• 폴리머
• /
• 제37권5호
• /
• pp.656-662
• /
• 2013

태양전지의 효율 증가를 위하여 유리비드가 함유된 polymethyl methacrylate(PMMA) 용액을 PMMA 필름 위에 코팅하여 유리비드가 코팅된 고분자 유연 패턴 필름을 제조하고 패턴 필름이 태양전지 효율에 미치는 영향을 살펴보았다. 필름 위에 코팅된 유리비드로 인하여 빛의 입사각 0도에서 90도 범위에서 태양전지의 상대효율이 최대 3.4%까지 증가함을 알 수 있었다. 이러한 효율 증가는 빛의 입사각 변화에도 필름 표면에 형성되어 있는 구 형태의 유리비드로 인하여 빛이 수직으로 입사되어 방향성에 의한 태양전지 효율 감소가 최소화되기 때문이다. 태양전지상대효율 증가는 필름 표면 위의 유리비드가 반구의 형태를 가질 때 가장 높으며 유리비드 함량에 따라 증가되나 유리비드 함량이 너무 많은 경우, 오히려 광 투과도 감소 및 빛의 간섭 효과에 의하여 상대효율이 감소됨을 알 수 있었다.

• 한국광학회지
• /
• 제20권5호
• /
• pp.281-287
• /
• 2009

편광법을 사용하여 패턴이 있는 LCD 유리기층위에 놓여 있는 러빙된 PI(polyimide)의 광학이방성을 분석하였다. 투과형 편광계를 사용하여 0.4 nm 이하의 극히 작은 위상지연의 크기와 광축의 방향을 정밀하게 측정하였다. 온도에 따르는 광학이방성의 미세변화를 위상지연의 크기 및 광축 방향의 변화곡선으로 나타내고 간단한 광학모델을 사용하여 설명하였다.

• Journal of Electrical Engineering and Technology
• /
• 제4권4호
• /
• pp.546-551
• /
• 2009

In this paper, we describe a self-aligned fabrication method for a nano-patterned bottom electrode using flood exposure from the backside. Misalignments between layers could cause the final devices to fail after the fabrication of the nano-scale bottom electrodes. A self-alignment was exploited to embed the bottom electrode inside the glass substrate. Aluminum patterns act as a dry etching mask to fabricate glass trenches as well as a self-aligned photomask during the flood exposure from the backside. The patterned photoresist (PR) has a negative sidewall slope using the flood exposure. The sidewall slopes of the glass trench and the patterned PR were $54.00^{\circ}$ and $63.47^{\circ}$, respectively. The negative sidewall enables an embedment of a gold layer inside $0.7{\mu}m$ wide glass trenches. Gold residues on the trench edges were removed by the additional flood exposure with wet etching. The sidewall slopes of the patterned PR are related to the slopes of the glass trenches. Nano-scale bottom electrodes inside the glass trenches will be used in beam resonators operating at high resonant frequencies.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2000년도 하계학술대회 논문집
• /
• pp.663-666
• /
• 2000

Laser direct writing of micro-patterned copper lines has been achieved by pyrolytic decomposition of copper formate films (Cu(HCOO)$_2$$.$4H$_2$O), as a precursor, using a focused Ar$\^$+/ laser beam ($\lambda$= 514 nm) on PCB boards and glass substrates. The linewidth and thickness of the lines were investigated as a function of laser power and scan speed. The profiles of the lines were measured by scanning electron microscope (SEM), surface profiler (${\alpha}$-step) and atomic force microscopy (AFM). The electrical resistivities of the patterned lines were also investigated as a function of laser parameter using probe station and semiconductor analyzer. we compared resistivities of the patterned lines with that of the Cu bulk, respectively.

• 한국전기전자재료학회논문지
• /
• 제13권11호
• /
• pp.969-975
• /
• 2000

Laser direct writing of micro-patterned copper lines has been achieved by pyrolytic decomposition of copper formate films (Cu(HCOO)$_2$.4$H_2O$), as a metallo-organic precursor, using a focused CW Ar$^{+}$ laser beam (λ=514nm) on PCB boards and glass substrates. The linewidth and thickness of the lines wee investigated as a functin of laser power and scan speed. The profiles of the lines were measured by scanning electron microscope (SEM), surface profiler ($\alpha$-step) and atomic force measured by scanning electron microscope (SEM), surface profiler ($\alpha$-step) and atomic force microscopy (AFM). The electrical resistivities of the patterned lines were also investigated as a function of laser parameters using probe station and semiconductor analyzer. We compared resistivities of the patterned copper lines with these of the Cu bulk. Resistivities decreased due to changes in morphology and porosity of the deposit, which were about 3.8 $\mu$$\Omega$cm and 12$\mu$$\Omega$cm on PCB and glass substrates after annealing at 30$0^{\circ}C$ for 5 minutes.s.

