• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.43-47
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• 2001

Sn-3Ag-8Bi-5In was developed for the intermediate melting point solder. Although In-contained solder is expensive, its melting point is lower than these of Sn-Ag-Cu alloys. Sn-3Ag-8Bi-5In solder used for this research has a melting range of 188~$204^{\circ}C$. On this study wetting characteristics of Sn-3Ag-8Bi-5In were evaluated in order to investigate its availability as a Pb-free solder. Wettabilities of Sn-37Pb and Sn-3.5Ag solders were also studied to compare these of the Sn-3Ag-8Bi-5In. Experimental results showed that the zero-cross-time and wetting time at $240^{\circ}C$ for the Sn-3Ag-8Bi-5In were 1.1 and 2.2 second respectively. These values are a little better than these of Sn-37Pb and Sn-3.5Ag solders. The equilibrium wetting farce of the Sn-3Ag-8Bi-5In was 5.8 mN at $240^{\circ}C$, and it was tuned out to be a little higher than that of Sn-3.5Ag and lower than that of Sn-37Pb.

• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.2
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• pp.584-595
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• 1991

In the direct rolling processes for the mushy state alloy, a mushy state material which simultaneously contains liquid-solid phase is obtained from the exit port of stirring apparatus with a given solid fraction. This solid fraction is dependent on the temperature of within the solid-liquid range which shows to be controlled accurately by the experimental conditions for a given stirring apparatus. Rolling conditions for fabrication the fine surface strip were obtained from direct rolling experiment with mushy state alloys of Sn-75%Pb and aluminum alloy. Influence of solid fraction, rolling speed and initial roller gap on the state of strip surface and solidified structure was observed. We proposed theoretical model for prediction of rolling force, and we compared calculation result and experimental value measured with load cell.

• 보존과학연구
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• s.23
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• pp.149-162
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• 2002

Gilt bronze locks(Treasure No. 1141) excavated from Hancheonsa temple are artifacts of Goryeo Dynasty. The locks underwent a conservation process from October 2001 to July 2002. The process included cleaning and the application of corrosion inhibitors, Benzotriazolesolution, as well as reinforcement treatment with Paraloid NAD-10 solution,an acrylic resin. Non-destructive XRF analysis unveil that the artifacts are made of an alloy of copper(Cu), tin(Sn) and lead(Pb), but the gilt layer is too thin to analyze the purity of the gold or the exact production method. Gilt bronze locks are important materials because they preserve all the structures of locks in Goryeo Dynasty to the smallest detail. The surface pattern is revealed through the conservation process and components of the alloy through material analysis.

• Journal of Korea Foundry Society
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• v.21 no.4
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• pp.239-245
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• 2001

Microstructure and mechanical properties of Sn-3.1 wt.%Ag-6.9 wt.%Bi system solders on Cu-substrate were studied. The Sn3.1 wt.%Ag-6.9 wt.%Bi alloy was designed by phase diagram and chemical properties and was prepared by melting in argon atmosphere. The mechanical properties of solder/Cu joints were examined by shear strength test, and also creep test. The microstructure of Sn-3.1 wt.%Ag-6.9 wt.%Bi alloy consists of Bi-rich phase and $Ag_3Sn$ precipitate in {\beta}-Sn$ matrix phase. The shear strength of the joint was decreased with aging treatment. Crack path under shear test was through the solder. Similar crack path change mode was observed at the creep test of solder/Cu joint. The creep behavior of Sn-3.1 wt.%Ag-6.9 wt.%Bi alloy represented the inverse primary creep behavior at all test condition. It is suggested that the inverse primary creep behavior is induced from Bi solute atoms in Sn-matrix. The creep resistance of Sn-3.1Ag-6.9Bi alloy is better than that of Sn-3.5 wt.%Ag alloy at all test conditions.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.155-156
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• 2015

최근 자동차 및 항공기의 경량화 관련하여 알루미늄 합금의 필요성이 높아지고 있으나, 자동차재료에 쓰이는 알리미늄 합금의 경우 높은 이온화 경향 때문에 Fe, Cu, Pb 등과 접촉하면 쉽게 부식되는 단점이 있다. 본 연구에서는 기존의 Magsimal-59 샘플과 본 연구에서 개발한 고용질, 저용질 Duplex 알루미늄 합금과의 내식성을 분극 및 갈바닉을 통해 확인하고, 균질화처리를 통해 내식성을 개선한다.

