• 한국재료학회지
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• 제17권10호
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• pp.509-515
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• 2007

In order to fabricate adhesiveless 2-layer flexible copper clad laminate (FCCL) used for COF (chip on film) with high peel strength, polyimide (PI; Kapton-EN, $38\;{\mu}m$) surface was modified by reactive $O_2^+$ and $N_2O^+$ ion beam irradiation. 300 mm-long linear electron-Hall drift ion source was used for ion irradiation with ion current density (J) higher than $0.5\;mA/cm^2$ and energy lower than 200 eV. By vacuum web coating process, PI surface was modified by linear ion source and then 10-20 nm thick Ni-Cr and 200 nm thick Cu film were in-situ sputtered as a tie layer and seed layer, respectively. Above this sputtered layer, another $8-9{\mu}m$ thick Cu layer was grown by electroplating and subsequently acid and base resistance and thermal stability were tested for examining the change of peel strength. Peel strength for the FCCLs treated by both $O_2^+$ and $N_2O^+$ ion irradiation showed similar magnitudes and increased as the thickness of tie layer increased. FCCL with Cu (200 nm)/Ni-Cr (20 nm)/PI structure irradiated with $N_2O^+$ at $1{\times}10^{16}/cm^2$ ion fluence was proved to have a strong peel strength of 0.73 kgf/cm for as-received and 0.34 kgf/cm after thermal test.

• 한국섬유공학회:학술대회논문집
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• 한국섬유공학회 1995년도 추계 학술발표회
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• pp.55-56
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• 1995

• 한국재료학회:학술대회논문집
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• 한국재료학회 1998년도 IUMRS-ICEM ABSTRACT BOOK
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• pp.138.3-138
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• 1998

• 대한기계학회논문집A
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• 제33권5호
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• pp.474-481
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• 2009

Fracture models and criteria of adhesive with two parameters, namely $G_C$ and ${\sigma}_{max}$, have been developed to describe the fracture process of adhesive joints. Cohesive zone model(CZM) is a representative two parameter failure criteria approach. In CZM, ${\sigma}_{max}$ is a critical, limiting maximum value of the stress in the damage zone ahead of the crack and is assumed to have some physical significance in adhesive failure. Based on CZM and finite element analysis method, the relationship between fracture load and adhesive properties, as $G_{IC)$ and $({\sigma}_{max})_I$, was investigated in adhesively bonded joint tensile test and T-peel test. The two parameters in tensile mode loading were evaluated by using the relationship. The value of $G_{\IC}$ evaluated by proposed method showed close agreement with analytical solution for tapered double cantilever beam(TDCB) test which proposed in an ASTM standard.

• 대한치과보철학회지
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• 제30권3호
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• pp.411-436
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• 1992

The purpose of this study was to assess the adhesion of resilient denture liners (such as, heat-cured silicone molloplast B,cold- cured silicone Mollosil) to polymethyl metacrylate (K-33) and metal (Megalloy) in the laboratory by peel test. The resilient denture lines were processed according to manufactures instruction, onto prepared specimens(original resin base plate, rough resin base plate, stippled metal plate, mesh metal plate ) 75mm long and 25m wide. And then, the peel test was performed by instron. The results were as follows : 1. The bonding strength of Mollosil was stronger than that of Molloplast B except the specimen of stippled metal plate. 2. The tensile strength of Mollosil was weaker than that of Molloplast Bas tearing of Mollosil was occured in the peel test. 3. Mesh metal plate had the highest bonding strength in the case of Molloplast B and Mollosil. But stippled metal plate have high bonding strength in the case of Molloplast B and have the lowest bonding strength in the case of Mollosil. 4. The bonding strength of rough resin base plate was stronger than that of original resin base plate in the case of Molloplast B and Mollosil. 5. The bonding strength of metal plates was stronger than that of resin base plates in the case of Molloplast B and Mollosil except the case of bonding strength between the stippled metal plate and Mollosil. 6. It seems that the Increase of surface and retention form of metal plate and resin base plate produces higher physical bonding strength.

• 한국근적외분광분석학회:학술대회논문집
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• 한국근적외분광분석학회 2001년도 NIR-2001
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• pp.1021-1021
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• 2001

Sample presentation, which means how to set samples to an NIR instrument, is very important in Near Infrared (NIR) Spectroscopy. When sample presentation is not suitable for the samples that you use, very good spectra can not be obtained even if you use a sophisticated NIR instrument. In my presentation, various NIR sample presentations for agricultural products such as intact fruits, single grains, vegetable juice and the others will be explained. In case of peaches with thin peel, the fiber optics of Interactance can be used. However, the fiber optics are not suitable for oranges with relatively thick peel. In this case, transmittance method is useful. As for a small sample such as single grains, a specially designed cell is needed. The cell in transmittance mode has been developed and then applied to single kernels of rice and soybean. In this case we also used the fiber optics. As regards liquid type of sample, a cuvette cell made of quartz in transmittance mode is popular. However, it is time-consuming to wash and dry it. In order to compensate this disadvantage the sample presentation using normal test tubes as sample cells have been developed and applied to milk, rumen juice and urine of a milking cow. An individual test tube can be used for each sample if you use the calibration equation with sample cell compensation. The test tube cell has also been applied to spinach juice for determination of undesirable constituents. It is concluded that sample presentation is most important for NIR Spectroscopy.

