• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.897-900
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• 2005

This paper presents temperature control of aluminum plate using Peltier module. As one of the thermoelectric effect, Peltier effect is heat pumping phenomena by electric energy. So if current is charged to Peltier module, it absorbs heat from low temperature side and emits heat to high temperature side. In this experiment, Peltier module is used to control the temperature of small aluminum plate with heating and cooling ability of Peltier module with current control and fan On/OFF control. And current control of Peltier module was accomplished by PWM method. As a results of experiments, it takes about 125sec to control temperature of aluminium plate between $30^{\circ}C\;and\;70^{\circ}C$ and about 70sec between $40^{\circ}C\;and\;60^{\circ}C$, in ambient temperature $29^{\circ}C$ while operating cooling fan only while cooling duration. Future aim is to realize more rapid temperature control and develop SMHA(special metal hydride actuator) by using Peltier module as a heating and cooling source.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.10
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• pp.60-67
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• 2006

This paper presents the temperature control in aluminum plate with Peltier module. From the experimental work, Peltier module is used to control the temperature of small aluminum plate for both heating and cooling with the control of current and fan ON/OFF. And current control of Peltier module was accomplished by PWM method. As a result of experiments, it is proper that operate cooling fan only while cooling duration and there exist a proper cooling current to drop temperature rapidly. It takes about 125sec to control temperature of aluminium plate between $30^{\circ}C$ and $70^{\circ}C$ and about 70sec between $40^{\circ}C$ and $60^{\circ}C$, in ambient temperature $28^{\circ}C{\sim}29^{\circ}C$ while cooling fan is operated only cooling duration. With the cooling current, temperature control of aluminum plate was accomplished more rapidly in comparison without cooling current. Future aim is to realize more rapid temperature control and develop SMHA(special metal hydride actuator) by using Peltier module as a heating and cooling source.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.1400-1404
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• 2005

This paper presents the temperature control of aluminum plate by using Peltier element. Peltier effect is heat pumping phenomena by electric energy as one of the thermoelectric effect. So if current is charged to Peltier element, it absorbs heat from low temperature side and emits heat to high temperature side. In this experiment, Peltier element is used to control the temperature of small aluminum plate with current control and operating cooling fan only while cooling duration. Operating cooling fan only while cooling duration is proper to get more rapid heating and cooling duration. As a result of experiment, it takes about 100sec period to repeating temperature between $35^{\circ}C$ and $70^{\circ}C$ and about 80sec from $40^{\circ}C$ to $70^{\circ}C$ in ambient air temperature $25^{\circ}C$ and while operating cooling fan only in cooling duration. Future aim is to apply this temperature control method in actuating SMHA(special metal hydride actuator) which is applicable in Siver project acting in low frequency range by using Peltier element for heating and cooling.

• Transactions of Materials Processing
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• v.17 no.5
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• pp.337-342
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• 2008

The injection molding process has high accuracy and good reproducibility that are essential for mass production at low cost. Conventional molding processes typically use the water-based mold heating and air cooling methods. However, in the nano injection molding processes, this semi-active mold temperature control results in the several defects such as air-flow mark, non-fill, sticking and tearing, etc. In order to actively control temperature of the molds and effectively improve the quality of the molded products, the novel nano injection molding system, which uses active heating and cooling method, has been introduced. By using the Peltier devices, the temperature of locally adiabatic molds can be controlled dramatically and the quality of the molded patterns can be improved.

• Design & Manufacturing
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• v.12 no.1
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• pp.31-35
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• 2018

The peltier thermoelectric module are used to cool the heat generated by electronic equipment. In order to increase the efficiency of the peltier thermoelectric module, the heat must be released to the outside. A heat sink is used to discharge such heat to the outside. in this paper, two types of heat sinks with internal tunnels were designed. And the heating and cooling performance of the heat sink with internal tunnel structure was compared and analyzed through ANSYS. The heat sink of the A type had better heat transfer than the heat sink of the B type. Which is about 70% improved.