• Corrosion Science and Technology
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• v.6 no.6
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• pp.282-285
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.51-57
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• 2008

In this paper, wetting and interfacial reaction properties for low Ag containing Sn-Ag-Cu Pb-free solder alloy, i.e., Sn-0.3Ag-0.7Cu were investigated and compared with those of Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu. Melting behavior and stress-strain curves of some Sn-xAg-xCu alloys were also measured using a differential scanning calorimeter(DSC) and a tensile test machine, respectively. In order to enhance insufficient wetting properties of Sn-0.3Ag-0.7Cu alloy, the improvement of wetting properties were analyzed by applying fluxes containing higher content of halide or indium adding of 0.2wt.% into the solder alloy. It was concluded that the small addition of indium is more effective for the improvement of wettability in low temperature range of $230{\sim}240^{\circ}C$ than applying flux containing higher content of halide.

• The Journal of Korean Academy of Prosthodontics
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• v.36 no.3
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• pp.514-523
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• 1998

The purpose of this study was to compare the wear characteristics of Type III Gold Alloy (Degular C : Degussa AG), VMK 95 (Vita Zahnfabrik), Vitadur Alpha (Vita Zahnfabrik), IPS Empress (Ivoclar-Vivadent) and Targis (Ivoclar- Vivadent). Ten samples of each material were abraded against enamel of extracted incisors for 160,000 cycles on the wear machine. The depth of wear scars on enamel was analized with profilometer (Alpha-step 200;Tencor). And the wear of material specimen was determined with micrometer (PB-IB;Mitutoyo Co. Japan). The results obtained were as follows : 1. Type III gold alloy ($2.47{\mu}m$) and Targis ($5.89{\mu}m$) caused less wear of enamel specimens compared to VMK 95 ($75.59{\mu}m$), IPS Empress ($78.60{\mu}m$) and Vitadur Alpha ($78.89{\mu}m$) (p<0.05). 2. The wear of material specimen when opposing enamel was the lowest in type III gold alloy ($3.0{\mu}m$), followed by Targis ($69.8{\mu}m$), IPS Empress ($148.4{\mu}m$). VMK 95 ($298.0{\mu}m$) and Vitadur Alpha ($300.8{\mu}m$ exhibited the most severe wear against enamel (p<0.05).

• Journal of Conservation Science
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• v.36 no.4
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• pp.296-305
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• 2020

Konbaung Dynasty was the last unified dynasty that ruled Myanmar from 18^th to 19^th century. During this time Buddhist art flourished in Myanmar due to the interest of the rulers toward their traditional culture. Metal decorative artifacts in the 18^th century are classified into structures and Buddha statues. They are further subdivided into gilt-bronze and bronze objects, depending on their material component. Three-dimensional gilt-bronze decorative artifacts were cast with a brass alloy of Cu-Zn-Sn-Pb and their surfaces were gilded with extremely thin gold leaves (less than 1 ㎛ in thickness). The gilded layer approximately comprised 10 wt% silver in addition to the main element, gold. The lack of Hg in the gilded layer, indicated that the amalgam gilding technique was not applied. The analysis results indicated that the lacquered gilding technique was applied to the objects. Bronze decorative artifacts without gilding were cast with materials containing Cu-Sn-Pb. The bronze pavilions and bronze Buddha staues were crafted using the same alloy of high-tin bronze, which approximately contained 20 wt% Sn. No heat treatment was applied to reduce the brittleness of the objects after they were cast with a large amount of Sn. The most significant difference between the gilt-bronze and bronze decorative artifacts lie in their elemental compositions. The gilt-bronze decorative artifacts with their gilded surface were manufactured using brass containing zinc, while the unplated bronze decorative artifacts were composed of bronze containing tin. Artifacts of the same type and size are classified differently depending on the materials utilized in the surface treatment such as gilding.

• Journal of Welding and Joining
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• v.25 no.3
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• pp.57-63
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• 2007

Electrochemical migration characteristics of Pb-free solder alloys are quantitatively correlated with corrosion characteristics in harsh environment conditions. In-situ water drop test and corrosion resistance test for Sn-3.0Ag-0.5Cu solder alloys were carried out in NaBr and NaF solutions to obtain the electrochemical migration lifetime and pitting potential, respectively. Sn-3.0Ag-0.5Cu solder alloy shows similar ionization and electrochemical migration behavior with pure Sn because of Ag and Cu do not migrate due to the formation of resistant intermetallic compounds inside solder itself. Electrochemical migration lifetime in NaBr is longer than in NaF, which seems to be closely related to higher pitting potential in NaBr than NaF solution. Therefore, it was revealed that electrochemical migration lifetime of Sn-3.0Ag-0.5Cu solder alloys showed good correlation to the corrosion resistance, and also the initial ionization step at anode side is believed to be the rate-determining step during electrochemical migration of Pb-free solders in these environments.