• Nuclear Engineering and Technology
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• v.53 no.4
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• pp.1218-1223
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• 2021

A hydrophobic ionic liquid including an amino moiety ([DiOcAPmim][NTf₂]) was synthesized. Its extraction behaviors towards Pd(II), Ru(III), Rh(III) were investigated in nitric acid aqueous solution as a function of contact time, effect of concentration of nitric acid, effect of temperature, and effect of co-existing metal ions. The extraction kinetics of Pd(II) was fairly fast and extraction equilibrium can be attained within only 5 min under the [HNO₃] = 2.05 M. When [HNO₃]< 1 M, the extraction percentage of Pd(II), Ru(III), Rh(III) were all above 80%. When [HNO₃] reached 2 M, all of the extraction percentage decreased and in an order of Pd(II)>Ru(III)>Rh(III). When [HNO₃]> 2 M, the extraction performance gradually recovered. The effect of temperature can slightly affect the extraction performance of Pd(II). Furthermore, in simulated high-level liquid waste, [DiOcAPmim][NTf₂] showed a better preference towards Pd(II) under the interference of various other co-existing metal ions.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.267-267
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• 2015

본 연구에서는 에틸렌디아민을 착화제로 사용하여 전해도금으로 Ni-Pd 합금피막을 형성하였다. 염화팔라듐 농도 1~5 mM, 전류밀도 $0.2{\sim}1.5A/dm^2$ 구간에서 고용체 합금피막이 형성되었으며, 이의 격자상수는 X선회절 분석을 통하여 확인하였다. Pd 함량은 전류밀도가 증가할수록 감소하였고, 경도는 전류밀도가 증가할수록 증가하다가 전류밀도 $1.3A/dm^2$ 이후 급격히 감소하였다. 경도증가 원인은 결정립미세화이고, 전류밀도 $1.3A/dm^2$ 이후에서 잔류응력으로 인한 크랙 발생으로 사료되었다.

• Bulletin of the Korean Chemical Society
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• v.30 no.9
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• pp.1951-1955
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• 2009

A Thermodynamic study on the interaction of bovine calf thymus DNA with new designed Pd(II) complex (Ethylendiamine- 8-hydroxyquinolinato Palladium(II) chloride) was studied by using isothermal titration calorimetry (ITC) at 27 ${^{\circ}C}$ in Tris buffer solution at pH = 7.5. The enthalpies of Pd(II) complex + DNA interaction are reported and analysed in terms of the new solvation theory. It was indicated that there are three identical and non-cooperative sites for Pd(II) complex. The binding of a Pd(II) complex is endothermic with association equilibrium constants of 428.03 m$M^{-1}$ at 27 ${^{\circ}C}$. The binding of Pd(II) complex can cause some changes in the stability of the DNA at low and high Pd(II) complex concentrations. Our results suggested that this complex might interact with DNA as an intercalator, thus interfering with DNA replication and cell proliferation.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.206-206
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• 2011

Nanoparticles have been received great attention from many researchers for several decades because of their good and unique properties. In particular, researches in the field of synthesis of bimetallic nanoparticles showed good results for the past ten years. In this research, Pd thinlayer on Au nanoparticles were synthesized by electrochemical deposition method. Well-defined Au(111) nanoparticles were synthesized by solution based reduction method. Electrochemical deposition conditions for Pd thinlayer on Au(111) nanoparticles surface were carefully regulated by controlling parameters of cyclic voltammetry. To calculate exact mass and surface area catalytic activities of deposited Pd thinlayer on Au(111) nanoparticle, electrochemically active surface area (ECSA) and mass of the deposited Pd thinlayer were measured by cyclic voltammetry in 0.1 M HClO4 solution. Afterward, catalytic activities of the deposited Pd thinlayer were measured in 0.1 M HClO4 + 0.2 M formic acid solution. In case of less negative deposition potential, the amounts of deposited Pd mass and surface area were small. However, mass and ECSA activity of the deposited Pd to oxidize formic acid were increased.

• Journal of Magnetics
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• v.8 no.4
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• pp.146-148
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• 2003

Multilayered films of Co/Pd have been studied as a candidate material for a high density perpendicular recording medium due to higher anisotropy energy. However, high exchange coupling among grains results in large transition noise. To reduce the exchange coupling and grain size, addition of 3rd elements and physical separation of grains have been attempted. In the present paper, effects of sputtering pressure, Co sublayer thickness and Pd underlayer thickness on magnetic properties and microstructures were studied. It was found that by increasing sputtering pressure from 5 mTorr to 25 mTorr, Ms decreased to one half and coercivity increased more than 5000 Oe. The increase of the coercivity is associated with physical separation of grains by high pressure sputtering. Ms per volume of Co for Co/Pd multilayered film deposited at 25 mTorr shows continuous decrease with increasing Co sublayer thickness. This was related to void formation and intermixing of Co/Pd interface. Also, effect of Pd underlayer thickness on magnetic properties will be discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.11a
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• pp.361-364
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• 1996

Aging diagnosis system using partial discharge(PD) is being highlighted as a research area. But the application of PD requires complicated analysis method because the PD has complex progressing forms. In this paper, It has been developed to the PD diagnosis system using neural network(NN). As a result after NN learning, the recognized rate was represented about 85%. The safety area is possible to express the second output of NN in this experiments.

