• Title/Summary/Keyword: Patterned chemical surface

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Vertically-Aligned Nanowire Arrays for Cellular Interfaces

  • Kim, Seong-Min;Lee, Se-Yeong;Gang, Dong-Hui;Yun, Myeong-Han
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.90.2-90.2
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    • 2013
  • Vertically-aligned silicon nanostructure arrays (SNAs) have been drawing much attention due to their useful electrical properties, large surface area, and quantum confinement effect. SNAs are typically fabricated by chemical vapor deposition, reactive ion etching, or wet chemical etching. Recently, metal-assisted chemical etching process, which is relatively simple and cost-effective, in combination with nanosphere lithography was recently demonstrated for vertical SNA fabrication with controlled SNA diameters, lengths, and densities. However, this method exhibits limitations in terms of large-area preparation of unperiodic nanostructures and SNA geometry tuning independent of inter-structure separation. In this work, we introduced the layerby- layer deposition of polyelectrolytes for holding uniformly dispersed polystyrene beads as mask and demonstrated the fabrication of well-dispersed vertical SNAs with controlled geometric parameters on large substrates. Additionally, we present a new means of building in vitro neuronal networks using vertical nanowire arrays. Primary culture of rat hippocampal neurons were deposited on the bare and conducting polymer-coated SNAs and maintained for several weeks while their viability remains for several weeks. Combined with the recently-developed transfection method via nanowire internalization, the patterned vertical nanostructures will contribute to understanding how synaptic connectivity and site-specific perturbation will affect global neuronal network function in an extant in vitro neuronal circuit.

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Nanowire Patterning for Biomedical Applications

  • Yun, Young-Sik;Lee, Jun-Young;Yeo, Jong-Souk
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.382-382
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    • 2012
  • Nanostructures have a larger surface/volume ratio as well as unique mechanical, physical, chemical properties compared to existing bulk materials. Materials for biomedical implants require a good biocompatibility to provide a rapid recovery following surgical procedure and a stabilization of the region where the implants have been inserted. The biocompatibility is evaluated by the degree of the interaction between the implant materials and the cells around the implants. Recent researches on this topic focus on utilizing the characteristics of the nanostructures to improve the biocompatibility. Several studies suggest that the degree of the interaction is varied by the relative size of the nanostructures and cells, and the morphology of the surface of the implant [1, 2]. In this paper, we fabricate the nanowires on the Ti substrate for better biocompatible implants and other biomedical applications such as artificial internal organ, tissue engineered biomaterials, or implantable nano-medical devices. Nanowires are fabricated with two methods: first, nanowire arrays are patterned on the surface using e-beam lithography. Then, the nanowires are further defined with deep reactive ion etching (RIE). The other method is self-assembly based on vapor-liquid-solid (VLS) mechanism using Sn as metal-catalyst. Sn nanoparticle solutions are used in various concentrations to fabricate the nanowires with different pitches. Fabricated nanowries are characterized using scanning electron microscopy (SEM), x-ray diffraction (XRD), and high resolution transmission electron microscopy (TEM). Tthe biocompatibility of the nanowires will further be investigated.

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380-nm Ultraviolet Light-Emitting Diodes with InGaN/AlGaN MQW Structure

  • Bae, Sung-Bum;Kim, Sung-Bok;Kim, Dong-Churl;Nam, Eun Soo;Lim, Sung-Mook;Son, Jeong-Hwan;Jo, Yi-Sang
    • ETRI Journal
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    • v.35 no.4
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    • pp.566-570
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    • 2013
  • In this paper, we demonstrate the capabilities of 380-nm ultraviolet (UV) light-emitting diodes (LEDs) using metal organic chemical vapor deposition. The epi-structure of these LEDs consists of InGaN/AlGaN multiple quantum wells on a patterned sapphire substrate, and the devices are fabricated using a conventional LED process. The LEDs are packaged with a type of surface mount device with Al-metal. A UV LED can emit light at 383.3 nm, and its maximum output power is 118.4 mW at 350 mA.

