• Title/Summary/Keyword: PcbC

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Effects of PCBs (Polychlorinated Biphenyls) on Energy Budget in Mysid, Neomysis awatschensis I. Acute and Chronic Effects of PCBs on Mysid, Neomysis awatschensis (곤쟁이, Neomysis awatschensis의 에너지수지에 미치는 PCBs의 영향 I. 곤쟁이에 미치는 PCBs의 급성 및 만성영향)

  • CHIN Pyung;SHIN Yun-Kyung;JEON Eun-Mi
    • Korean Journal of Fisheries and Aquatic Sciences
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    • v.31 no.1
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    • pp.95-103
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    • 1998
  • Acute and chronic responses to PCB toxicity of Neomysis awatschensis were studied by measurement of bioassay, growth, oxygen consumption and nitrogen excretion with concentrations of PCB at 10 and $20^{\circ}C$. 96 hr.-$LC_50$ at 10 and $20^{\circ}C$ were 28.7492 pub and 10.6742 pub, respectively. Survival rates during 60 days exposured to chronic PCB concentrations of 0.5 pub, 1.0 pub, 1.5 pub and 2,0 pub at $10^{\circ}C$ were $85\%,\;80\%,\;75\%$ and $75\%$, respectively and suwival rates at $20^{\circ}C$ $85\%,\;75\%,\;75\%$ and $65\%$, respectively. Average daily growth rate of N. awatschensis exposed to chronic PCB concentrations at $10^{\circ}C$ were 0.039 mm/day in control group and 0.036 mm/day at concentration of 2.0 ppb, while their rates at $20^{\circ}C$ showed 0.072 mm/day in central group and 0.039 mm/day at 2,0 ppb. The growth factors were some similarities between the chronic PCB concentrations, but intermolt periods were related to body size of mysids, temperature and PCB toxicity. Changes in oxygen consumption and nitrogen excretion rates during 60 days exposure to PCB toxicity showed higher in high groups of PCB concentrations. Assimilation and feeding rates of N. awatschensis fed Artemia sp. decreased with increase of PCB concentration at 10 and $20^{\circ}C$.

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Reidentification of Comamonas sp. Strain DJ-12 and Analysis of its pcbABC2D2 Genes Responsible for Degradation of 4-Chlorobiphenyl. (Comamonas sp. Strain DJ-12 의 재동정 및 4-Chlorobiphenyl 분해유전자 pcbABC2D2 의 분석)

  • 이준훈;박동우;강철희;채종찬;이동훈;김치경
    • Korean Journal of Microbiology
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    • v.40 no.2
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    • pp.121-126
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    • 2004
  • Comamonas sp. strain DJ-12 is a 4-chlobiphenyl(4CB)-degrading bacterium that was reidentified from Pseudomonas sp. DJ-12. The genomic DNA was isolated from the strain DJ-12 and amplified by PCR with primers for cloning pcbABCD genes responsible for degradation of 4CB. The amino acid sequences deduced from the nucleotide sequences of pcbA1, pcbA2, pcbA3, pcbA4, pcbB, pcbC2, and pcbD2 genes showed 91, 87, 99, 87, 97, 90 and 87% homologies with those of Pseudomonas sp. KKS102, respectively. The pcbC1D1 genes that are involved in the degradation of (4-chloro)1,2-dihydroxybiphenyl produced from 4CB by pcbAB gene products were previously reported in the recombinant plasmid pCU1 from Pseudomonas sp. DJ-12. However, the pcbC2D2 genes in the plasmid pCT4 and pCT5 cloned from Comamonas sp. DJ-12 in this study showed 51 and 62% homologies with those of pcbC1D1 in their nucleotide sequences. The pcbC1D1 and pcbC2D2 genes were found by Southern hybridization to be located at different loci on the chromosome of DJ-12 strain. These results indicate that Comamonas sp. strain DJ-12 has two different sets of pcbCD genes responsible for deg-radation of (4-chloro)1,2-dihydroxybiphenyl.

Characterization of the pcbE Gene Encoding 2-Hydroxypenta-2,4-Dienoate Hydratase in Pseudomonas sp. DJ-12

