• 대한조선학회논문집
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• 제49권6호
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• pp.528-533
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• 2012

Flexible composite propellers are subject to large deformation under heavy loading, and hence the hydrodynamic performance of deformed propeller might deviate from that of the metallic propeller under negligible deformation. To design the flexible propeller, it is therefore necessary to be able to evaluate the structural response of the blades to the hydrodynamic loadings, and then the influence of the blade deformation upon the hydrodynamic loadings. We use the lifting-surface-theory-based propeller analysis and design codes in solving the hydrodynamic problem, and the finite-element-method program formulated with 20-node iso-parametric solid elements for the analysis of the structural response. The two different hydrodynamic and structural programs are arranged to communicate through the carefully-designed interface scheme which leads to the derivation of the geometric parameters such as the pitch, the rake and the skew distributions common to both programs. The design of flexible propellers, suitable for manufacturing, is shown to perform the required thrust performance when deformed in operation. Sample design shows the fast iteration scheme and the robustness of the design procedure of the flexible propellers.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.763-768
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• 2005

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified for other bonding methods such as ACF In bonding process, the bonding forte and temperature are known as the most dominant bonding parameters. A parametric study is performed for these two parameters. For the test sample, we used standard flip-chip test kit which consists of FR4 boards and dummy flip-chips. The bonding test was performed fur two types of flip-chips with different chip size and lead pitch. The bonding temperatures are chosen between $25^{\circ}C\;to\;300^{\circ}C$. The bonding forces are chosen between 5N and 300N. The bonding strength is checked using bonding force tester. After the bonding force test, the samples are examined by microscope to determine the failure mode. The relations between the bonding strength and the bonding parameters are analyzed and compared with bonding models. Finally, the most suitable bonding condition is suggested in terms of temperature and force.