• Journal of the Korea Concrete Institute
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• v.18 no.2 s.92
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• pp.227-232
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• 2006

This article presents the results of experimental study that investigates the effect of filler and shrinkage reducing agent influencing on the strength properties of MMA-modified polymer paste that was produced to develop the surface-repair and coating materials of the concrete structures. Results show that the flexural and compressive strengths of the polymer paste increased 29 and 27%, respectively, when the aluminum hydroxide completely replaced the calcium carbonate as the filler Furthermore, when the shrinkage reducing agent was used 30%, both strengths decreased about 29% comparing to when the agent was not used. As in the cases of flexural and compressive strengths, the adhesive strength increased as the content of aluminum hydroxide as the filler increased, and it decreased as the content of shrinkage reducing agent increased. The adhesive strength with a dry concrete substrate turned out to be $30{\sim}40%$ higher than that with a wet concrete substrate.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.69-74
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• 2015

With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.

• Journal of Dental Rehabilitation and Applied Science
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• v.23 no.3
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• pp.259-268
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• 2007

purpose: This study was to evaluate the shear bond strength of Lithium Disilicate Glass-Ceramic by removable method of temporary cement on the abutment tooth. Material and Method: Sixty molar teeth of human with the occlusal surface up were mounted in acrylic resin blocks. The 45 specimens were prepared to exposure dentin by diamond bur and the eugenol-containing temporary cement($Cavitec^{TM}$ ($KERR^{(R)}$, U.S.A)was applied to the dentin surfaces. After initial removal of the cement with a dental explorer, the specimens were divided into 4 groups of 15 specimens each. The dentin surfaces of the specimens were treated by rotary instrument with as follow pastes: $Zircate^{(R)}$ prophy paste(Dentsply, U.S.A), Radent Prophy Paste(Pascal company,inc. U.S.A), and Dental pumice(Wip mix corporation,U.S.A). An adhesive resin luting agent(Variolink $II^{(R)}$, Ivoclar Vivadent, Leichtenstein) including Monobond-S and $Excite^{(R)}$ was applied to all specimens. The ceramic specimens were made with an A1 ingot of IPS Empress $II^{(R)}$ (Ivoclar Vivadent, Leichtenstein). After the specimens were stored in distilled water for 48hr, the shear bond strength(MPa) was measured by a Universal testing machine(Zwick 145641, Zwick, Germany) at a 1mm/min cross-head speed. The data were statistically analyzed by one-way ANOVA and Duncan's multiple range test. Results: In all group, there were no significant differences in comparison with the control group(p>0.05). The pattern of most failure showed the mixed type of cohesive and adhesive failure. Conclusion: Resin bond strength of IPS Empress $II^{(R)}$ was not affected by removal method of the temporary cement.

• Journal of Conservation Science
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• v.25 no.1
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• pp.39-47
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• 2009

This paper reports a study on physical properties of the traditional adhesives for developing natural adhesives. This is to certify that the superiority of tradition through systematic surveys and experiments as well. We used three kinds of starches differing fermentation time(7 years, 4 years 8 months, and 2 years 8 months) which are fermented from wheat flour starches. The amylose contents, total sugar contents, crystallinity, particle size and shape, viscosity, pH, and adhesive strength were examined. The effect of fermentation time on physical properties of fermented wheat flour were studied. It was found that fermentation time effect various physical properties such as total sugar contents, amylose contents, crystallinity, viscosity, and so on.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.386-386
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• 2011

