• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.192-193
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electro less plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. In this paper, we investigated low-cost Ni/Cu contact formation by electro less and electroplating for crystalline silicon solar cells.

• Progress in Superconductivity
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• v.1 no.1
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• pp.61-67
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• 1999

We evaluated the effect of alloying element additions to Ag sheath on mechanical, electrical and thermal properties of Bi-2223. Additions of Au, Pd and Mg to Ag sheath increased hardness and strength, while reduced elongation and electrical and thermal conductivity. In addition, microstructural investigation showed that the grain size of Ag significantly decreased with increasing content of alloying elements. The improvements in strength and hardness are believed to be due to the presence of alloying elements that lead to strengthen materials by combined effects of solid-solution, dispersion hardening and grain size hardening. Thermal conductivity of Ag and Ag alloys was evaluated in the temperature range from 77 K to 300 K, and com-pared to calculated value obtained by Wiedermann-Franz law. It was observed that the thermal conductivity decreased with increasing the content of alloying elements. Specifically, the thermal conductivity of $Ag_{0.92}Pd_{0.06}Mg_{0.02}$ alloy was measured to be $48.2W/(m{\cdot}K)$ at 77 K, which is about 6 times lower than that of $Ag(302.6W/(m{\cdot}K))$.

• Applied Chemistry for Engineering
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• v.17 no.5
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• pp.458-464
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• 2006

The Pd-Ni-Ag alloy composite membrane using modified porous stainless steel (PSS) as a substrate was prepared by a electroless plating technique. In this work, we have introduced the intermediate layer between Pd-based alloy and a metal substrate. As an intermediate layer, the mixtures of nickel powder and inorganic sol such as $SiO_{2}$ sol, $Al_{2}O_{3}$ sol, and $TiO_{2}$ sol were used. The intermediate layers were coated onto a PSS substrate according to various membrane preparation conditions and then $N_{2}$ fluxes through the membranes with different intermediate layers were measured. The surface morphology of the intermediate layer in the mixture of nickel powder and inorganic sol was analyzed using scanning electron microscope (SEM). Finally, the Pd-Ni-Ag alloy composite membrane using the support coated with the mixture of nickel powder and silica as an intermediate layer was fabricated and then the gas permeances for $H_{2}$ and $N_{2}$ through the Pd-based membrane were investigated. The selectivity of $H_2/N_2$ was infinite and the $H_{2}$ flux was $1.39{\times}10^{-2}mol/m^2{\cdot}s$ at the temperature of $500^{\circ}C$ and trans-membrane pressure difference of 1 bar.

• Applied Chemistry for Engineering
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• v.16 no.5
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• pp.641-647
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• 2005

The partial oxidation of methane is one of important processes for hydrogen production. As a membrane reactor, palladium-silver (Pd-Ag) alloy membrane prepared by electroless plating technique was employed for partial oxidation of methane. The experimental variables were reaction temperature, $O_2/CH_4$ mole ratio, $CH_4$ feed rate, and $N_2$ sweep gas flow rate. The methane conversions increased with the reaction temperatures in the range of 350 to $730^{\circ}C$. The highest methane conversion and CO selectivity were obtained at the condition of $O_2/CH_4$ mole ratio of 0.5 and $730^{\circ}C$ using commercially available nickel/alumina catalyst. The Pd-Ag membrane reactor showed higher methane conversions, 10~40% higher, compared to those in a traditional reactor.

• The Journal of Korean Academy of Prosthodontics
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• v.25 no.1
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• pp.95-118
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• 1987

