• 한국재료학회지
• /
• 제4권3호
• /
• pp.334-338
• /
• 1994

Pb-Sn eutectic bulk specimens을 thermal cycling동안 electronic package의 땜납이 격게되는 변형 조건 즉 $10^{-3}-10^{-5}$/s정도의 낮은 frequency와 0.2-1%정도의 적당한 strain range에서 피로파괴 실험을 했을때, grain boundary sliding과 관련하여 임계면을 따라 일어나는 균열이 5단계에 의해 묘사될 수 있다는 것을 보였음.

• 자원리싸이클링
• /
• 제14권1호
• /
• pp.17-25
• /
• 2005

폐전자스크랩으로부터 미생물 침출법에 의해 유가금속을 회수하기 위한 기초 연구로 Thiobacillus ferrooxidans를 이용하여 Cu, Zn, Al, Co, Ni, Sn 및 Pb의 침출 거동을 조사하였다. 예비실험으로 각 금속의 침출 거동을 조사하기 위해 먼저 폐전자스크랩 대신 각 금속분말을 이용하여 침출 실험을 실시하였는데, 금속분말의 양이 증가함에 따라 츰출율을 감소하는 경향을 보였으며 각각의 금속분말의 농도가 5 g/L이하에서 Cu, Co 및 Zn의 경우 85%이상의 침출율을 나타내었다. 한편 폐전자스크랩을 이용한 침출실험 결과 고액농도가 100 g/L에서 Cu, Co의 경우는 90%이상의 침출율을 보이고 있으나 Al, Zn 및 Ni의 경우는 40%이하의 침출율을 나타내었다. Pb의 경우는 PbSO$_4$ 형태로 Sn의 경우는 SnO 형태로 침전되어 침출액중으로는 거의 용출되지 않았다.

• 마이크로전자및패키징학회지
• /
• 제9권4호
• /
• pp.1-9
• /
• 2002

Ball grid array (BGA) substrate 상의 0.5 $\mu\textrm{m}$Au/5 $\mu\textrm{m}$Ni/Cu 층으로 구성된 접촉 패드(pad)와 In-15(wt.%)Pb-5Ag 솔더 볼 사이에서 리플로우 및 고상 시효동안 일어나는 금속학적 반응 특성이 조사되었다. 1-5 분의 리플로우 시간에 따라 솔더/패드 계면에서 $AuIn_2$ 또는 Ni-In 금속간 화합물층이 형성됨이 관찰되었다. 리플로우 동안 용융 In-l5Pb-5Ag 솔더 내로의 Au 층의 용해 속도는 $2\times 10^{-3}$ $\mu\textrm{m}$/sec 정도로 측정되어 공정 Sn-37Pb와 비교하여 매우 느린 것으로 관찰되었다. $130^{\circ}C$에서 500시간의 고상 시효 후에는 초기 리플로우 시간에 관계없이 $Ni_{28}In_{72}$ 금속간 화합물층이 약 3 $\mu\textrm{m}$까지 성장하였다. 이를 통하여 솔더 합금에서의 In 원자들은 아래의 Ni 층과 반응하기 위하여 리플로우 동안 형성된 $AuIn_2$상을 통하여 확산하는 것으로 관찰되었다. 미세구조 관찰과 전단 시험을 통하여 In-l5Pb-5Ag합금의 경우는 Sn-37Pb 조성과는 달리 Au/Ni surface finish 상에 사용시에도 솔더 접합부에서의 Au-embrittlement를 야기 시키지 않는 것으로 분석되었다.

• 한국재료학회지
• /
• 제12권5호
• /
• pp.347-352
• /
• 2002

A transparent dielectric of the $PbO-B_2O_3-SiO_2-A1_2O_3$ system which was a low melting glass has been used for PDP (Plasma Display Panel), but it has a problem which is a reaction to be occurred between a transparent dielectric layer and electrodes (Ag, ITO) after firing. This research was conducted for ion migration of $Ag^+\$ and $Sn^ {2+}$ during firing three different frits of low melting glass. The result showed that yellowing phenomena occurred through a chemical reaction between $Ag^+\$and $Sn^ {2+}$ at 550~58$0^{\circ}C$ for 20~60 min. In addition, it was confirmed that the migration of $Sn^{2+}$ from ITO electrode made a strong effect on the yellowing phenomena.

• 한국자동차공학회논문집
• /
• 제22권3호
• /
• pp.90-96
• /
• 2014

The conventional SnPb solders were widely used for several decades in the electronic packing system due to the superior mechanical properties such as low melting point, better wettavility and good mechanical fatigue. However, in recent years, owing to adverse effect on the human health and environment, conventional SnPb solders have been replaced by Lead-free solders. In this research, the shear punch(SP) test of Sn-4Ag-(Cu)/Ni pad was performed. Pb-free solder alloys which are the environmentally friendly of the electronic components were performed at $150^{\circ}C$ for 100hr~1000hr to artificial aging processing. In order to evaluate the mechanical properties of solder joints, the SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of almost the whole specimens was decreased with the increase in aging time and temperature of SP test. The mechanical properties of Sn-4Ag-0.5Cu solder were most excellent in all Pb-free solder which were produced by the SP test at $30^{\circ}C$.

