• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.34 no.6
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• pp.42-50
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• 2006

This paper addresses the optimized thermal modeling methodology for spacecraft board level thermal analysis. A direct thermal modeling of external and internal structure of active parts which have high power dissipation is newly proposed, based on conventional plate modeling for Printed Circuit Board(PCB). The parts thermal modeling results were compared with other generic methodologies and verified by thermal vacuum test. This parts thermal modeling was directly applied to thermal analysis of CS(Communication Subsystem) board of HAUSAT-2 small satellite. As a result, it was confirmed that the parts thermal modeling can complement other conventional modeling methodologies. A parts thermal modeling is very effective for thermal control design, since the existing thermal problems can be solved at the parts level in advance.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.4 s.235
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• pp.526-536
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• 2005

A heat dissipation modeling method of EEE parts, or semi-empirical heat dissipation method, is developed for thermal design and analysis an electronic equipment of geostationary satellite. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU (Command and Telemetry Unit) and verified by thermal cycling and vacuum tests.

• 한국전산유체공학회:학술대회논문집
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• 2005.04a
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• pp.91-95
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• 2005

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU and verified by thermal cycling and vacuum tests.

• Journal of computational fluids engineering
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• v.11 no.2 s.33
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• pp.32-39
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• 2006

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is considered instead of conventional lumped capacity nodes. These modeling methods are applied to the thermal design and analysis of CTU EM and EQM and verified by thermal cycling and vacuum tests.

• Bulletin of the Korean Space Science Society
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• 2004.10b
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• pp.270-273
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• 2004

The initial thermal analysis needs to be fast and efficient to reduce the feedback time for the optimal electronic equipment designing. In this study, a thermal model is developed by using power consumption measurement values of each functional breadboard, that is, semi-empirical power dissipation method. In modeling heat dissipated EEE parts, power dissipation is imposed evenly on the EEE part footprint area which is projected to the printed circuit board, and is called surface heat model. The application of these methods is performed in the development of a command and telemetry unit (CTU) for a geostationary satellite. Finally, the thermal cycling test is performed to verify the applied thermal analysis methods.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.32 no.9
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• pp.114-121
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• 2004

Thermal design changes and analysis on the engineering model of Command Telemetry Unit(CTU) for a geostationary communications satellite arc performed for the purpose of developing an engineering qualification model. A thermal model is developed by using power consumption measurement values of each functional board and thermal cycling test results. In modeling heat dissipated EEE parts, heat dissipation is imposed evenly on the EEE part footprint area which is projected to the printed circuit board. All the EEE parts of CTU meet the requirement of their allowable temperature range when placed on the engineering qualification level of thermal vacuum environments in accordance with the proposed thermal design changes.

• Journal of Astronomy and Space Sciences
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• v.23 no.1
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• pp.39-54
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• 2006

HAUSAT-2 is nano satellite with 25kg mass being developed by Space System Research Lab. in Hnakuk Aviation University. This paper addresses HAUSAT-2 small satellite thermal analyses and its verification at satellite system, electronic box, and PCB levels. Thermal model which is used for system-level and box-level thermal analyses was verified and corrected through thermal vacuum/balance test. The new board-level thermal analysis methodology, modelling high-power dissipating EEE parts directly, was proposed. The proposed methodology has been verified with test results.

• Steel and Composite Structures
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• v.10 no.2
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• pp.129-149
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• 2010

The objective of this study is to formulate a general 3D material-structural analysis framework for the thermomechanical behavior of steel-concrete structures in a fire environment. The proposed analysis framework consists of three sequential modeling parts: fire dynamics simulation, heat transfer analysis, and a thermomechanical stress analysis of the structure. The first modeling part consists of applying the NIST (National Institute of Standards and Technology) Fire Dynamics Simulator (FDS) where coupled CFD (Computational Fluid Dynamics) with thermodynamics are combined to realistically model the fire progression within the steel-concrete structure. The goal is to generate the spatial-temporal (ST) solution variables (temperature, heat flux) on the surfaces of the structure. The FDS-ST solutions are generated in a discrete form. Continuous FDS-ST approximations are then developed to represent the temperature or heat-flux at any given time or point within the structure. An extensive numerical study is carried out to examine the best ST approximation functions that strike a balance between accuracy and simplicity. The second modeling part consists of a finite-element (FE) transient heat analysis of the structure using the continuous FDS-ST surface variables as prescribed thermal boundary conditions. The third modeling part is a thermomechanical FE structural analysis using both nonlinear material and geometry. The temperature history from the second modeling part is used at all nodal points. The ABAQUS (2003) FE code is used with external user subroutines for the second and third simulation parts in order to describe the specific heat temperature nonlinear dependency that drastically affects the transient thermal solution especially for concrete materials. User subroutines are also developed to apply the continuous FDS-ST surface nodal boundary conditions in the transient heat FE analysis. The proposed modeling framework is applied to predict the temperature and deflection of the well-documented third Cardington fire test.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.12
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• pp.1208-1213
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• 2007

Some structural problems and temperature difference of the pyrolysis equipment were improved by using the structure analysis and the optimal design of torch. The pyrolysis equipment developed in this study is expected to the excellent pyrolysis effect. To modify user-friendly the dimension of a part, we developed the feature modeling system that all of the related parts automatically change applying to the three-dimensional modeling method.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.12
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• pp.1265-1271
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• 2013

In this work, modeling and analysis of thermal effects laser drilling under water for ceramics were presented. Laser is a unique tool for machining ceramics due to the characteristic of non-contact material removal. However, ablation by a laser often induces a thermal effect on the material and an increased heat-affected-zone or deposition of debris can be observed on the machined parts. The underwater surrounding improved a heat transfer rate to cooling down the machined part and could prevent any deposition of debris near the machined surfaces and edges. The heat modeling was applied to obtain the temperature distributions as well as temperature gradients between the material and surroundings. The cooling effect of the underwater laser drilling was improved and a more stable temperature distribution was calculated. The actual laser drilling results of ceramic laser drilling were presented to verify the effects of underwater laser drilling.