This study was undertaken to observe the elemental transition of Interface depending on different pretreatment methods, the number of filings, the kinds of porcelain powders and the various alloys in ceramo-metal restoration. The materials used in this study were Pors-on $4^{(R)}$ and Ceramco porcelain powder to compare the differences depending on the pretreatement methods and the number of firings. Ceramco porcelain powder and Vita porcelain powder were used to compare the differences of elemental transition depending on the porcelain powders. The $Parasil^{(R)},\;PGV^{(R)}$ and Pors-on $4^{(R)}$ as Pd-Ag alloy were used to compare the difference of elemental transition depending on the various alloys. The pretreatment methods were : no treatment, treatment under vacuum and air, treatment with 50 % hydrofluoric acid and double heat tretament. The number of firings were 3, 5 and 7 repeated firings All specimens were observed by SEM and concentration of elements were analyzed quantitatively with EPMA The results of this study were obtained as follows : 1. In the groups of air-treatment, concentration of Sn were the highest and widest. A high concentration of In were in the groups of vacuum and air treatment. 2. There were no significant differences in concentration of Sn between the group of vacuum, 5 minutes hydrofluoric acid and double heat treatment. (p>0.05) 3. As the period of time of hydrofluoric acid treatment increased, not only were the trace elements reduced but the main components such as Pd and Ag were also reduced. 4. Concentration of Sn and In increased and diffused with repeated firings but 5 repeated and 7 repeated firings groups had no significant differences. (p>0.05) 5. Sn were more concentrated in the group of Ceramco porcelaion powder than Vita porcelain powder. 6. The higher concentration of trace elements in the alloy, the more increasing concentration of Sn and In in the interface.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.196-196
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• 2016

치과나 기공소로부터 높은 원가로 인한 재료선택에 어려움을 겪고 있어 귀금속 금합금의 물성을 가질 수 있도록 하면서 가격급등으로 인한 문제 해결하기 위한 비귀금속 합금으로 대체가 필요하기에 이에 따른 연구가 이루어져 국산 제품의 상품화를 위해 파라듐을 이용하여 적합한 새로운 합금을 개발하는 것이 필요하다. 치과용 골드합금은 미국치과의사 협회의 구정에 의하면 1형부터 4형까지 분류하고 있으며 3형에 해당하는 강도와 기계적인 특성을 갖도록 파라듐으로 대체하는 연구가 진행중이거나 시판되고 있다. 따라서 본 연구에서는 2형, 3형 및 4형을 대체가능하도록 팔라듐을 기반으로 한 새로운 합금을 설계하고 합금의 성분원 소인 Au(1~5), Pd(20~25), Ag(70~75), In(1.5) 및 Zn(2)등으로 조성을 변화시켜 측량 후 합금을 제조하기 위하여 아르곤 분위기하의 진공아크용해로를 이용하여 용해하였다. 정량된 금속을 진공아크 용해로에 장입하고 용해는 균질한 합금이 되도록 최소한 6회 이상 용융을 실시하며 합금성분의 손실이 발행하지 않도록 보정을 하였다. 합금의 미세조직 관찰을 위하여 샘플을 고속 다이아몬드 정밀 절단기(Acculom-5, STRUERS, Denmark)를 이용하여 절단한 후 2000 grit의 Sic 연마지에서 단계적으로 $0.3{\mu}m$ 알루미나 분말까지 연마한 후 초음파 세척을 하였다. 준비한 시편은 KCN과 $(NH_4)_2S_2O_8$을 1:1로 혼합한 부식액으로 에칭한 후 OM과 SEM을 이용하여 조직을 관찰하였으며 각 샘플의 성분변화는 EDS 분석을 통해 확인하고 결정구조는 XRD를 사용하여 분석하였다. 경도시험은 비커스경도시험기를 이용하여 5kg의 하중을 30초간 작동시켜 압흔을 연결된 micron으로 평균값을 측정하였다. 각 시편의 부식거동은 POTENTIOSTAT(Model PARSTAT 2273, EG&G, USA)을 이용하여 구강 내환경화 유사한 $36.5{\pm}1^{\circ}C$의 0.9% NaCl에서 실시하였다. 인가전위는 -1500mV에서 1000mV까지 1.67 mV/min의 주사속도로 인가하여 시험을 수행하였으며 분극곡선으로부터 부식전위와 부식전류밀도 및 부동태영역의 전류밀도로 금속의 용출거동을 조사하였으며 부식이 끝난 시편은 FE-SEM과 EDS를 사용하여 조사하였다. 기계적인 특성은 Pd-Ag에 3wt%의 Au를 첨가한 합금이 Pd-Ag에 1.5wt%합금을 첨가한 경우에 비하여 기계적인 특성이 증가하고 내식성이 크게 증가하였다. 이들 합금에 Cu를 11wt%를 첨가한 경우는 비커스경도가 200이상으로 높게 나타났지만 내식성이 크게 감소하였다.