• 한국재료학회지
• /
• 제15권8호
• /
• pp.528-535
• /
• 2005

It is inclined to increase that use of hazardous substances such as lead(Pb), mercury (Hg), cadmium(Cd) etc. are prohibited in the electronics according to environmental friendly policies of an advanced nation for protecting environment of earth. As this reasons, many researches for ensuring the reliability were proceeding in Pb free soldering process. n the flux remains on the PCB(printed circuit board) in the soldering process or the electronics exposed to corrosive environment, it becomes the reasons of breakdown or malfunction of the electronics caused by corrosion. Therefore in this studies we researched the polarization and Tafel properties of Sn40Pb and SnCu system solders based on the electrochemical theory. The experimental polarization curves were measured in distilled ionized water and 1 mole $3.5 wt\%$ NaCl electrolyte of $40^{\circ}C$, pH 7.5. Ag/AgCl and graphite were utilized by reference and counter electrodes, respectively. To observe the electrochemical reaction, polarization test was conducted from -250mV to +250mV. From the polarization curves composed of anodic and cathodic curves, we obtained Tafel slop, reversible electrode potential(Ecorr) and exchange current density((cow). In these results, we compared the corrosion rate of SnPb and SnCu solders.

• Journal of Welding and Joining
• /
• 제15권2호
• /
• pp.36-42
• /
• 1997

In this paper, stability of initial strength at solder joint with lead free solders, such as Sn-In (52-48%) and Sn-Ag (96.5-3.5wt%) was studied. To obtain at solder joint with high quality, it is very important to control the temperature at the interface of solder joints. It is found that the thermal EMF (electro motive force) occurs betwee lead frame and copper pad on a substrate during reflow soldering process using heated tip. As a result of control the temperature at interface of solder joints, variation of initial strength at solder joint decreases from about $\pm40%$ to $\pm20%$, and it is realized Pb free soldering process using Sn/In and Sn-Ag solder paste.

• Journal of Welding and Joining
• /
• 제32권6호
• /
• pp.75-81
• /
• 2014

Usage of heavy metal element (Pb, Hg and Cd etc.) in electronic devices have been restricted due to the environmental banning of the European Union, such as WEEE and RoHS. Therefore, it is needed to develop the Pb-free solder plated ribbon in photovoltaic (PV) module. This study described that degradation characteristics of PV module under damp heat (DH, $85^{\circ}C$ and 85% R.H.) condition test for 1,000 h. Solar cell ribbons were utilized to hot dipping plate with Pb-free solder alloys. Two types of Pb-free solder plated ribbons, Sn-3.0Ag-0.5Cu (SAC305) and Sn-48Bi-2Ag, and an electroless Sn-40Pb solder hot dipping plated ribbon as a reference sample were prepared to evaluate degradation characteristics. To detect the degradation of PV module with the eutectic and Pb-free solder plated ribbons, I-V curve, electro-luminescence (EL) and cross-sectional SEM analysis were carried out. DH test results show that the reason of maximum power (Pm) drop was mainly due to the decrease fill factor (FF). It was attributed to the crack or oxidation of interface between the cell and the ribbon. Among PV modules with the eutectic and Pb-free solder plated ribbon, the PV module with SAC305 ribbon relatively showed higher stability after DH test than the case of PV module with Sn-40Pb and Sn-48Bi-2Ag solder plated ribbons.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1987년도 정기총회 및 창립40주년기념 학술대회 학회본부
• /
• pp.187-190
• /
• 1987

This paper is for the charge storage effect and C-V characteristics of MIS type diode which is the basic structural unit of charge-coupled device after growing the $Pb_{1-x}Sn_xTe$ crystal. $Pb_{1-x}Sn_xTe$ singlecrystal dbtained from the horizental furnace using Bridgman method. To judge whether the grown singlecrystal is suitable for specimen or not, it was investigated by X-ray diffraction analysis, thermogravimetry and differential thermal analysis. The C-V characteristics of the specimen caused to anodic oxidation was the best when the insulator film's depth was 250[$\AA$]. Measuring the C-V characteristics aftermanufacturing MIS type diode resulted that the whole capacitance was the largest when the supply voltage was low, 0.3[V] and the capacitance also varied according to the variance frequence when the supply voltage is over 0.5[V]. From the above result, even if the supply voltage is low, the $Pb_{1-x}Sn_xTe$ also have a good charge storage effect.

• 한국결정성장학회지
• /
• 제27권2호
• /
• pp.94-98
• /
• 2017

최근 수년 동안 Sn-3.0Ag-0.5Cu(weight%) 조성의 합금은 주요 전자 제조업체들의 대표 무연솔더 조성으로 다양한 전자제품의 제작에 적용되어 왔다. 그러나 최근 Ag 가격의 급격한 상승과 전자산업의 저가격화 전략으로 인해 솔더 재료에서의 Ag 함량의 감소가 지속적으로 요구되고 있다. 본 연구에서는 Sn-3.0Ag-0.5Cu 조성의 무연솔더를 주석, 은 및 구리 금속분말의 용융을 이용하여 합금화 하였다. 제조한 Sn-3.0Ag-0.5Cu 샘플에 대한 결정구조 및 미세구조를 XRD, 광학현미경, FE-SEM 및 EDS 분석을 이용하여 검토하였다. 분석결과, 제조된 Sn-3.0Ag-0.5Cu 샘플은 ${\beta}-Sn$, ${\varepsilon}-Ag_3Sn$ 및 ${\eta}-Cu_6Sn_5$ 결정으로 구성되어 있었다.