  • Lim, Jong-Chul;Lee, Jeongrai;Jang, Jeong-Duk;Lim, Jai-Yun;Min, Kyung-Rak;Kim, Chi-Kyung;Kim, Young-Soo
    • Archives of Pharmacal Research
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    • v.23 no.2
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    • pp.187-195
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    • 2000
  • Nucleotide sequence extending 2,3-dihydroxybiphenyl 1,2-dioxygenase gene (pcbC) and 2-hydroxy-6-oxo-6-phenylhexa-2,4-dienoate hydrolase gene (pcbD) of Pseudomonas sp. DJ-12 was previously analyzed and the two genes were present in the order of pcbD-pcbC preceded by a promoter from Pseudomonas sp. DJ-12. In this study, a 3.8-kb nucleotide sequence located downstream of the pcbC gene was analyzed to have three open reading frames (ORFs) that are designated as orf1, pcbE and orf2 genes. All of the ORFs were preceded by each ribosome-binding sequence of 5-GGAXA-3 (X=G or A). However, no promoter-like sequence and transcription terminator sequence were found in the analyzed region, downstream of pcbC gene. Therefore, the gene cluster appeared to be present in the order of pcbD-pcbC-orf1-pcbE-orf2 as an operon, which is unique organization characterized so far in biphenyl- and PCB-degrading bacteria. The orf1 gene was composed of 1,224 base pairs which can encode a polypeptide of molecular weight 44,950 containing 405 amino acid residues. A deduced amino acid sequence of the orf1 gene product exhibited 21-33% identity with those of indole dioxygenase and phenol hydroxylase components. The pcbE gene was composed of 783 base pairs encoding 2-hydroxypenta-2,4-dienoate hydratase involved in the 4-chlorobiphenyl catabolism. The orf2 gene was composed of 1,017 base pairs encoding a polypeptide of molecular weight 37,378 containing 338 amino acid residues. A deduced amino acid sequence of the orf2 gene product exhibited 31% identity with that of a nitrilotriacetate monooxygenase component.

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The removal characteristics of PCB by catalyzed fabric filter (촉매 처리된 여과재에 의한 PCB 처리특성)

  • Kim, Moon-Chan
    • Analytical Science and Technology
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    • v.21 no.3
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    • pp.167-173
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    • 2008
  • In order to solve the reproduction problem of PCB, we carried out poly chlorinated biphenyl (PCB) removal at low temperature (< $220^{\circ}C$), which could not take place reproduction of PCB by over 90% on catalyst. We coated catalyst to commercial bag filter for simultaneous removal of PCB and particle. It was found that PCB could be not reproducible due to it's decomposition of benzene ring. The coating method of spray type was more useful than that of precipitation one. PCB removal conversion was highest on the Pt-Co catalyzed bag filter. The data of this study can be well used in order to remove PCB and particle simultaneously for incinerator process by substituting commercial bag filter to catalyzed bag filter.

Temperature Analysis of LED Module which used Metal PCB (Metal PCB를 이용한 LED Module 열 해석)

  • Choi, Keum-Yeon;Eo, Ik-Soo;Suh, Eui-Suk
    • Proceedings of the KIEE Conference
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    • 2009.07a
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    • pp.1605_1606
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    • 2009
  • 본 논문은 LED조명기구 방열설계의 열해석에 관한 것으로서 메탈 PCB에 Chip LED를 배치하여 COMSOL Multiphysics로 시뮬레이션한 결과 LED와 PCB의 경계면 온도는 약 $80^{\circ}C$이며, PCB의 바닥면까지는 약 $50^{\circ}C$까지 변화함을 검증 하였으며, 결과적으로 실 제작의 근사치에 가까운 방열설계가 가능함이 확인되었다.

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Analysis of LED Package Properties by PCB Material and Via-hole Construction (PCB 재질 및 Via hole 구성에 따른 LED 패키지의 특성 분석)

  • Lee, Se-Il;Yang, Jong-Kyung;Kim, Sung-Hyun;Lee, Seung-Min;Park, Dae-Hee
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.59 no.11
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    • pp.2038-2042
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    • 2010
  • In this paper, we confirmed the thermal & optical properties for improving the heat transfer coefficient by changing the via hole size and in FR4 PCB with the same area. Osram 1W power LED Package (Golden Dragon) was used and the K-factor which is relative constant between LED junction temperature and forward bias was measured with power source meter(KEITHLEY 2430) to measure the thermal resistance from PCB configuration. As results, thermal resistance in metal PCB came out to the lowest as $26 [^{\circ}C/W]$ and thermal resistance in FR4 PCB without via-holes emerged as the highest as $69 [^{\circ}C/W]$. However thermal resistance of FR4 PCB could have decreased until $32[^{\circ}C/W]$ in 0.6 mm by using the via hole. Also, the luminous flux could have improved, too.

Study on the overcurrent detection and blocking method of SiC MOSFET using the PCB pattern Rogowski coil (PCB패턴 Rogowski 코일을 이용한 SiC MOSFET의 과전류 검출 및 차단 기법에 관한 연구)

