• 제목/요약/키워드: Particle deposition

검색결과 572건 처리시간 0.019초

입자하전량에 따른 클린룸 수직벽체로의 입자침착 특성 (Characteristics of Particle Deposition onto Cleanroom Wall Panel for Varying Particle Charging Rates)

  • 김종준;노광철;성상철;백선호;오명도
    • 대한설비공학회:학술대회논문집
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    • 대한설비공학회 2008년도 하계학술발표대회 논문집
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    • pp.725-730
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    • 2008
  • In this study, we found out charged particle's deposition characteristic by experiments of $0.5{\mu}m$, $1.0{\mu}m$, $3.0{\mu}m$ size particle's concentration decay. We carried out the experiments on charged particle deposition onto the vertical cleanroom wall panel and some other fundamental experiments. The particle deposition mechanism is consist of sedimentation, convection, diffusion, thermophoresis, electrostatic and so on. Particle size determines mainly working deposition mechanism. The charged particle is made with corona discharge that are constituted field charging and diffusion charging. In addition, this combinational mechanism is called combined charging. The type of corona discharge determines quantity of particle electrical charge. In conclusion, we assumed that quantity of particle electrical charge accelerations deposition velocity onto the vertical cleanroom wall panel and proved it. And we figured out particle's deposition characteristic through compared between our experiment's results.

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2단식 전기집진기의 집진판 블록간격 및 입자크기가 입자의 부착효율에 미치는 영향 (Effects of the Block Distance of Collecting Plate and Particle Size on the particle Deposition Efficiency in the Two-Stage Electrostatic Precipitator)

  • 박청연
    • 한국대기환경학회지
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    • 제16권2호
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    • pp.165-178
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    • 2000
  • In this study the effects of block distance have been investigated on the particle deposition efficiency in the collecting cell of two-stage electrostatic precipitator by numerical analysis. Particle trajectories have been changed by the electrostatic and inertial force of particle with the inlet velocity electrostatic number and particle diameter. The total deposition efficiency has a minimum value by the interaction between the effect of particle inertial force and electrostatic force in the collecting cell. The increase of block distance makes the total deposition efficiency decrease under the range of the particle size which has the minimum deposition efficiency. However beyond the range of particle size which has minimum deposition efficiency total deposition efficiency has no trend with the variation of block distance.

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정전효과를 고려한 반도체 웨이퍼의 입자침착 특성 (Particle Deposition Characteristics with Electrostatic Effect on Semiconductor Wafers)

  • 이건형;채승기;문영준
    • 대한설비공학회:학술대회논문집
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    • 대한설비공학회 2006년도 하계학술발표대회 논문집
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    • pp.779-785
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    • 2006
  • Particle transport and deposition characteristics on semiconductor wafers inside the chamber were experimentally investigated via a particle generation & deposition system and a wafer surface scanner. Especially the relation between particle size($0.083{\sim}0.495{\mu}m$) and particle deposition velocity with ESA(Electrostatic Attraction) effect was studied. Spot deposition technique with the deposition system using nozzle type outlets of the chamber was newly conducted to derive particle deposition velocity and all experiment results were compared with the previous study and were in a good agreement as well.

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정전압에 따른 클린룸 벽체에서의 입자침착 특성 (Characteristics of Particle Deposition onto the Cleanroom Wall Panel with Electrostatic Voltages)

  • 노광철;손영태;김종준;오명도
    • 설비공학논문집
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    • 제18권12호
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    • pp.1033-1038
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    • 2006
  • We carried out the experiments on particle deposition onto the cleanroom wall panels. And then we investigated the particle deposition characteristic coefficients for electrostatic voltages and particle size. It was found that there is little difference in characteristics of the particle deposition between the steel panel and the anti-static coating panel. In case of that the particle size is under $1.0{\mu}m$, the particle deposition characteristic coefficient becomes larger as the electrostatic voltage induced to the cleanroom wall panel is increasing. Where in case of that the particle size is over $3.0{\mu}m$, the particle deposition characteristic coefficients do not show any differences with the electrostatic voltages. It is due to that the electrostatic force is the major particle transport mechanism for submicron particles, while the gravitational settling is the major particle transport mechanism for overmicron particles when the electro-static voltages are induced to the cleanroom wall panel.