Flow Rate Changes in the Heterogeneous Rectangular Microchannels with Different Hydrophilicity for the PDMS Bottom Surface (PDMS 표면특성에 따른 비균일계 마이크로채널의 유속 변화)

  • Noh, Soon-Young;Lee, Hyo-Song;Kim, Ki-Ho;Choi, Jae-Ho;Yu, Jae-Keun;Yoon, Soo-Kyung;Rhee, Young-Woo
    • Clean Technology
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    • v.13 no.3
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    • pp.195-200
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    • 2007
  • This study investigated the flow rate changes of the heterogeneous rectangular microchannels which have different hydrophilic property on the bottom surface. The heterogeneous rectangular microchannel has three native PDMS (poly-dimethyl siloxane) surfaces which were patterned by the soft lithography. PDMS bottom surface was treated by the argon plasma and coated by the allyl alcohol (99%). The channel length was 10, 20 and 30 mm and the channel width was 100, 200 and $300\;{\mu}m$, respectively. Several external voltages were applied to make the fluid flow by the electroosmosis in the microchannel. For the same electric field strength and hydrophilicity of the bottom surface, the flow rate is almost same. This result is matched to the theoretical expectation and confirms that the experimental system is reliable. With increasing the channel width, the flow rate increased for the same hydrophilicity of the bottom surface. The flow rate of the microchannel of higher hydrophilicity was larger than that of the microchannel of lower hydrophilicity. This result implies that the hydrophilicity change of the bottom surface could be applied to control the flow rate in the microchannel.

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Infinite Selectivity Etching Process of Silicon Nitride to ArF PR Using Dual-frequency $CH_2F_2/H_2/Ar$ Capacitively Coupled Plasmas (Dual-frequency $CH_2F_2/H_2/Ar$ capacitively coupled plasma를 이용한 실리콘질화물과 ArF PR의 무한 선택비 식각 공정)

  • Park, Chang-Ki;Lee, Chun-Hee;Kim, Hui-Tae;Lee, Nae-Eung
    • Journal of the Korean institute of surface engineering
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    • v.39 no.3
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    • pp.137-141
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    • 2006
  • Process window for infinite etch selectivity of silicon nitride $(Si_3N_4)$ layers to ArF photoresist (PR) was investigated in dual frequency superimposed capacitive coupled plasma (DFS-CCP) by varying the process parameters such as low frequency power $(P_{LF})$, $CH_2F_2$ and $H_2$ flow rate in $CH_2F_2/H_2/Ar$ plasma. It was found that infinite etch selectivities of $Si_3N_4$ layers to the ArF PR on both blanket and patterned wafers can be obtained for certain gas flow conditions. The etch selectivity was increased to the infinite values as the $CH_2F_2$ flow rate increases, while it was decreased from the infinite etch selectivity as the $H_2$ flow rate increased. The preferential chemical reaction of the hydrogen with the carbon in the polymer film and the nitrogen on the $Si_3N_4$ surface leading to the formation of HCN etch by-products results in a thinner steady-state polymer and, in turn, to continuous $Si_3N_4$ etching, due to enhanced $SiF_4$ formation, while the polymer was deposited on the ArF photoresist surface.

