• Polymer(Korea)
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• v.36 no.2
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• pp.119-123
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• 2012

Adhesion strength of polyurethane adhesive for laminated metal plate was investigated. Also, the effect of laminating conditions on the adhesion strength was understood by measuring peel strength as a function of adhesion temperature and time. The amount of isocyanate appearing due to the unblocking of oxime in polyurethane adhesive affected the strength of adhesion with hydroxyl on the metal plate or aluminum foil and it was controlled by adhesion temperature and time. However, the excess of temperature and time in laminating process caused the lowering of adhesion strength because of the decrease of solvent content as well as thermal degradation of the adhesive.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.38-43
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• 2001

The interfacial adhesive joining characteristics of the foams are very important for the structural integrity of sandwich structures. Peel strength is one of the best criteria for the interfacial characteristics of the sandwich structures and peel energy is most commonly used for the interfacial characteristics. The peel strength is the first peak force per unit width of bond line required to produce progressive separation by the wedge or other crack opening type action of two adherends where one or both undergo significant bending and the peel energy is the surface active energy per unit width of bond line. In this work, to investigate the strengthening effect of resin treatment on the interfacial surface of foam material, peel strength and peel energy of epoxy resin treated polyurethane foam core sandwich structures were obtained by the cleavage peel tests and compared with those of non surface treated polyurethane foam core sandwich structures.

• Journal of Adhesion and Interface
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• v.3 no.1
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• pp.13-19
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• 2002

We have studied on the surface and adhesion properties for acrylic terpolymers, having both hydrophobic and hydrophilic side chains, synthesized via solution polymerization. In order to develop a waterborne material. we tried to synthesize these terpolymers via emulsion polymerization. The polymeric emulsion synthesized was mainly composed of methyl methacrylate (MMA), methoxy-polyethyleneglycol methacrylate (MPEGMA) having hydrophilic side chains and methoxypolypropyleneglycol methacrylate (MPEGMA) having hydrophobic side chains. The viscosities of this series increased with an increase in the content of the co-monomer such as MPEGMA and (MPEGMA). This behavior resulted in the increase in the diameter and heterogeneity of the emulsion particle via AFM observation. Furthermore. the tensile adhesion strength and 90-degree peel strength of the adhesive of these polymeric emulsions were measured. In the case of polymeric emulsion composed of the same content of both hydrophilic and hydrophobic component, the adhesion property showed the highest value. However, since the adhesion properties as a practical applicable adhesive were poor, some improvements were required. When the composition above was modified with butyl acrylate (BA), the improvement effect on adhesion strength was accepted. In particular, 90-degree peel strength increased up to a maximum of 400% of the original value.

• Korean Journal of Materials Research
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• v.9 no.12
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• pp.1176-1180
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• 1999

The adhesion strength and high temperature/high humidity reliability of polyetherimide (PEI) adhesive on silicon wafer after being treated by each reactive ion etching (RIE) Aluminum (Al)-chelate adhesion promoter were investigated. 180$^{\circ}$ peel test and <85$^{\circ}C$ 85%> humidity test were performed for the initial adhesion strength and high temperature/high humidity reliability, respectively. For investigating surface effect scanning electron microscope (SEM), atomic force microscope (AFM), deionized (DI)-water contact angle studies were carried out. To investigate RIE effect, PEI was treated with $^O_2$ RIE, and then laminated. The initial peel strength increased slightly from 1.6 kg/cm for the first 2 minutes, and then decreased. High temp/high humid resistance decreased rapidly by RIE etching. RIE treatment on PEI affected on both of roughness and hydrophilicity increase. Aluminum-chelate adhesion promoter was coated by spinning on silicon wafer. The initial peel strength showed no effect of adhesion promoter treatment, but high temp/high humidity resistance increased remarkably. Al-chelate adhesion promoter did not affect the roughness but increased hydrophilicity.

• Journal of the Korean institute of surface engineering
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• v.32 no.6
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• pp.709-716
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• 1999

Ceramic is select for an alternative substrate material for high-speed circuits due to its low-thermal expansion. As, in this study, ceramic was prepared by ISG (interlayer sol-gel) process using metal salts and a metal alkoxide as the starting materials. Generally ceramic substrate is used electroless copper plating for the metallization. But it has been indicate weakely the adhesion strength between the substrate and copper layer. Therefore, this research, using the ISG process on the preparation of homogeneous and possible preparation at law temperature fabricated sol solution. Using of the dip coating method was coated for the purpose of giving the anchoring effect on the coating layer and enhancing the adhesion strength between the $Al_2$O$_3$ substrate and copper layer. This study examined primary the characteristic of the sol making condition and differential thermal analysis (DTA) X-ray diffraction (XRD) were mearsured to identify the crystal phase of heat treatment specimens. The morphology of the coated films were studied by scanning electron microscopy(SEM). As a resurt, XRD analysis was obtained patterns of $\alpha$-cordierite after heat-treatment about 2 hours at $1000^{\circ}C$. SEM analysis could have seen a large number of voids on coated film. The more contants of$ Al_2$$O_3$ Wt% was increased the more voids was advanced. Peel adhesion strength has a maximum in the contants of the TEOS:ANE of 1:0.7 mole%. In this case, adhesion strength has been measured 1150gf, peel adhesion strength were about 10 times more than uncoated of the ceramics film.