정전효과가 있는 100mm보다 큰 반도체 웨이퍼로의 입자침착 (Particle deposition on a semiconductor wafer larger than 100 mm with electrostatic effect)

  • 송근수;유경훈;이건형
    • 한국입자에어로졸학회지
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    • 제5권1호
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    • pp.17-27
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    • 2009
  • Particle deposition on a semiconductor wafer larger than 100 mm was studied experimentally and numerically. Particularly the electrostatic effect on particle deposition velocity was investigated. The experimental apparatus consisted of a particle generation system, a particle deposition chamber and a wafer surface scanner. Experimental data of particle deposition velocity were obtained for a semiconductor wafer of 200 mm diameter with the applied voltage of 5,000 V and PSL particles of the sizes between 83 and 495 nm. The experimental data of particle deposition velocity were compared with the present numerical results and the existing experimental data for a 100 mm wafer by Ye et al. (1991) and Opiolka et al. (1994). The present numerical method took into consideration the particle transport mechanisms of convection, Brownian diffusion, gravitational settling and electrostatic attraction in an Eulerian frame of reference. Based on the comparison of the present experimental and numerical results with the existing experimental results the present experimental method for a 200 mm semiconductor wafer was found to be able to present reasonable data.

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진공 환경에서 가열되는 반도체 웨이퍼로의 입자 침착에 관한 수치해석적 연구 (A Numerical Study on Particle Deposition onto a Heated Semiconductor Wafer in Vacuum Environment)

  • 박수빈;유경훈;이건형
    • 한국입자에어로졸학회지
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    • 제14권2호
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    • pp.41-47
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    • 2018
  • Numerical analysis was conducted to characterize particle deposition onto a heated horizontal semiconductor wafer in vacuum environment. In order to calculate the properties of gas surrounding the wafer, the gas was assumed to obey the ideal gas law. Particle transport mechanisms considered in the present study were convection, Brownian diffusion, gravitational settling and thermophoresis. Averaged particle deposition velocities on the upper surface of the wafer were calculated with respect to particle size, based on the numerical results from the particle concentration equation in the Eulerian frame of reference. The deposition velocities were obtained for system pressures of 1000 Pa~1 atm, wafer heating of 0~5 K and particle sizes of $2{\sim}10^4nm$. The present numerical results showed good agreement with the available experimental ones.

대기오염 입자의 인체 호흡기내 비대칭 국부침전 특성에 관한 연구 (Study on the Asymmetric Regional Deposition of Airborne Pollutant Particles in the Human Respiratory Tract)

  • 구재학;김종숭
    • 한국대기환경학회지
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    • 제19권5호
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    • pp.551-560
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    • 2003
  • Particle deposition in human lungs was investigated theoretically by using asymmetric five-lobe lung model. The volumes of each of the five lobes were different, thereby forming an asymmetric lung structure. The tidal volume and flow rate of each lobe were scaled according to lobar volume. The total and regional deposition with various breathing patterns were calculated by means of tracking volume segments and accounting for particle loss during inhalation and exhalation. The deposition fractions were obtained for each airway generation and lung lobe, and dominant deposition mechanisms were investigated for different size particles. Results show that the tidal volume and flow rate have a characteristic influence on particle deposition. The total deposition fraction increases with an increase in tidal volume for all particle sizes. However, flow rate has dichotomous effects: a higher flow rate results in a sharp increase in deposition for large size particles, but decreases deposition for small size particles. Deposition distribution within the lung shifts proximally with higher flow rate whereas deposition peak shifts to the deeper lung region with larger tidal volume. Deposition fraction in each lobe was proportional to its volume. Among the three main deposition mechanisms, diffusion was dominant for particles < 0.5 ${\mu}{\textrm}{m}$ whereas sedimentation and impaction were most influential for larger size particles. Impaction was particularly dominant for particles> 8 ${\mu}{\textrm}{m}$. The results may prove to be useful for estimating deposition dose of inhaled pollutant particles at various breathing conditions.

