• Title/Summary/Keyword: Parallel Integration

Search Result 160, Processing Time 0.026 seconds

Lock-in and drag amplification effects in slender line-like structures through CFD

  • Belver, Ali Vasallo;Iban, Antolin Lorenzana;Rossi, Riccardo
    • Wind and Structures
    • /
    • v.15 no.3
    • /
    • pp.189-208
    • /
    • 2012
  • Lock-in and drag amplification phenomena are studied for a flexible cantilever using a simplified fluid-structure interaction approach. Instead of solving the 3D domain, a simplified setup is devised, in which 2D flow problems are solved on a number of planes parallel to the wind direction and transversal to the structure. On such planes, the incompressible Navier-Stokes equations are solved to estimate the fluid action at different positions of the line-like structure. The fluid flow on each plane is coupled with the structural deformation at the corresponding position, affecting the dynamic behaviour of the system. An Arbitrary Lagrangian-Eulerian (ALE) approach is used to take in account the deformation of the domain, and a fractional-step scheme is used to solve the fluid field. The stabilization of incompressibility and convection is achieved through orthogonal quasi-static subscales, an approach that is believed to provide a first step towards turbulence modelling. In order to model the structural problem, a special one-dimensional element for thin walled cross-section beam is implemented. The standard second-order Bossak method is used for the time integration of the structural problem.

Integrated Thyristor Switch Structures for Capacitor Discharge Application

  • Kim, Eun-Dong;Zhang, Chang-Li;Kim, Sang-Cheol;Baek, Do-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2001.05b
    • /
    • pp.22-25
    • /
    • 2001
  • A thyristor switch circuit for capacitor discharge application, of which the equivalent circuit includes a resistor between cathode and gate of a reverse-conducting thyristor and an avalanche diode anti-parallel between its anode and gate to set thyristor tum-on voltage, is monolithically integrated by planar process with AVE double-implantation method. To ensure a lower breakdown voltage of the avalanche diode for thyristor tum-on than the break-over voltage of the thyristor, $p^+$ wells on thyristor p base layer are made by boron implantation/drive-in for a steeper doping profile with higher concentrations while rest p layers of thyristor and free-wheeling diode parts are formed with Al implantation/drive-in for a doping profile of lower steepness. The free-wheeling diode part is isolated from the thyristor part by formation of separated p-well emitter for suppressing commutation between them, which is achieved during the formation of thyristor p-base layer.

  • PDF

Challenges for Nanoscale MOSFETs and Emerging Nanoelectronics

  • Kim, Yong-Bin
    • Transactions on Electrical and Electronic Materials
    • /
    • v.11 no.3
    • /
    • pp.93-105
    • /
    • 2010
  • Complementary metal-oxide-semiconductor (CMOS) technology scaling has been a main key for continuous progress in silicon-based semiconductor industry over the past three decades. However, as the technology scaling enters nanometer regime, CMOS devices are facing many serious problems such as increased leakage currents, difficulty on increase of on-current, large parameter variations, low reliability and yield, increase in manufacturing cost, and etc. To sustain the historical improvements, various innovations in CMOS materials and device structures have been researched and introduced. In parallel with those researches, various new nanoelectronic devices, so called "Beyond CMOS Devices," are actively being investigated and researched to supplement or possibly replace ultimately scaled conventional CMOS devices. While those nanoelectronic devices offer ultra-high density system integration, they are still in a premature stage having many critical issues such as high variations and deteriorated reliability. The practical realization of those promising technologies requires extensive researches from device to system architecture level. In this paper, the current researches and challenges on nanoelectronics are reviewed and critical tasks are summarized from device level to circuit design/CAD domain to better prepare for the forthcoming technologies.