탄소나노튜브는 큰 길이 대 직경 비와 뛰어난 전기적 특성으로 인해 차세대 전계 방출 소자로 주목 받고 있다. 실질적인 전계방출 디스플레이로의 응용을 위한 대면적 제작과 유리 기판 사용을 위해 이용되었던 페이스트(paste)법은 높은 전기장 하에서 장시간 전계방출시 탄소나노튜브 전계방출원과 페이스트(paste)간의 낮은 접착력 때문에 발생하는 탄소나노튜브의 탈루현상(omission)과 유기물질(organic paste)에서 발생하는 탈기체(out-gassing) 문제점이 있었다. 최근 이런 문제점을 개선하기 위해 유기물질(organic paste)를 대체하여 금속바인더(metal binder) 물질을 사용한 결과들이 보고되고 있다. 본 연구에서는 유리기판 위에 제작된 탄소나노튜브 전계방출원의 수명 향상을 위하여 금속바인더와 후속 열처리법의 변화에 따른 전계방출 안정성을 분석하였다. 금속바인더는 접합층/ 접착층(soldering layer/ adhesive layer)으로 구성되어 있으며, 일반적인 소다석회유리(soda-lime glass)에 스퍼터(DC magnetron sputtering system)를 이용하여 증착하였다. 접착층은 유리기판과 접합층의 접착력 향상을 위해 사용되며, 접합층은 기판과 탄소나노튜브 전계방출원을 접합하는 역할과 전계방출 측정시 전극이 되기 때문에 우수한 전기 전도성과 내산화성을 필요로 한다. 본 실험에서는 일반적으로 유리기판과 접착력이 좋다고 알려진 Cr, Ti, Ni, Mo을 접착층으로 사용하였으며, 접합성과 전기전도성, 내산화성이 뛰어난 귀금속 계열의 금속을 접합층으로 사용하였다. 탄소나노튜브를 1,2-디클로로에탄(1,2-dichloroethane, DCE)에 분산시킨 용액을 스프레이방법을 이용하여 증착시켰으며, 후속 열처리 방법을 통하여 접합층과 결합시켰다. 금속바인더와 후속 열처리법의 변화에 따른 접착력과 표면형상(morphology)의 변화를 주사전자현미경(scanning electron microscopy)를 이용하여 분석하였으며, 다이오드 타입에 디씨 바이어스(DC bias)를 사용하여 전계방출특성을 측정하였다[1,2].

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.4
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• pp.231-237
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• 2018

In this study, two important requirements for the home production of a robot to detect and remove improvised explosive devices (IEDs) are presented in terms of the total cost for robot system development and the performance improvement of the mine detection technology. Firstly, cost analyses were performed in order to provide a reasonable solution following an engineering estimate method. As a result, the total cost for a mass production system without the mine detection system was estimated to be approximately 396 million won. For the case including the mine detection system, the total cost was estimated to be approximately 411 million won, in which labor costs and overhead charges were slightly increased and the material costs for the mine detection system were negligible. Secondly, a method for fabricating the carbon nanotube (CNT) based gas detection sensor was studied. The detection electrodes were formed by a photolithography process using a photosensitive CNT paste. As a result, this method was shown to be a scalable and expandable technology for producing excellent mine detection sensors. In particular, it was found that surface treatments by using adhesive taping or ion beam bombardment methods are effective for exposing the CNTs to the ambient air environment. Fowler-Nordheim (F-N) plots were obtained from the electron-emission characteristics of the surface treated CNT paste. The F-N plot suggests that sufficient electrons are available for transport between CNT surfaces and chemical molecules, which will make an effective chemiresistive sensor for the advanced IED detection system.

• The korean journal of orthodontics
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• v.49 no.6
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• pp.404-412
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• 2019