• 마이크로전자및패키징학회지
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• 제24권1호
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• pp.75-81
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• 2017

연성인쇄회로기판에서 금속 배선 도포층 에폭시수지와 폴리이미드 기판 사이의 계면접착력과 신뢰성 확보를 위해 3가지 폴리이미드 표면처리 및 열처리 조건에 따라 계면접착력 평가를 하였다. 또한 고온고습처리 조건에 따른 에폭시수지와 폴리이미드 사이의 계면 신뢰성을 $180^{\circ}$ 필 테스트를 통해 정량적으로 측정하였다. 폴리이미드 표면 KOH 전처리 전의 에폭시수지와 폴리이미드 사이의 필 강도는 29.4 g/mm이지만, $85^{\circ}C/85%$상대습도의 고온고습 환경에서 100 시간이 지난 후 10.5 g/mm로 감소하였다. 그러나, 폴리이미드 표면처리 후 열처리를 한 경우 29.6 g/mm의 필강도값을 가지며, 고온고습 환경 후에도 27.5 g/mm로 유지되었다. 파면 미세구조 분석 및 박리면 X-선 광전자 분광법 분석 결과, 폴리이미드 표면 습식 개질전처리 후 적절한 열처리를 하는 경우 폴리이미드 표면 잔류 불순물들의 효과적인 제거 및 습식공정에 의한 폴리이미드 손상 회복으로 인해, 고온고습환경에서도 계면접착력이 높게 유지되는 것으로 생각된다.

• Current Photovoltaic Research
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• 제4권2호
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• pp.59-63
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• 2016

A key point of a soldering process for photovoltaic (PV) modules is to increase an adhesive strength leading a low resistivity between ribbon and cell. In this study, we intended to optimize a heating condition for the soldering process and characterize the soldered joint via physical and chemical analysis methods. For the purpose, the heating conditions were adjusted by IR lamp power, heating time and hot plate temperature for preheating a cell. Since then the peel test for the ribbon and cell was conducted, consequently the peel strength data shows that there is some optimum soldering condition. In here, we observed that the peel strength was modified by increasing the heating condition. Such a soldering property is affected by a various factors of which the soldered joint, flux and bus bar of the cell are changed on the heating condition. Therefore, we tried to reveal causes determining the soldering property through analyzing the soldered interface.

• 한국응용과학기술학회지
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• 제17권4호
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• pp.262-266
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• 2000

Acrylic pressure sensitive adhesives of n-butyl acrylate, 2-ethyl acrylate, methyl acrylate, vinyl acetate, acrylic acid, acrylonitrile and 2-hydroxyethyl acrylate were synthesized and basic physical properties of pressure sensitive adhesives with increasing the contents of 2-hydroxyethyl acrylate were investigated. 2-Hydroxyethyl acrylates effects on glass transition temperature, viscosity, hardening time and peel strength. Glass transition temperature(Tg) decreased with increasing the contents of 2-hydroxyethyl acrylate. Viscosity and hardening time were increased with increasing the contents of 2-hydroxyethyl acrylate. On the other hands, peel strength increased with increasing the contents of 2-hydroxyethyl acrylate up to 6 wt% and the decreased at further higher contents of 2-hydroxyethyl acrylate. In peel test, interfacial failure was occured in 8 wt% and 10wt%.

• 마이크로전자및패키징학회지
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• 제25권2호
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• pp.41-48
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• 2018

Fan-out wafer level packaging (FOWLP) 적용을 위한 최적의 Cu 재배선 계면접착에너지 측정방법을 도출하기 위해, 전기도금 Cu 박막과 WPR 절연층 계면의 정량적 계면접착에너지를 $90^{\circ}$ 필 테스트, 4점 굽힘 시험법, double cantilever beam (DCB) 측정법을 통해 비교 평가 하였다. 측정 결과, 세 가지 측정법 모두 배선 및 패키징 공정 후 박리가 일어나지 않는 산업체 통용 기준인 $5J/m^2$보다 높게 측정되었다. 또한, DCB, 4점 굽힘 시험법, $90^{\circ}$ 필 테스트 순으로 계면접착에너지가 증가하는 거동을 보였는데, 이는 계면파괴역학 이론에 의해 위상각 증가에 따라 이종재료 계면균열 선단의 전단응력성분 증가에 따른 소성변형에너지 및 계면 거칠기 증가 효과에 의한 것으로 설명이 가능하다. FOWLP 재배선에 대한 최적의 계면접착에너지 도출을 위해서는 시편제작 공정, 위상각 차이, 정량적 측정 정확도 및 결합력 크기 등을 고려하여 4점 굽힘 시험법 또는 DCB 측정법을 적절히 혼용 사용하는 것이 타당한 것으로 판단된다.