• Korean Journal of Metals and Materials
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• v.47 no.6
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• pp.349-355
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• 2009

In the solvent extraction of Ru(IV) with Alamine336, it was found that Ru took part in the reaction as $RuCl_{6}_^{2-}$ in the HCl concentration range of 1 to 5 M. Interaction parameter between hydrogen ion and $RuCl_{6}_^{2-}$ was estimated by applying Bromley equation to the extraction data. From the mixed solutions of Pd(II) and Ru(IV), the distribution coefficients of Pd were found to be higher than those of Ru in the experimental ranges. Separation factor between Pd and Ru rapidly increased with the decrease of Alamine336 concentration. About 60% of the Ru from the mixed solutions was extracted by TBP at 8.3 M HCl, while Pd was not extracted in the HCl concentration range of 1.6 to 8.3 M.

• Applied Chemistry for Engineering
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• v.10 no.7
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• pp.996-1002
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• 1999

The oxalate precipitation of lanthanide and actinide by oxalic acid was investigated in the simulated radioactive liquid waste, which was composed of 17 elements of alkali, alkaline earth(Cs, Rb, Ba, Sr), transition metal(Zr, Fe, Mo, Ni, Pd, Rh), lanthanide(La, Y, Nd, Ce, Eu) and actinide(Np, Am) in nitric acid solution. The effect of concentrations of nitric acid and ascorbic acid on the precipitation yield of each element in the simulated solution was examined at 0.5 M oxalic acid concentration. The precipitation yields of the elements were usually decreased with nitric acid concentration, nevertheless, the precipitation yields of lanthanide and actinide were more than 99%. Palladium was precipitated due to the reduction of Pd(II) into Pd metal by the addition of ascorbic acid in the oxalate precipitation and then, the precipitation yields of Mo, Fe, Ni, Ba decreased by 10~20% with concentration of ascorbic acid. The reductive precipitation of Pd(II) into Pd metal by the addition of ascorbic acid into the simulated radwaste occurred at below 1 M nitric acid concentration and its yield showed maximum at the ascorbic acid concentration of 0.01~0.02 M. The hydrazine suppressed the reductive precipitation of Pd by the ascorbic acid.

• Journal of the Korean Chemical Society
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• v.42 no.4
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• pp.369-377
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• 1998

The palladium(II) and platinum(II) complexes(where, $([M(L)_2X_2]$, M=Pd(II), Pt(II); L=isoxazole(isox), 3,5-dimethylisoxazole(3,5-diMeisox), 3-methyl, 5-phenylisoxazole(3-Me, 5-Ph-isox), and 4-amino-3,5-dimethylisoxazole (4-ADI); X=Cl, Br) with isoxazole and its derivatives were investigated on antitumor activity by MM2 and EHMO calculation. Because for all the complexes the ${\sigma}MO$ energy level $(E_{{\sigma}(M-X)})$ between $d_x^{2-}_y^2$ orbital of central metal and px orbital of halogen atom is less than ${\sigma}MO$ energy level $(E_{{\sigma}(M-N)})$ between $d_x^{2-}_y^2$ orbital of central metal and px orbital of N atom, without exception. And judging, from the lower $(E_{\'{o}(m-x)})$ value in trans, the bonding strength was found to be weaker in trans isomer than in cis. For the Pd(II) and Pt(II) complexes which have planar ligands, it was shown that for all the complexes dissociation of X-atom in the Pd(II) complexes is easier than that of X-atom in the Pt(II) complexes in both cis- and trans-complexes. Therefore it suggests that the easier dissociation of $X^-$ ion has some relations with antitumor activity, and a linear equation with correlation coefficient of 0.96 was found between ${\Delta}E_{{\sigma}(N-X)}(E_{{\sigma}(M-N)}-E_{{\sigma}(M-X)})$ and inhibitory activity coefficient, logIA.

• Korean Journal of Materials Research
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• v.9 no.3
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• pp.288-294
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• 1999

In the flip chip interconnection using solder bump, the Under Bump Metallurgy (UBM) is required to perform multiple functions in its conversion of an aluminum bond pad to a solderable surface. In this study, various UBM systems such as $Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 5\mu\textrm{m}, Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}, al 1\mu\textrm{m}/Ni 0.2\mu\textrm{m} / Cu 1\mu\textrm{m} and Al 1\mu\textrm{m}/Pd 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}$ for flip chip interconnection using the low melting point eutectic 63Sn-37Pb solder were investigated and compared to their metallurgical properties. $100\mu\textrm{m}$ size bumps were prepared for using an electroplating process. The effects of the number of reflows and aging time on the growth of intermetallic compounds(IMC) were investigated. $Cu_6Sn_5$ and $Cu_3Sn$ IMC were abserved after aging treatment in the UBM system with thick coper $(Al 1\mu\textrm{m}/Ti 0.2\mu\textrm{m}/Cu 5\mu\textrm{m})$. However only the $Cu_6Sn_5$ was detected in the UBM system with $1\mu\textrm{m}$ thick copper even after 2 reflow and 7 day aging at $150^{\circ}C$. Complete Cu consumption by Cu-Sn IMC growth gives rise to a direct contact between solder inner layer such as Ti, Ni and Pd, and hence to possibly cause reactions between two of them. In this study, however, only for the Pd case, IMC of PdSn. was observed by Cu consumption. UBM interfacial reactions with s이der affected the adhesion strength ot s이der balls after s이der reflow and annealing treatment.