• Journal of the Korean Ceramic Society
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• v.39 no.3
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• pp.286-293
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• 2002

Microstructure and the electrical porperties of a ZnO-based multilayered chip-type varistor(abbreviated as MLV) with Ag/Pd(7:3) inner electrode have been studied as a function of firing of temperature. At 1100$^{\circ}$C, inner electrode layers began to show nonuniform thickness and small voids, which resulted in significant disappearance of the electrode pattern and delamination at 1100$^{\circ}$C. MLVs fired at 950$^{\circ}$C showed large degradation in leakage current, probably due to incomplete redistribution of liquid and transition metal elements in pyrochlore phase decomposition. Those fired at 1100$^{\circ}$C and above, on the other hand, revealed poor varistor characteristics and their reproductibility, which are though to stem from the deformation of inner electrode pattern, the reaction between electrode materials and ZnO-based ceramics, and the volatilization of $Bi_2O_3$. Throughout the firing temperature range of 950∼1100$^{\circ}$C, capacitance and leakage current increased while breakdown voltage and peak current decreased with the increase of firing temperature, but nonlinear coefficient and clamping ratio kept almost constant at ∼30 and 1.4, respectively. In particular, those fired between 1000$^{\circ}$C and 1050$^{\circ}$C showed stable varistor characteristics with high reproducibility. It seems that Ag/Pd(7:3) alloy is one of the electrode materials applicable to most ZnO-based MLVs incorporating with $Bi_2O_3$ when cofired up to 1050$^{\circ}$C.

• Transactions on Electrical and Electronic Materials
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• v.1 no.2
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• pp.32-37
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• 2000

Effect of alloying element additions to Ag on thermal conductivity and electrical conductivity of sheath materials for Bi-Pb-Sr-Ca-Cu-O(BSCCO) tapes has been characterized. The thermal conductivity at low temperature range (10~300K) of Ag and Ag alloys were evaluated by both direct and indirect measurement techniqueas and compared with each other, It was observed that the thermal conductivity decreases with increasing the content of alloying element such as Au, Pd and Mg. Thermal conductivity of pure Ag at 3 0K was measured to be 994.0 W(m.K) on the other hand, the corresponding values of $Ag_{0.9995}Mg_{0.0005}$, $Ag_{0.974}$, $Au_{0.025}$, $Mg_{0.001}$, $Ab_{0.973}$, $Au_{0.025}$, $Mg_{0.002}$ and $Ag_{0.92}$, $Pb_{0.06}$, $Mg_{0.02}$ were 342.6, 62.1, 59.2 and 28.9 W(m.K), respectively, indicating 3 to 30 times lower than that of pure Ag. In addition, the thermal conductivity of pure Ag measured by direct and indirect measurement techniques was 303.2 and 363.8 W(m.K) The difference in this study is considered to be within an acceptable error range compared to the reference data.

• Journal of Technologic Dentistry
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• v.21 no.1
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• pp.15-26
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• 1999

This study was carried out by observing to composition of oxide on the surface of dental porcelain low gold alloy with various Indium additions according to the degassing and analysing the change composition of additional elements In on diffusion behaviors of Porcelain-matal surface. The specimens used were Au-Pd-Ag alloys by small indium addition. These specimens were treated for 10min at $1000^{\circ}C$ in vacuum condition. To investigate the microsturcture of oxidized alloy surface, SEM and EDAX were used, and EPMA were used to investigate the diffusion behaviors of porcelain-metal surface. X-ray diffraction were used to observe the morphological changes in the oxidation zone. The results of this study were obtained as follows ; 1) The hardness of alloy increased with increasing amount of In addition. 2) The formation of oxidation increased with increasing In content after heat treatment. 3) Diffusion of indium elements increased with increasing In content in metal-porcelain surface after firing. 4) The oxidations of alloy surface were mainly $In_2O_3$.

• Korean Journal of Metals and Materials
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• v.48 no.11
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• pp.1041-1046
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• 2010

The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.