A Study on the Optimization of Ballast Water Treatment System for Scale-up (선박평형수 처리장치의 Scale-up을 위한 조건 최적화 연구)

  • Kang, Ahyoung;Song, Ju Yeong
    • Korean Chemical Engineering Research
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    • v.54 no.5
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    • pp.630-635
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    • 2016
  • In the prior work, we studied a ballast water treatment apparatus, which is secondary pollution free by using physical treatment of shear stress. The principle of this apparatus is smashing various microorganisms by shear stress generated between stationary outer cylinder and revolving inner cylinder. Because of various magnitude of shear stress according to the inner cylinder surface type and revolution speed, an appropriate surface type and optimum revolution speed should be studied by consecutive experiment to determine the reference data for commercial apparatus. Through a comparative study of disk type and cylinder type of ballast water treatment apparatus, cylinder type is turned out to be superb to disk type. In this study, we studied to determine the superior collaboration of cylinder type, groove type and knurling type of inner cylinder to non patterned outer cylinder, and to optimize the revolution speed and flow rate according to the gap between inner cylinder and outer cylinder. As a result, we could get perfect sterilization effect at groove type under the conditions of 250 mL/min of flow rate at 8,000 rpm and 500 mL/min of flow rate at 10,000 rpm respectively.

A Study on the Characteristics of the Functional Groups of the Alkanethiol Molecules in UV Laser Photochemical Patterning and Wet Etching Process (UV Laser를 이용한 광화학적 패터닝과 습식에칭에 따른 알칸티올 분자 작용기의 특성 연구)

  • Huh, Kab-Soo;Chang, Won-Seok
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.5
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    • pp.104-109
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    • 2007
  • Photochemical patterning of self-assembled mono layers (SAMs) has been performed by diode pumped solid state (DPSS) 3rd harmonic Nd:$YVO_4$ laser with wavelength of 355 nm. SAMs patternings of parallel lines have subsequently been used either to generate compositional chemical patterns or fabricate microstructures by a wet etching. This paper describes a selective etching process with patterned SAMs of alkanetiolate molecules on the surface of gold. SAMs formed by the adsorption of alkanethiols onto gold substrate employs as very thin photoresists. In this paper, the influence of the interaction between the functional group of SAMs and the etching solution is studied with optimal laser irradiation conditions. The results show that hydrophobic functional groups of SAMs are more effective for selective chemical etching than the hydrophilic ones.

Superhydrophobic nano-hair mimicking for water strider leg using CF4 plasma treatment on the 2-D and 3-D PTFE patterned surfaces

  • Shin, Bong-Su;Moon, Myoung-Woon;Kim, Ho-Young;Lee, Kwang-Ryeol
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.365-365
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    • 2010
  • Similar to the superhydrophobic surfaces of lotus leaf, water strider leg is attributed to hierarchical structure of micro pillar and nano-hair coated with low surface energy materials, by which water strider can run and even jump on the water surface. In order to mimick its leg, many effort, especially, on the fabrication of nanohairs has been made using several methods such as a capillarity-driven molding and lithography using poly(urethane acrylate)(PUA). However most of those effort was not so effective to create the similar structure due to its difficulty in the fabrication of nanoscale hairy structures with hydrophobic surface. In this study, we have selected a low surface energy polymeric material of polytetrafluoroethylene (PTFE, or Teflon) assisted with surface modification of CF4 plasma treatment followed by hydrophobic surface coating with pre-cursor of hexamethyldisiloxane (HMDSO) using a plasma enhanced chemical vapor deposition (PE-CVD). It was found that the plasma energy and duration of CF4 treatment on PTFE polymer could control the aspect ratio of nano-hairy structure, which varying with high aspect ratio of more than 20 to 1, or height of over 1000nm but width of 50nm in average. The water contact angle on pristine PTFE surface was measured as approximately $115^{\circ}$. With nanostructures by CF4 plasma treatment and hydrophobic coating of HMDSO film, we made a superhydrophobic nano-hair structure with the wetting angle of over $160^{\circ}C$. This novel fabrication method of nanohairy structures has been applied not only on 2-D flat substrate but also on 3-D substrates like wire and cylinder, which is similarly mimicked the water strider's leg.