• Journal of Power System Engineering
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• v.17 no.1
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• pp.71-76
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• 2013

This study is experimentally performed for using the oyster shell as a desiccant in the batch type system. The peltier element(thermoelectric device) is used for absorbing and releasing the adsorption and desorption heat generation. The cooling and heating effects of peltier element exist in this experiment and these effects are generally known phenomena among some references. The increase in electric current induced into peltier element is effectively release the heat generation of adsorption and desorption. Consequently, the non-dimensional adsorption and desorption amount would increase with increase in electric current. However, in the case of adsorption, the increase of induced current into peltier element, the heat of cold side can not release sufficiently. So the heat of hot side of peltier is transferred into the cold side.

• Design & Manufacturing
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• v.17 no.3
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• pp.41-47
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• 2023

This paper presents the development of a controller that can control the temperature of an heating system based on a thermoelectric module. Temperature controller using Peltier has various external factors such as external temperature, characteristics of an aluminum plate, installation location of temperature sensors, and combination method between the aluminum plate and heating element. Therefore, it is difficult to apply the simulation and simulation results of heating system using Peltier at control algorithm. In general, almost temperature controller is using PID algorithm that finds control gain value heuristically. In this paper, it is proposed mathematical model that explain correlate between the temperature of the heating system and input voltage. And then, optimal parameter of estimated thermal model of the aluminum plate are searched by using genetic algorithm. In addition, based on this estimated model, the optimal PID control gain are inferred using a genetic algorithm. All of the sequence are simulated and verified with proposed real system.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.513-516
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• 2008

We have replicated nanopillar arrays using injection molding process of active heating and cooling method by several peltier devices. The injection melding has a high accuracy ed good reproducibility that are essential for mass production at low cost. Conventional molding processes widely use the water-based mold heating and air cooling methods. However, in case of replication for nano-patterned structures, it caused several defects such as air-flow mark, non-fill, sticking and tearing. In this study, periodic nano-scale patterns are replicated by using injection molding with Peltier devices. Porous nano-scale patterns, which have pore diameter range from 120nm to 150nm, were fabricated by using anodizing process. Periodic nano-pore structures ( $20mm\;{\times}\;20mm$) were used as a mold stamp of injection molding. Finally, PMMA with nanopillar arrays was obtained by injection molding process. By using the Peltier devices, the temperature of locally adiabatic molds can be dramatically controlled and the quality of the molded patterns can be slightly improved.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.764-767
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• 2004

This paper present the temperature control of aluminum plate using Peltier element. Peltier effect is heat pumping phenomena by electric energy as one of the thermoelectric effect. So if current is asserted to Peltier element, it absorbs heat from low temperature side and emits to high temperature side. In this experiment, Peltier element is used to control the temperature of small aluminum plate with ON/OFF control scheme and fan ON/OFF. As the result of experiments, it is proper to act fan only while cooling duration and there exist a proper cooling current to drop temperature rapidly. It takes about 100sec to increase to 7$0^{\circ}C$ and drop to 35$^{\circ}C$ of aluminium plate temperature and about 90sec to increase to 7$0^{\circ}C$ and drop to 4$0^{\circ}C$ in ambient temperature 3$0^{\circ}C$ while fan is on only in cooling duration. Future aim is to realize more rapid temperature control and develop SMHA(special metal hydride actuator) by using Peltier element to heating and cooling.

• International Journal of Air-Conditioning and Refrigeration
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• v.14 no.3
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• pp.94-101
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• 2006

A theoretical investigation to find thermodynamically optimum design conditions of conduction-cooled Peltier current leads is performed. A Peltier current lead (PCL) is composed of a thermoelectric element (TE), a metallic lead and a high temperature superconductor (HTS) lead in the order of decreasing temperature. Mathematical expressions for the minimum heat flow per unit current crossing the TE-metal interface and the minimum heat flow per unit current from the metal lead to the joint of the metal and the HTS leads are obtained. It is shown that the temperature at the TE -metal interface possesses a unique optimal value that minimizes the heat flow to the joint and that this optimal value depends on the material properties of the TE and the metallic lead but not the joint temperature nor electric current. It is also shown that there exists a unique optimal value for the joint temperature between the metal and the HTS leads that minimizes the sum of the power dissipated by ohmic heating in the current leads and the refrigerator power consumed to cool the lead, for a given length of the HTS.