• Korean Journal of Materials Research
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• v.19 no.3
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• pp.119-124
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• 2009

In the microelectronics packaging industry, the adhesion strength between Cu and polyimide and the thermal stability are very important factors, as they influence the performance and reliability of the device. The three different buffer layers of Cr, 50%Cr-50%Ni, and Ni were adopted in a Cu/buffer layer/polyimide system and compared in terms of their adhesion strength and thermal stability at a temperature of $300^{\circ}C$ for 24hrs. A 90-degree peel test and XPS analysis revealed that both the peel strength and thermal stability decreased in the order of the Cr, 50%Cr-50%Ni and Ni buffer layer. The XPS analysis revealed that Cu can diffuse through the thin Ni buffer layer ($200{\AA}$), resulting in a decrease in the adhesion strength when the Cu/buffer layer/polyimide multilayer is heat-treated at a temperature of $300^{\circ}C$ for 24hrs. In contrast, Cu did not diffuse through the Cr buffer layer under the same heat-treatment conditions.

• Journal of the Korean institute of surface engineering
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• v.29 no.4
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• pp.238-252
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• 1996

In order to study the effect of interface oxides on the adhesion strength of the copper/epoxy system, copper foils were immersed in black oxide or brown oxide forming solutions before lamination with epoxy prepregs, and variation of peel strength with the treatment time were investigated. Results showed that peel strength decreased rapidly up to 1 minute of treatment lime and remained constant in the case of the black oxide treated specimens, which was accompanied by the thickening of $Cu_2O$ at the Copper/Epoxy interface during the period. In contrast, peel strength increased rapidly up to 1 minute of treatment time and remained constant in the case of the brown oxide treated specimens, which could be ascribed to the thickening of CuO. Subsequent heat treatments of the Copper/Epoxy laminations at $120^{\circ}C$ in air showed that peel strength remained constant in the case of the black oxide treated specimens but decreased gradually in the case of the brown oxide treated specimens. Following XPS analyses revealed that the latter was possibly caused by the coalescence of CuO at the Copper/Epoxy interface into $Cu_2O$.

• Journal of Adhesion and Interface
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• v.19 no.3
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• pp.118-122
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• 2018

In this study, polyurethane hot melt adhesive containing ester groups was synthesized. Three kinds of chain extenders were used to find out the best chain extender. Results showed that adhesive containing 1,4-butanediol as a chain extender exhibited the highest peel strength among them. Also, it was found that there existed the optimum molecular weight of 1,4-butanediol containing adhesive for make the highest peel strength.. Moreover, hot melt adhesive containing 1,4-butanediol chain extender was applied to various kinds of textiles substrate such as cotton, polyester, and urethane coated polyester textiles to study the effects of different substrates on the peel strength and water resistance at $60^{\circ}C$. It was found that cotton substrate showed the highest peel strength and urethane coated polyester substrate showed the highest resistance on $60^{\circ}C$ water.

• Journal of Fashion Business
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• v.23 no.2
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• pp.77-88
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• 2019

One way of appling 3D printing to garments is through the combination of 3D polymer filaments in textile fabrics. it is essential to understand the interface between the polymer and the 3D composite fabric in order to enhance the adhesion strength between the polymers and the peeling strength between the fabric and the polymer. In this study, the adhesion of composite printed specimens using a combination of fabric and polymers for 3D printing was investigated, and also the change in adhesion was investigated after the composite fabric printed with polymers was subjected to constant pressure. Through this process, the aims to help develop and utilize 3D printing textures by providing basic data to enhance durability of 3D printing composite fabrics. The measure of the peeling strength of the composite fabric prepared by printing on a fabric using PLA, TPU, Nylon polymer was obtained as follows; TPU polymer for 3D printing showed significantly higher peel strength than polymers of composite fabric using PLA and Nylon polymer. In the case of TPU polymer, the adhesive was crosslinked because of the reaction between polyurethane and water on the surface of the fabric, thus increasing the adhesion. It could be observed that the adhesion between the polymer and the fiber is determined more by the mechanical effect rather than by its chemical composition. To achieve efficient bonding of the fibers, it is possible to modify the fiber surface mechanically and chemically, and consider the deposition process in terms of temperature, pressure and build density.

• Journal of the Semiconductor & Display Technology
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• v.3 no.3
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• pp.11-17
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• 2004

This research has been progressed for adhesive improvement of the Polyimide/Buffer layer/Cu at the COF(Chip On Film) which induced as the alternative plan about high concentration of a circuit or substrates according to demands of miniaturization and high efficiency of various electronic equipment. RF plasma equipment was applied to when plama pretreatment was performed for improvement of adhesive strength of PI and Cr as the buffer layer. Experimental fluents were a species of the buffer layer, depositied time and the ratio of $O_2$/Ar when performed to plasma pretreatment. The results are that Ni was superior to Cr at peel test according to a species of the buffer layer, peel strength and Cu THK were showed proportional relation to deposition structure of the same buffer layer and sample of the Cr depositied time(30 sec) and Cu depositied time(20 min) was showed good adhesion to peel test according to Cr's depositied time and Cu's depositied time. When perform PI's plasma pretreatment peel strength and $O_2$/Ar ratio were showed proportional relation. But $O_2$/Ar(2/5) was best condition since then decreased.