• Corrosion Science and Technology
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• v.9 no.6
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• pp.247-253
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• 2010

The characteristics of selective oxidation prior to hot-dip galvanizing with the annealing atmosphere dew point and chemical composition in dual-phase steels and their effect on the inhibition layer formation relevant to coating adhesion have been studied using a combination of electron microscopic and surface analytical techniques. The annealed and also galvanized samples of 3 kinds of Si/Mn ratios with varied amounts of Si addition were prepared by galvanizing simulator. The dew point was controlled at soaking temperature $800^{\circ}C$ in 15%$H_2$ -85%$N_2$ atmosphere. It was shown that good adhesion factors were mainly uniformity of oxide particle distribution of low number density and low Si/Mn ratio prior to hot-dip galvanizing. Their effect was the greatly reduced coating bare spots and the formation of uniform inhibition layer leading to good adhesion of Zn overlay. The mechanism of good adhesion is suggested by two processes: the formation of inhibition layer on the oxide free surface uncovered with no $SiO_2$-containing particles in particular, and the inhibition layer bridging of oxide particles. The growth of inhibition layer was enhanced markedly by the delayed reaction of Fe and Al with the increase of Si/Mn ratio.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.30 no.3
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• pp.74-83
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• 1998

The phenomenon of decrease in sizing efficiency when the stock temperature is increased is well recognized as summer sizing, and this is believed to be caused by uneven distribution of sizing agents on paper surface most often incurred by coagulation of sizing agents. When unevenly sized paper is used as coating base stock, nonuniform consolidation of the coating layer may result, which, in turn, causes uneven distribution of binder on coating surface. This causes nonuniform ink absorption to produce print mottle. In this study the effects of simple or polymeric electrolytes, storage temperature and time on the coagulation of cationic dispersed rosin size were investigated using a turbidity measurement method which was verified to correlate well with the particle size of rosin emulsion or its coagulates. Handsheets sized with rosin dispersions coagulated under various conditions were prepared and their sizing degree and coated paper properties including gloss and ink density were examined. The relationship between the sizing nonuniformity of coated papers and its ink absorption property was evaluated. Turbidity of rosin emulsion increased as the storage temperature and time were increased. Addition of simple or polymeric electrolytes caused reduction in $zeta$ -potential of the rosin dispersion and accelerated the coagulation tendency substantially. Reversion of the $zeta$ -potential of rosin dispersion, however, did not occur when coagulation was induced with simple electrolytes. On the other hand, addition of an anionic polyelectrolyte reversed the $zeta$ -potential of the flocculated rosin dispersion. This indicated that electrical double layer compaction and bridging flocculation were coagulation mechanisms for simple and polymeric electrolytes, respectively. Sizing degree decreased as coagulation of rosin was increased. Paper gloss, ink gloss and ink density were increased when sizing degree of base stock was increased most probably due to prevention of base paper swelling and increased binder migration to coating surface. This suggested that uneven printing ink density occurred when uneven sizing development was induced by coagulation of rosin particles.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.91-97
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• 2022

The wettability and rheological properties of solder paste with the size of the solder powder were evaluated. To formulate the solder paste, three types of solder powder were used: T4 (20~28 ㎛), T5 (15~25 ㎛), and T6 (5~15 ㎛). The viscosities of the T4, T5, and T6 solder pastes at 10 RPM were 155, 263, and 418 Pa·s, respectively. After 7 days, the viscosity of the T4 solder paste slightly increased by 2.6% and that of T5 was increased by 20.6%. The viscosity of the T6 solder paste after 7 days could not be measured due to high viscosity. The viscosity variation with solder particle size also affected on the printability of the solder. In the case of the T4 solder paste, printability, slump, bridging, and soldering properties were excellent. On the other hand, T5 showed slight dewetting and solder ball defects. Especially, T6, which the smallest powder size, showed poor printability and dewetting at the edge of solder.