• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.395-396
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• 2008

• 월간포장계
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• 통권114호
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• pp.56-62
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• 2002

• International Journal of Precision Engineering and Manufacturing
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• 제4권4호
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• pp.51-56
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• 2003

Generally, the build-up printed circuit board manufactured by a sequential process involving etching, plating, drilling, etc, which requires many types of equipments and long lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing a prototype in the development stage. In this study, we introduce a screen printing technology for prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as formation of a liquid resin thin layer, solidification by a UV/IR light, and via hole filling with a conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with the conventional process.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 춘계학술발표대회
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• pp.12.1-12.1
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• 2009

For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

• 한국결정성장학회지
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• 제29권6호
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• pp.345-351
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• 2019

디지털 잉크젯 프린팅 기술은 고해상도, 빠른 인쇄 속도, 높은 잉크 효율과 같은 장점과 함께 다양한 소재 적용이 용이하여 반도체, 디스플레이, 세라믹 타일 등의 산업 분야에서 주목을 받고 있다. 최근에는 전통적인 잉크 소재에서 벗어나 우수한 내열성, 내광성, 내화학성 등을 보이는 기능성 소재도 잉크젯 프린팅 공정에 적용하려는 시도가 활발히 진행되고 있다. 특히 2차원 인쇄뿐만 아니라 3차원 적층인쇄에 관한 연구도 시작되고 있으며 이를 위해서는 토출되는 잉크의 유변학적 물성과 프린트되는 기판과의 상호작용를 제어하는 것이 필수적이다. 본 연구에서는 나노 실리카 입자가 포함된 광경화성 세라믹 잉크를 합성하고 잉크의 물성과 프린팅 기판의 표면특성을 제어하였다. 나노 실리카 입자가 포함된 광경화성 세라믹 잉크의 퍼짐현상을 억제하고 기판과의 접촉각 특성을 개선함으로써 결과적으로 프린팅 해상도 및 적층성을 향상시켰으며 잉크젯 프린팅을 이용한 광경화 나노 실리카 잉크의 3D 프린팅에 대한 가능성을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.502-502
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• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

• 한국결정성장학회지
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• 제30권5호
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• pp.174-182
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• 2020

최근 잉크젯 프린팅 기술을 이용한 인쇄전자 분야가 차세대 기술로서 각광받고 있으며, 복수의 프린트 헤드(head)로부터 다양한 잉크 형태의 소재를 정밀하게 출력하여 적층할 수 있는 3D 프린팅 기술에 관한 연구가 활발하게 진행되고 있다. 본 연구에서는 잉크젯 3D 프린팅 기술을 이용하여 광경화성 실리카 잉크와 PVP가 첨가된 나노 구리 잉크로 절연층과 전도층의 복합구조체를 제작하였다. 프린팅 구동 조건과 잉크의 유변학적 거동을 최적화하여 정밀한 광경화 실리카 절연층을 적층 제조하였으며, 절연층의 저항은 2.43 × 10¹³ Ω·cm의 값을 나타내었다. 광경화 실리카 절연층 위에는 액적 간격 제어를 통하여 나노 구리 전도층을 프린팅하였다. PVP 첨가 나노 구리 잉크의 소결은 IPL 광소결 공정을 이용하였으며, 어닐링 온도와 인가 전압 변화에 따른 전기적, 기계적 특성을 확인하였다. 100℃ 어닐링 온도와 700 V IPL 광소결 조건에서 PVP가 첨가된 나노 구리 전도층의 저항은 29 μΩ·cm으로 매우 낮으며, 광경화 실리카 절연층과의 접착력은 매우 우수한 것으로 확인하였다.

• 전기학회논문지
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• 제57권5호
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• pp.803-807
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• 2008

A making process of DSC(dye sensitized solar cell) was presented. In general, Photo electrodes of DSC was made by using colloid paste of nano $TiO_2$ and processing of Doctor-blade printing and high temperature sintering for porous structure. These methods lead to cracks on $TiO_2$ surface and ununiform of $TiO_2$ thickness. This phenomenon is one factor that makes low efficiency to cells. After $TiO_2$ printing on TCO glass, a physical vibration was adapted for reducing ununiform of $TiO_2$ thickness. And a thermal treatment at low temperature(under $75^{\circ}C$) was adapted for reducing cracks on $TiO_2$ surface. In this paper, we have designed and manufactured an ultrasonic circuit (100W, frequency and duty variable) and a thermal equipment. Then, we have optimized forcing time, frequency and duty of ultrasonic irradiation and thermal heating for surface treatment of photo-electrode of DSC. In I-V characteristic test of DSC, ultrasonic and thermal treated DSC shows 19% improved its efficiency against monolithic DSC. And it shows stability of light-harvesting from drastically change of light irradiation test.

• 한국정보과학회:학술대회논문집
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• 한국정보과학회 2004년도 가을 학술발표논문집 Vol.31 No.2 (3)
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• pp.76-78
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• 2004

근래에 이르러 Digital Photo에 대한 사용자들의 수요가 늘어나면서 DSC이나 Camera Phone으로부터 Photo용 Printer로의 Printing Solution 개발에 대한 요구가 증가하고 있다. 2003년에 미국과 일본의 회사들이 이런 용도로 PictBridge를 개발하였다. 이것은 Image File의 전송에 대한 것인데, 최근에 이르러 양질의 프린팅 서비스 제공을 위하여 XHTML을 전송하는 방식에 대한 연구가 진행 중이다. 본 논문은 Pictsridge 상에 HXHTML script을 전송하는 방식에 대한 내용을 담고 있다.

• 한국세라믹학회지
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• 제56권4호
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• pp.360-364
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• 2019

PZT suspensions for photo-curable 3D printing were fabricated and their characteristics were evaluated. After mixing the PZT, photopolymer, photo-initiator, and dispersant for 10 min by using a high-shear mixer, the viscosity characteristics were investigated based on the powder content. To determine an appropriate dispersant content, the dispersant was mixed at 1, 3, and 5 wt% of the powder and a precipitation test was conducted for two hours. Consequently, it was confirmed that the dispersibility was excellent at 3 wt%. Through thermogravimetric analysis, it was confirmed that weight reduction occurred in the photopolymer between 120? and 500?, thereby providing a debinding heat treatment profile. The fabricated suspensions were cured using UV light, and the polymer was removed through debinding. Subsequently, the density and surface characteristics were analyzed by using the Archimedes method and field-emission scanning electron microscopy. Consequently, compared with the theoretical density, an excellent characteristic of 97% was shown at a powder content of 87 wt%. Through X-ray diffraction analysis, it was confirmed that the crystallizability improved as the solid content increased. At the mixing ratio of 87 wt% powder and 13 wt% photo-curable resin, the viscosity was 3,100 cps, confirming an appropriate viscosity characteristic as a stereolithography suspension for 3D printing.