  • Yoon, Hanjong;Cho, Younghoon
    • Proceedings of the KIPE Conference
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    • 2018.11a
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    • pp.92-94
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    • 2018
  • 본 논문은 SiC MOSFET 디바이스를 사용하는 전력변환장치에서 Rogowski 코일을 이용하여 SiC MOSFET 디바이스에 흐르는 전류를 측정하여, 과전류를 검출하고 게이팅 신호를 차단하는 기법에 관하여 연구한다. SiC MOSFET는 소자의 특성으로 보편적으로 사용되는 과전류 검출 방법인 DeSAT 적용이 어렵기 때문에 Rogowski 코일을 사용하여 스위치 전류를 측정, 과전류를 검출한다. 본 논문에서는 PCB패턴 Rogowski 코일의 설계 방법뿐만 아니라 Rogowski 코일과 적분기의 대역폭에 대해서도 논의한다. 실험은 직류링크 커패시터에 SiC MOSFET 스위치 레그를 병렬로 연결하고, 직류링크 커패시터에 직류전압을 충전 후 스위치 레그를 약 6us정도 단락시켜 SiC MOSFET에 과전류를 발생시킨다. 이 때, 제안한 Rogowski 코일을 이용한 과전류 검출 및 차단 기법의 적용 전후를 비교하여 동작 및 성능(검출 및 차단 소요시간)을 확인한다. 마지막으로 실험 결과를 통해 본 논문에서 제안한 PCB패턴 Rogowski 코일을 이용하여 과전류 검출 및 차단 기법이 검증되었다.

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Chlorination of ortho-position on Polychlorinated Biphenyls Increases Protein Kinase C Activity in Neuronal Cells

  • Lee, Youn-Ju;Yang, Jae-Ho
    • Toxicological Research
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    • v.28 no.2
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    • pp.107-112
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    • 2012
  • Polychlorinated biphenyls (PCBs) are persistent and bioaccumulative environmental pollutants. Recently, it is suggested that neurotoxic effects such as motor dysfunction and impairment in memory and learning have been associated with PCB exposure. However, structure relationship of PCB congeners with neurotoxic effects remains unknown. Since PKC signaling pathway is implicated in the modulation of motor behavior as well as learning and memory and the role of PKC are subspecies-specific, we attempted to study the effects of structurally distinct PCBs on the total PKC activity as well as subspecies of PKC in cerebellar granule cell culture model. Cells were exposed to 0, 25 and 50 ${\mu}M$ of PCB-126, PCB-169, PCB-114, PCB-157, PCB-52 and PCB-4 for 15 min. Cells were subsequently analyzed by [$^3H$] phorbol ester binding assay or immunoblotted against PKC-${\alpha}$ and -${\varepsilon}$ monoclonal antibodies. While non-dioxin-like-PCB (PCB-52 and PCB-4) induced a translocation of PKC-${\alpha}$ and -${\varepsilon}$ from cytosol to membrane fraction, dioxin-like PCBs (PCB-126, -169, -114, -157) had no effects. [$^3H$] Phorbol ester binding assay also revealed structure-dependent increase similar to translocation of PKC isozymes. While PCB-4 induced translocation of PKC-${\alpha}$ and -${\varepsilon}$ was inhibited by ROS inhibitor, the pattern of translocation was not affected in presence of AhR inhibitor. It is suggested that PCB-4-induced PKC activity may not be mediated via AhR-dependent pathway. Taken together, our findings suggest that chlorination of ortho-position in PCB may be a critical structural moiety associated with neurotoxic effects, which may be preferentially mediated via non-AhR-dependent pathway. Therefore, the present study may contribute to understanding the neurotoxic mechanism of PCBs as well as providing a basis for establishing a better neurotoxic assessment.

Development of Miniature Quad SAW Filter Bank based on PCB Substrate

  • Lee, Young-Jin;Kim, Chang-Il;Paik, Jong-Hoo
    • Transactions on Electrical and Electronic Materials
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    • v.9 no.1
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    • pp.33-37
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    • 2008
  • This paper describes the development of a new $5.0{\times}3.2mm$ SAW filter bank which is consist of 12 L, C matching components and 4 SAW bare chips on PCB substrate with CSP technology. We improved the manufacturing cost by removing the ceramic package through direct flip bonding of $LiTaO_3$ SAW bare chip on PCB board after mounting L, C passive element on PCB board. After that we realized the hermitic sealing by laminating the epoxy film. To confirm the confidentiality and durability of the above method, we have obtained the optimum flip bonding & film laminating condition, and figured out material property and structure to secure the durability & moisture proof of PCB board. The newly developed super mini $5.0{\times}3.2mm$ filter bank shows the superior features than those of existing products in confidence, electrical, mechanical characters.

Study on Low Temperature Bonding Technology for Optical PCB with Polymer Intermediate Layers (광PCB를 위한 폴리머 저온 접합기술 연구)

  • Cha, Doo-Yeol;Lee, Jai-Hyuk;Chang, Sung-Pil
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.1
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    • pp.29-33
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    • 2010
  • As the demands for the higher data transmission speed and capacity as well as integration density grow throughout the network, much works have being done in order to integrate the Electrical PCB with Optical PCB. However, one of the most troublesome problems in the commercial bonding process is to need the high temperature for the bonding. Due to the high temperature bonding process, lots of side problems are followed such as warpage and crack, etc. In this paper, we tried to develop the new bonding technology with low temperature around $100^{\circ}C$. As a result of this study, the PCB bonding technology with high bonding strength is demonstrated with the value of bonding strength from 7 to 8 MPa at the temperature of $100^{\circ}C$.