 하였다. 또한 OES (Optical Emission Spectroscopy) 를 이용하여 식각 중 내부 플라즈마의 상태를 분석하였다. 본 실험 결과에 따르면 5 sccm $O_2$ 가스와 100 W 척 파워를 고정한 후 반응기 내부의 압력을 25 mTorr에서 180 mTorr까지 변화시켜 실험한 결과 40 mTorr의 반응기 내부 압력에서 실험 자료 중 가장 높은 식각율로 아크릴 (PMMA)은 $0.46\;{\mu}m/min$, 폴리카보네이트 (Polycabonate)는 $0.28\;{\mu}m/min$의 결과를 얻었다. 또한 이 자료를 바탕으로 5 sccm $O_2$ 가스와 반응기 내부 압력을 40 mTorr로 고정시키고 RIE 척 파워를 25 W에서 150 W로 증가시켰을 때 아크릴 (PMMA)의 식각율은 $0.15\;{\mu}m/min$에서 $0.72\;{\mu}m/min$까지 증가하였고, 폴리카보네이트 (Polycabonate) 의 식각율은 $0.1\;{\mu}m/min$에서 $0.36\;{\mu}m/min$까지 증가하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.33-33
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• 2007

SoP-L 공정은 유전율이 상이한 재료를 이용하여 PCB 공정이 가능하고 다른 packaging 방법에 비해 공정 시간과 비용이 절약되는 잠정이 있다. 본 연구에서는 SoP-L 기술을 이용하여 Si 기판의 함몰에 판한 공정의 안정도와 함몰 시 제작된 때턴의 특성의 변화에 대해 관찰 하였다. Si 기판의 함몰에 Active device를 이용하여 특성의 변화를 살펴보고 공정의 안정도를 확립하려 했지만 Active device는 측정 시 bias의 확보와 특성의 민감한 변화로 인해 비교적 측정이 용이하고 공정의 test 지표를 삼기 위해 passive device 를 구현하여 함몰해 보았다. Passive device 의 제작 과정은 Si 기판 위에 spin coating을 통해 PI(Poly Imide)를 10um로 적층한 후에 Cr과 Au를 seed layer로 증착을 하였다. 그리고 photo lithography 공정을 통하여 photo resister patterning 후에 전해 Cu 도금을 거쳐 CPW 구조로 $50{\Omega}$ line 과 inductor를 형성하였다. 제작 된 passive device의 함몰 전 특성 추출 data와 SoP-L공정을 통한 함몰 후 추출 data 비교를 통해 특성의 변화와 공정의 안정도를 확립하였다. 차후 안정된 SoP-L 공정을 이용하여 Active device를 함몰 한다면 특성의 변화 없이 size 룰 줄이는 효과와 외부 자극에 신뢰도가 강한 기판이 제작 될 것으로 예상된다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.8
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• pp.601-604
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• 2010

In this study, the piezoelectric energy harvester was investigated employing the pillar structure with the diameter size of 50~500 um. Usually, the aspect ratio between the height and diameter was related with the piezoelectric performance. High aspect ratio was showed the low electric noise and high piezoelectric properties than low aspect ratio. Therefore, we have selected the Su-8 photo-resist and modified lithography process to manufacture the pillar structure with height above the 250 ${\mu}m$. In this presentation, we will report the process and properties of micro pillar structure based on the PMN-PZT (Pb$(Mg_{1/3}Nb_{2/3})O_3$-PbZrTiO$_3$) materials.