• 한국진공학회지
• /
• 제21권1호
• /
• pp.55-61
• /
• 2012

본 연구에서는 주기적인 3차원 패턴이 형성된 유리기판을 사용하여 비정질 실리콘 박막 태양전지를 제작하였다. 주기적인 패턴은 일반적인 전도성 투명 산화막(TCO: Trasparent Conductive Oxide) 표면의 불규칙 패턴과 비교하여 더 효율적인 광포획을 가능하게 한다. 태양전지 제작 전 광특성 전산모사를 통하여 주기적인 패턴 유리 기판의 광학적 특성을 알아보았다. 비정질 실리콘 박막 태양전지의 제작은 PECVD를 이용하여 구면 패턴이 형성된 유리기판을 이용하여 제작되었으며, 인공 태양광 조사장치를 이용하여 제작된 태양전지의 성능 평가를 진행하였다. 태양전지 전산모사 결과와 실험 결과들을 비교 분석하여 주기적인 패턴 유리 기판을 이용한 비정질 실리콘 박막 태양전지의 효율향상 가능성을 확인하였다.

• 센서학회지
• /
• 제16권5호
• /
• pp.325-330
• /
• 2007

For the application to optic devices, wafer level package including spacer with particular thickness according to optical design could be required. In these cases, the uniformity of spacer thickness is important for bonding strength and optical performance. Packaging process has to be performed at low temperature in order to prevent damage to devices fabricated before packaging. And if photosensitive material is used as spacer layer, size and shape of pattern and thickness of spacer can be easily controlled. This paper presents polymer bonding using thick, uniform and patterned spacing layer of SU-8 2100 photoresist for wafer level package. SU-8, negative photoresist, can be coated uniformly by spin coater and it is cured at $95^{\circ}C$ and bonded well near the temperature. It can be bonded to silicon well, patterned with high aspect ratio and easy to form thick layer due to its high viscosity. It is also mechanically strong, chemically resistive and thermally stable. But adhesion of SU-8 to glass is poor, and in the case of forming thick layer, SU-8 layer leans from the perpendicular due to imbalance to gravity. To solve leaning problem, the wafer rotating system was introduced. Imbalance to gravity of thick layer was cancelled out through rotating wafer during curing time. And depositing additional layer of gold onto glass could improve adhesion strength of SU-8 to glass. Conclusively, we established the coating condition for forming patterned SU-8 layer with $400{\mu}m$ of thickness and 3.25 % of uniformity through single coating. Also we improved tensile strength from hundreds kPa to maximum 9.43 MPa through depositing gold layer onto glass substrate.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2004년도 추계학술대회논문집
• /
• pp.294-297
• /
• 2004

RTP(Rapid Thermal Pressing) is to fabricate desired pattern on polymer substrate by pressing patterned mold against the substrate heated around glass transition temperature. For a successful RTP process, the whole process including heating, molding, cooling and demolding should be conducted 'rapidly' as possible. As the RTP process is effective in replicating patterns on flat large surface without causing shape distortion after cooling, it is being widely used for fabricating various micro/bio application components, especially with channel-type microstructures on surface. This investigation finally aims to develop a RTP process machine for mass-producing micro/bio application components. As a first step for that purpose, we intended to examine the technological difficulties for realizing mass production by RTP process. Therefore, in the current paper, 4 kinds of RTP machines were examined and then the RTP process was conducted experimentally for PMMA film by using one of the machines, HEX 03. The micro-patterned molds used for RTP experiment was fabricated from silicon wafer by semi-conduct process. The replicated micro patterns on PMMA films were examined using SEM and the causes of defect observed in the replicated patterns were discussed.

• 한국생물공학회:학술대회논문집
• /
• 한국생물공학회 2000년도 추계학술발표대회 및 bio-venture fair
• /
• pp.709-710
• /
• 2000

유전자센서 기술은 biomedical analysis를 위해 일반적으로 고체 상에 고정화된 DNA 분자를 이용한다. 이 센서의 검출능력은 주로 capture probe의 서열뿐만 아니라 oligonucleotide의 고체 상에 고정화 방법에 달려있다. 본 연구에서는 glass 표면에 DNA 분자를 고정화시키는 두 가지 다른 방법을 비교하였고 유전자센서의 구성에 대해 검토하였다.

• 한국광학회:학술대회논문집
• /
• 한국광학회 2009년도 창립 20주년기념 특별학술발표회
• /
• pp.18-19
• /
• 2009