병렬로 배열된 두 개의 원형 실린더 유동에서 입자의 분산과 부착 해석 (SIMULATION OF PARTICLE DISPERSION AND DEPOSITION IN FLOW AROUND TWO CIRCULAR CYLINDERS IN A SIDE-BY-SIDE ARRANGEMENT)

  • 황동준;김동주
    • 한국전산유체공학회지
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    • 제21권2호
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    • pp.81-89
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    • 2016
  • Numerical simulations are carried out for the fluid flow and particle transport around two nearby circular cylinders in a side-by-side arrangement. The present study aims to understand the effects of the particle Stokes number and the spacing between two cylinders on particle dispersion and deposition characteristics. Simulations are based on an Eulerian-Lagrangian approach where the motion of particles is calculated by a Lagrangian approach based on one-way coupling. Results show that the flow structure is very different depending on the cylinder spacing, eventually affecting the overall pattern of particle dispersion significantly. It is also found that particles with smaller Stokes number tend to be distributed more uniformly in the wake of two cylinders, being located even inside the vortex cores. Meanwhile, particle deposition is analyzed in terms of the deposition efficiency and deposition location. The deposition efficiency of particles strongly depends on the Stokes number, whereas it is slightly affected by the cylinder spacing. The deposition location gets wider as the Stokes number increases, and it becomes asymmetric about the center of each cylinder as the cylinders get close.

원관 주위 유하 액막에 의한 관 외벽에서의 입자 부착에 대한 실험 (An experiment of the particle deposition on a circular cylinder in a laminar flow)

  • 정종수;이윤표;정기만;박찬우
    • 설비공학논문집
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    • 제12권2호
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    • pp.113-119
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    • 2000
  • An experimental study has been carried out in order to investigate on a particle deposition on a circular cylinder surface. The present study is focused on the particulate fouling occurring in a heat exchanger for a seawater desalinization, in a laminar flow over circular cylindrical tubes. The objective is to investigate how NaCl concentration influences the $SiO2$ particle deposition on the surface of a glass circular cylinder. The NaCl concentration was changed from 0 g/L to 40 g/L. As the experimental results of $SiO2$ particle which is deposited on the glass circular cylinder surface showed, particle deposition rate per unit time increases rapidly with the increase of NaCl concentration between 0 g/L and 15 g/L. After the maximum of particle deposition rate was found at the NaCl concentration of 15 g/L, particle deposition rate remains unchanged or decreases gradually with the NaCl concentration from 15 g/L to 40 g/L. Also the $SiO2$ deposition rate of particles does not have serious variations with the position at present glass surface.

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웨이퍼 표면상의 입자침착에 관한 수치 시뮬레이션 (Numerical Simulation of Particle Deposition on a Wafer Surface)

  • 명현국;박은성
    • 대한기계학회논문집
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    • 제17권9호
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    • pp.2315-2328
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    • 1993
  • The turbulence effect of particle deposition on a horizontal free-standing wafer in a vertical flow has been studied numerically by using the low-Reynolds-number k-.epsilon. turbulence model. For both the upper and lower surfaces of the wafer, predictions are made of the averaged particle deposition velocity and its radial distribution. Thus, it is now possible to obtain local information about the particle deposition on a free-standing wafer. The present result indicates that the particle deposition velocity on the lower surface of wafer is comparable to that on the upper one in the diffusion controlled deposition region in which the particle sizes are smaller than $0.1{\mu}m$. And it is found in this region that, compared to the laminar flow case, the averaged deposition velocity under the turbulent flow is about two times higher, and also that the local deposition velocity at the center of wafer is high equivalent to that the wafer edge.