State-driven Business Process Transaction Management (상태 기반 비즈니스 프로세스 트랜젝션 관리)

  • Lee Sun Jae;Yun Jang Hyeok;Kim Gwang Su
    • Proceedings of the Korean Operations and Management Science Society Conference
    • /
    • 2003.05a
    • /
    • pp.772-779
    • /
    • 2003
  • In the real world, business processes are very complex and composed or heterogeneous business activities. As the advent or the Web services enables business processes to be Integrated and to be automated. It makes enterprises integrate heterogeneous business processes from different business partners as well as their internal business processes. To support recent trends in integration of business processes, BPEL, WS-E and WS-T specipications have been established since 2002 WS-C and WS-T describe the reliable business environment including compensation (undo) or completed business processes. The compensation of business processes is a basic requirement for automation or business processes among business partners. Systems implementing these specifications, however, very rarely exist. It's not only because those specifications are developed recently. but also because they are not perfect yet. In this paper, a new business process transaction management, which complements the deficiency of WS-E and WS-T, is suggested. Furthermore, the new approach proposes the business logics for supervisory coordinators which manage serial and parallel business gates The modification or traditional WS-T specification and the simplification or WS-E specification make business processes managed effectively.

  • PDF

Application of Multi-Frontal Method in Collaborative Engineering Environment

  • Cho, Seong-Wook;Choi, Young;Lee, Gyu-Bong;Kwon, Ki-Eak
    • International Journal of CAD/CAM
    • /
    • v.3 no.1_2
    • /
    • pp.51-60
    • /
    • 2003
  • The growth of the World Wide Web and the advances in high-speed network access have greatly changed existing CAD/CAE environment. The WWW has enabled us to share various distributed product data and to collaborate in the design process. An international standard for the product model data, STEP, and a standard for the distributed object technology, CORBA, are very important technological components for the interoperability in the advanced design and manufacturing environment. These two technologies provide background for the sharing of product data and the integration of applications on the network. This paper describes a distributed CAD/CAE environment that is integrated on the network by CORBA and product model data standard STEP. Several prototype application modules were implemented to verify the proposed concept and the test result is discussed. Finite element analysis server are further distributed into several frontal servers for the implementation of distributed parallel solution of finite element system equations. Distributed computation of analysis server is also implemented by using CORBA for the generalization of the proposed method.

A High Performance Solenoid-Type MEMS Inductor

  • Seonho Seok;Chul Nam;Park, Wonseo;Kukjin Chun
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • v.1 no.3
    • /
    • pp.182-188
    • /
    • 2001
  • A solenoid-type MEMS inductor with a quality factor over 10 at 2 GHz has been developed using an electroplating technique. The integrated spiral inductor has a low Q factor due to substrate loss and skin effects. It also occupies a large area compared to the solenoid-type inductor. The direction of flux of the solenoid-type inductor is parallel to the substrate, which can lower the substrate loss and other interference with integrated passive components. To estimate the characteristics of the proposed inductor over a high frequency range, the 3D FEM (Finite Element Method) simulation is used by using the HFSS at the Ansoft corporation. The electroplated solenoid-type inductor is fabricated on a glass substrate step by step by using photolithography and copper electroplating. The fabrication process to improve the quality factor of the inductor is also developed. The achieved inductance varies within a range from 0.5 nH to 2.8 nH, and the maximum Q factor is over 10.

  • PDF

A Study on the High Efficiency Ground Source Heat Pump System (1) (부하추종형 고효율 지열히트펌프 시스템에 관한 연구 (1))

  • Koh, Deuk-Yong;Kim, Ook-Joong;Choi, Sang-Kyu;Chang, Ki-Chang
    • New & Renewable Energy
    • /
    • v.1 no.4 s.4
    • /
    • pp.30-37
    • /
    • 2005
  • Cycle simulation of Ground Source Heat Pump[GSHP] system was carried out to determine the design specification of basic components such as turbo compressor and heat exchangers. Part load operation characteristics of the designed GSHP system was estimated using the compressor and heat exchanger performance data. A 50RT class turbo compressor for GSHP system is now under development, in which R134a refrigerant is adopted as working fluid. The compressor with variable cascade diffusers is designed to work both in cooling and heating modes so that it can actively keep up with the climate change with high efficiency. The normal running speeds of the compressor are 59000rpm for heating mode and 70000rpm for tooling mode respectively. It has two identical impellers at both ends of the rotor so as to minimize aero-induced thrust force effectively. GSHP system was coupled with a vortical type heat exchanger, and heat gain and heat loss from ground were evaluated per a bore hole. For the optimal integration of the heat pump system, its header for circulating fluid was combined with the ground heat exchangers in parallel and series configuration.