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One- and Two-Dimensional Arrangement of DNA-Templated Gold Nanoparticle Chains using Plasma Ashing Method

  • Kim, Hyung-Jin;Hong, Byung-You
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.291-291
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    • 2010
  • Electron-beam lithography (EBL) process is a versatile tool for a fabrication of nanostructures, nano-gap electrodes or molecular arrays and its application to nano-device. However, it is not appropriate for the fabrication of sub-5 nm features and high-aspect-ratio nanostructures due to the limitation of EBL resolution. In this study, the precision assembly and alignment of DNA molecule was demonstrated using sub-5 nm nanostructures formed by a combination of conventional electron-beam lithography (EBL) and plasma ashing processes. The ma-N2401 (EBL-negative tone resist) nanostructures were patterned by EBL process at a dose of $200\;{\mu}C/cm2$ with 25 kV and then were ashed by a chemical dry etcher at microwave (${\mu}W$) power of 50 W. We confirmed that this method was useful for sub-5 nm patterning of high-aspect-ratio nanostructures. In addition, we also utilized the surface-patterning technique to create the molecular pattern comprised 3-(aminopropyl) triethoxysilane (APS) as adhesion layer and octadecyltrichlorosilane (OTS) as passivation layer. DNA-templated gold nanoparticle chain was attached only on the sub-5 nm APS region defined by the amine groups, but not on surface of the OTS region. We were able to obtain DNA molecules aligned selectively on a SiO2/Si substrate using atomic force microscopy (AFM).

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$TiO_2$ Thin Film Patterning on Modified Silicon Surfaces by MOCVD and Microcontact Printing Method

  • 강병창;이종현;정덕영;이순보;부진효
    • Proceedings of the Korean Vacuum Society Conference
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    • 2000.02a
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    • pp.77-77
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    • 2000
  • Titanium oxide (TiO2) thin films have valuable properties such as a high refractive index, excellent transmittance in the visible and near-IR frequency, and high chemical stability. Therefore it is extensively used in anti-reflection coating, sensor, and photocatalysis as electrical and optical applications. Specially, TiO2 have a high dielectric constant of 180 along the c axis and 90 along the a axis, so it is highlighted in fabricating dielectric capacitors in micro electronic devices. A variety of methods have been used to produce patterned self-assembled monolayers (SAMs), including microcontact printing ($\mu$CP), UV-photolithotgraphy, e-beam lithography, scanned-probe based micro-machining, and atom-lithography. Above all, thin film fabrication on $\mu$CP modified surface is a potentially low-cost, high-throughput method, because it does not require expensive photolithographic equipment, and it produce micrometer scale patterns in thin film materials. The patterned SAMs were used as thin resists, to transfer patterns onto thin films either by chemical etching or by selective deposition. In this study, we deposited TiO2 thin films on Si (1000 substrateds using titanium (IV) isopropoxide ([Ti(O(C3H7)4)] ; TIP as a single molecular precursor at deposition temperature in the range of 300-$700^{\circ}C$ without any carrier and bubbler gas. Crack-free, highly oriented TiO2 polycrystalline thin films with anatase phase and stoichimetric ratio of Ti and O were successfully deposited on Si(100) at temperature as low as 50$0^{\circ}C$. XRD and TED data showed that below 50$0^{\circ}C$, the TiO2 thin films were dominantly grown on Si(100) surfaces in the [211] direction, whereas with increasing the deposition temperature to $700^{\circ}C$, the main films growth direction was changed to be [200]. Two distinct growth behaviors were observed from the Arhenius plots. In addition to deposition of THe TiO2 thin films on Si(100) substrates, patterning of TiO2 thin films was also performed at grown temperature in the range of 300-50$0^{\circ}C$ by MOCVD onto the Si(100) substrates of which surface was modified by organic thin film template. The organic thin film of SAm is obtained by the $\mu$CP method. Alpha-step profile and optical microscope images showed that the boundaries between SAMs areas and selectively deposited TiO2 thin film areas are very definite and sharp. Capacitance - Voltage measurements made on TiO2 films gave a dielectric constant of 29, suggesting a possibility of electronic material applications.

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