• Journal of Korea Society of Digital Industry and Information Management
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• v.15 no.4
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• pp.63-70
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• 2019

The subject of the simultaneous measuring system of base pattern and deposition pattern is a new research topic on a defect inspection of OLED. In this paper, we propose a new OLED inspection method that simultaneously measures standard and deposition pattern images. This method reduces unnecessary processes and tac time during OLED inspection. For an additional reduction of the tac time during pattern measurement, the ROI was configured to measure only in the designated ROI area instead of measuring the entire area of an image. During the ROI set-up, the value of effective deposition pattern area is included so that if the deposition pattern is out of the ROI zone, it would be treated as a defect before measuring the size and center point of the pattern. As a result, the tac time and inspection process could be shortened. The proposed method also could be applied to the OLED manufacturing process. Production of OLED could be increased by reducing tac time and inspection process.

• Journal of Institute of Control, Robotics and Systems
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• v.10 no.1
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• pp.54-59
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• 2004

We suggest a 3D vision inspection algorithm which is based on the external shape feature. Because many electronic parts have the regular shape, if we have the database of pattern and can recognize the object using the database of the object s pattern, we can inspect many types of electronic parts. Our proposed algorithm uses the geometrical pattern matching method and 3D database on the electronic parts. We applied our suggested algorithm fer inspecting several objects including typical IC and capacitor. Through the experiments, we could find that our suggested algorithm is more effective and more robust to the inspection environment(rotation angle, light source, etc.) than conventional 2D inspection methods. We also compared our suggested algorithm with the feature space trajectory method.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.3 s.180
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• pp.102-109
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• 2006

Several methods for PCB pattern inspection have been tried to detect fine detects in pad contours, but their low detection accuracy results from pattern variations originating from etching, printing and handling processes. The adaptive inspection algorithm has been newly proposed to extract minute defects based on movable segments. With gerber master images of PCB, vertex extractions of a pad boundary are made and then a lot of segments are constructed in master data. The pad boundary is composed of segment units. The proposed method moves these segments to optimal directions of a pad boundary and so adaptively matches segments to pad contours of inspected images, irrespectively of various pattern variations. It makes a fast, accurate and reliable inspection of PCB patterns. Its performances are also evaluated with several images.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.5
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• pp.444-452
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• 2008

This paper presents an overall image processing approach of defect inspection of patterned TFT-LCD panels for the real manufacturing process. A prototype of AOI(Automatic Optical Inspection) system which is composed of air floating stage and multi line scan cameras is developed. Adjacent pattern comparison algorithm is enhanced and used for pattern elimination to extract defects in the patterned image of TFT-LCD panels. New region merging algorithm which is based on border expansion is proposed to identify defects from the pattern eliminated defect image. Experimental results show that a developed AOI system has acceptable performance and the proposed algorithm reduces environmental effects and processing time effectively for applying to the real manufacturing process.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.5
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• pp.666-672
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• 2011

In this paper, we describes the development of automatic inspection system for detecting the defects on photovoltaic wafer by using machine vision. Until now, The defect inspection process was manually performed by operators. So these processes caused the produce of poorly-made articles and inaccuracy results. To improve the inspection accuracy, the inspection system is not only configured, but the image processing algorithm is also developed. The inspection system includes dimensional verification and pattern matching which compares a 2-D image of an object to a pattern image the method proves to be computationally efficient and accurate for real time application and we confirmed the applicability of the proposed method though the experience in a complex environment.

• Proceedings of the IEEK Conference
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• 2003.07c
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• pp.2533-2536
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• 2003

In this paper, we suggest the 3D Vision Inspection Algorithm which is based on the external shape feature, and is able to recognize the object. Because many objects made by human have the regular shape, if we posses the database of pattern and we recognize the object using the database of the object's pattern, we could inspect the objects of many fields. Thus, this paper suggest the 3D Vision inspection Algorithm using the Geometrical Pattern Matching by making the 3D database.

• Journal of Industrial Technology
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• v.21 no.B
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• pp.67-74
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• 2001

According as the patterns of PCB (Printed Circuit Board) become denser and complicated, quality and accuracy of PCB influence the performance of final product. It's attempted to obtain trust of 100% about all of parts. Because human inspection in mass-production manufacturing facilities are both time-consuming and very expensive, the automation of visual inspection has been attempted for many years. Thus, automatic visual inspection of PCB is required. In this paper, we used an algorithm which compares the reference PCB patterns and the input PCB patterns are separated an object and a scene by filtering and edge detection. And than compare two image using pattern matching algorithm. We suggest an defect inspection algorithm in PCB pattern, to be satisfied low cost, high speed, high performance and flexibility on the basis of $640{\times}480$ binary pattern.

• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.126-131
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• 2004

The popularity of flat-panel display(FPD), including plasma display panel(PDP) and liquid-crystal display(LCD), has given rise to the need to streamline their production. In these days, PDP is one of the most popular display devices because of its expansion of manufacturing process and simplicity. Bus electrodes, sustain electrodes, barrier ribs and RGB phosphors are patterned on PDP panel to display an image. Since a minute damage on the pattern can cause a serious defect to display, it is important to inspect the pattern precisely. In this paper, an automatic inspection system of repeated pattern in PDP panel has been introduced to find the defect, such as open, short, dirt, island, and so on. And the inspection system has been operated in the mass production line of PDP.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.6
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• pp.640-645
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• 2020

To produce an input device stably using the transparent electromagnetic pattern of an electromagnetic induction method, pattern inspection is required in advance in the production process. Various methods of inspecting the capacitive pattern for hand-touch have been proposed, but it is difficult to find the related technical data for the pattern inspection method of the transparent electromagnetic induction method. In this study, to develop an inspection system for a fused electromagnetic resonance pen sensor with a copper-etched metal mesh pattern, an inspection algorithm and method for measuring the antenna impedance inside the sensor was proposed by measuring only the exposed FPCB connector. The proposed method was configured as a control board consisting of a microprocessor that forms a loop between specific channels according to the command of a computer, a computer-controlled by the Windows program, an LCR meter measuring the impedance between specific channels, and transmitting the measurement results back to the computer. An evaluation of the proposed system and measurements of nine specimens showed that it could detect the defects of the sensor used in the actual product.

• Journal of the Semiconductor & Display Technology
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• v.2 no.4
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• pp.1-7
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• 2003

In this paper, we design the pattern generator circuits using PLDs(Programmable Logic Devices). The pattern generator is the circuit which generates the test pattern signal for the inspection of logical defects of semiconductor products. The proposed circuits are designed by the PLD design tool(MAX+ II of ALTERA). Also the designed circuits are simulated for the verification of the designed ones. The simulation results have a good performance.