  • PDF

Sensor enriched infrastructure system

  • Wang, Ming L.;Yim, Jinsuk
    • Smart Structures and Systems
    • /
    • v.6 no.3
    • /
    • pp.309-333
    • /
    • 2010
  • Civil infrastructure, in both its construction and maintenance, represents the largest societal investment in this country, outside of the health care industry. Despite being the lifeline of US commerce, civil infrastructure has scarcely benefited from the latest sensor technological advances. Our future should focus on harnessing these technologies to enhance the robustness, longevity and economic viability of this vast, societal investment, in light of inherent uncertainties and their exposure to service and even extreme loadings. One of the principal means of insuring the robustness and longevity of infrastructure is to strategically deploy smart sensors in them. Therefore, the objective is to develop novel, durable, smart sensors that are especially applicable to major infrastructure and the facilities to validate their reliability and long-term functionality. In some cases, this implies the development of new sensing elements themselves, while in other cases involves innovative packaging and use of existing sensor technologies. In either case, a parallel focus will be the integration and networking of these smart sensing elements for reliable data acquisition, transmission, and fusion, within a decision-making framework targeting efficient management and maintenance of infrastructure systems. In this paper, prudent and viable sensor and health monitoring technologies have been developed and used in several large structural systems. Discussion will also include several practical bridge health monitoring applications including their design, construction, and operation of the systems.

Engineering of Guangzhou International Finance Centre

  • Kwok, Michael;Lee, Alexis
    • International Journal of High-Rise Buildings
    • /
    • v.6 no.1
    • /
    • pp.49-72
    • /
    • 2017
  • The Guangzhou International Finance Centre (IFC) is a landmark building that symbolizes the emerging international strength of Guangzhou, China's third largest city. It is also one of the dual iconic towers along the main axis of Guangzhou Zhujiang New Town. Arup adopted a total engineering approach in embracing sustainability and aiming at high efficiency solutions based on performance-based design principles covering structures, building services, fire engineering, vertical transportation, and façade performance to constitute an efficient and cost-effective overall building design. Through dynamic integration of architectural and engineering principles, Guangzhou IFC represents a pioneering supertall building in China. It adopts a diagrid exoskeleton structural form that is clearly expressed through the building's façade and gives the building its distinctive character. The aerodynamic shape of the building not only presents the aesthetic quality of elegant simplicity, but also reduces the effects of wind, thereby reducing the size and weight of the structure. State-of-the-art advanced engineering methods, such as optimization techniques and nonlinear finite element modelling, were applied in parallel with large-scale experimental programs to achieve an efficient and high-performance design taking into account the constructability and cost-effectiveness for a project of this scale.

Program Slicing in the Presence of Complicated Data Structure (복잡한 자료 구조를 지니는 프로그램 슬라이싱)

  • Ryu, Ho-Yeon;Park, Joong-Yang;Park, Jae-Heung
    • The KIPS Transactions:PartD
    • /
    • v.10D no.6
    • /
    • pp.999-1010
    • /
    • 2003
  • Program slicing is s method to extract the statements from the program which have an influence on the value of a variable at a paricular point of the program. Program slicing is applied for many applications, such as program degugging, program testing, program integration, parallel program execution, software metrics, reverse engineering, and software maintenance, etc. This paper is the study to create the exact slice in the presence of Object Reference State Graph to generate more exactly static analysis information of objects in the program of the presence of complicated data structure.