Objective: To assess shear bond strength and failure mode (Adhesive Remnant Index, ARI) of orthodontic brackets bonded to polymethylmethacrylate (PMMA) blocks for computer-aided design/manufacture (CAD/CAM) fabrication of temporary restorations, following substrate chemical or mechanical treatment. Methods: Two types of PMMA blocks were tested: $CAD-Temp^{(R)}$ (VITA) and $Telio^{(R)}$ CAD (Ivoclar-Vivadent). The substrate was roughened with 320-grit sandpaper, simulating a fine-grit diamond bur. Two universal adhesives, Scotchbond Universal Adhesive (SU) and Assure Plus (AP), and a conventional adhesive, Transbond XT Primer (XTP; control), were used in combination with Transbond XT Paste to bond the brackets. Six experimental groups were formed: (1) $CAD-Temp^{(R)}/SU$; (2) $CAD-Temp^{(R)}/AP$; (3) $CAD-Temp^{(R)}/XTP$; (4) $Telio^{(R)}$ CAD/SU; (5) $Telio^{(R)}$ CAD/AP; (6) $Telio^{(R)}$ CAD/XTP. Shear bond strength and ARI were assessed. On 1 extra block for each PMMA-based material surfaces were roughened with 180-grit sandpaper, simulating a normal/medium-grit ($100{\mu}m$) diamond bur, and brackets were bonded. Shear bond strengths and ARI scores were compared with those of groups 3, 6. Results: On $CAD-Temp^{(R)}$ significantly higher bracket bond strengths than on $Telio^{(R)}$ CAD were recorded. With XTP significantly lower levels of adhesion were reached than using SU or AP. Roughening with a coarser bur resulted in a significant increase in adhesion. Conclusions: Bracket bonding to CAD/CAM PMMA can be promoted by grinding the substrate with a normal/medium-grit bur or by coating the intact surface with universal adhesives. With appropriate pretreatments, bracket adhesion to CAD/CAM PMMA temporary restorations can be enhanced to clinically satisfactory levels.

• Journal of Conservation Science
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• v.34 no.3
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• pp.143-155
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• 2018

In this study, we investigated the properties and manufacturing methods of soil mural finishing layers fabricated using animal glue, starch adhesive(wheat paste), and Dobak glue. We assessed the workability and weatherproofing properties of the earthen plaster and finishing layers fabricated using concentrations of 3%, 5%, 7% and 10% for each adhesive. The results showed that a mixture using 3% or 5% starch adhesive or 3% Dobak glue was suitable for constructing the finishing layer. For finishing layers made with animal glue, earthen plaster had poor workability. It was dry and easily broken as the concentrations of animal glue increased. However, specimens made with low concentrations of animal glue did not exhibit surface deterioration after a freezing-thawing test. Therefore, animal glue mixtures could possibly be used for constructing finishing layers in concentrations lower than 3%. Mixtures containing starch adhesive produced plasters with good workability. Additionally, starch adhesive enhanced compression strength. However, when starch adhesive was mixed at concentrations above 7%, the surface exhibited roughening and staining in freezing-thawing tests. When Dobak glue was used in mixtures, it enhanced compression strength, but concentrations above 5% produced specimens with surface cracking. For concentrations of 3%, there were no cracks and the specimens were stable after freezing-thawing tests, so concentrations below 3% of Dobak glue are suitable for constructing finishing layers. We expect this study will be useful for restoring the traditional technology of soil mural finishing layers and suggest using adhesives to construct the finishing layer.

• Korean Journal of Materials Research
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• v.13 no.1
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• pp.18-23
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• 2003

Properties of Ag thick films fabricated by using low temperature curable silver pastes were investigated. Ag pastes were consisted of polymer resins and silver powders. Ag pastes were used for conductive or fixing materials between board and various electrical and electronic devices. Low temperature curable Ag pastes have some advantages over high temperature curable types. In cases of chip mounting, soldering properties were required for screen printed Ag thick films. In this study, four types of Ag pastes were fabricated with different compositions. Screen printed Ag thick films on alumina substrates were fabricated at various curing temperatures and times. Thickness, resistivity, adhesive strength and solderability of fabricated Ag thick films were characterized. Finally, Ag thick films produced using Ag pastes, sample A and B, cured at $150^{\circ}C$ for longer than 6 h and $180^{\circ}C$ for longer than 2 h, and $150^{\circ}C$ for longer than 1 h and $180^{\circ}C$ for 1 h, respectively, showed low resistivities of $10^{-4}$ $∼10^{-5}$ Ωcm and good adhesive strength of 1∼5 Mpa. Soldering properties of those Ag thick films with curing temperatures at solder of 62Sn/36Pb/3Ag were also investigated.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.