• Title/Summary/Keyword: Paper chip

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A Study on the Machinabilty of Tianium (티타늄의 절삭성에 관한 연구)

  • Hong, Hwan-Pyo;Oh, Seok-Hyung;Seo, Nam-Seop
    • Journal of the Korean Society for Precision Engineering
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    • v.6 no.1
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    • pp.45-51
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    • 1989
  • In metal cutting various types of chips are produced in consequence of cutting conditions. According to the type of chips the cutting mechanism is to be changed. Most of the cutting theory is based on the continuous chip because of its convenient analysis, but the occurrence of the saw-toothed chip depends upon the workpiece and/or the cutting conditions, one of which is titanium alloy used widely. Nowadays titanium alloys are used widely with the rapid development of aerospace structural engineering application, whereas the theory of cutting mechanism has not been established yet, and the formatting process has not been understood satisfactorily, either. Unfortunately several misconceptions, conflicting statements and statements needing further clarifi- cation are also found. In this paper an attempt is made to clarify the formation process of saw-toothed chips which are to be produced during the orthogonal cutting process of titanium alloys. They were machined at low speed to avoid the rapid tool wear. We observed the SEM-photographs of chips taken at the quick-st- opping device. It is hoped that a rational model of the mechanics of cyclic chip formation can be developed. The results obtained are as follows. 1. When a saw- toothed chip is formed, the shear band begins at the primary shear zone and trans- fers to the free surface, so that a segment is produced and it is completed by upsetting between the formatting segment and the formatted segment. 2. As the rake angle or the clearance angle increases in the machining of the titanium alloy, the chip approaches to that of the continous type. 3. When the rake angle and the clearance angle are increased the shear energy and the unit friction energy decrease, which shows the same aspect as that of the continuous chip.

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On-Chip Design-for-Testability Circuit for RF System-On-Chip Applications (고주파 시스템 온 칩 응용을 위한 온 칩 검사 대응 설계 회로)

  • Ryu, Jee-Youl;Noh, Seok-Ho
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.15 no.3
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    • pp.632-638
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    • 2011
  • This paper presents on-chip Design-for-Testability (DFT) circuit for radio frequency System-on-Chip (SoC) applications. The proposed circuit measures functional specifications of RF integrated circuits such as input impedance, gain, noise figure, input voltage standing wave ratio (VSWRin) and output signal-to-noise ratio (SNRout) without any expensive external equipment. The RF DFT scheme is based on developed theoretical expressions that produce the actual RF device specifications by output DC voltages from the DFT chip. The proposed DFT showed deviation of less than 2% as compared to expensive external equipment measurement. It is expected that this circuit can save marginally failing chips in the production testing as well as in the RF system; hence, saving tremendous amount of revenue for unnecessary device replacements.

Design of a High Speed Asymmetric Baseband MODEM ASIC Chip for CATV Network (CATV 망용 고속 비대칭 기저대역 모뎀 ASIC 칩 설계)

  • 박기혁
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.25 no.9A
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    • pp.1332-1339
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    • 2000
  • This paper presents the architecture and design of a high speed asymmetric data transmission baseband MODEM ASIC chip for CATV networks. The implemented MODEM chip supports the physical layer of the DOCSIS(Data Over Cable Service Interface Specification) standard in MCNS(Multimedia Cable Network System) The chip consists of a QPSK/16-QAM transmitter and a 64/256-QAM receiver which contain a symbol timing recovery circuit, a carrier recovery circuit, a blind equalizer using MMA and LMS algorithms. The chip can support data rates of 64Mbps at 256 QAM and 48Mbps at 64-QAM and can provide symbol rates up to 8MBaud. This symbol rate is faster than existing QAM receivers. We have performed logic synthesis using the $0.35\mu\textrm{m}$ standard cell library. The total number of gates is about 290,000 and the implemented chip is being fabricated and will be delivered soon.

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Intelligent silicon bead chip design for bio-application (바이오 응용을 위한 지능형 실리콘 비드 칩 설계)

  • Moon, Hyung-Geun;Chung, In-Young
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.16 no.5
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    • pp.999-1008
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    • 2012
  • Unlike the existing CMOS chip, ISB (Intelligent Silicon Bead) is new concept biochip equipped with optical communication and memory function. It uses the light for power of SoC CMOS and interface with external devices therefore it is possible to miniaturize a chip size and lower the cost. This paper introduces an input protocol and a design of the low power and the low area to transfer the power and the signal through a single optical signal applied from external reader device to bead chip at the same time. It is also verified through simulation and measurement. In addition, low-power PROM is designed for recording and storing ID of a chip and it is successful in obtaining the value of output according to the optical input. Through this study, a new type biochip development can be expected by solving high cost and a limit of miniaturizing a chip area problem of an existing RFID.

Analysis of Cutting Characteristic of the Sapphire Wafer Using a Internal Laser Scribing Process for LED Chip (LED 칩 제조용 사파이어 웨이퍼 절단을 위한 내부 레이저 스크라이빙 가공 특성 분석)

  • Song, Ki-Hyeok;Cho, Yong-Kyu;Kim, Byung-Chan;Kang, Dong-Seong;Cho, Myeong-Woo;Kim, Jong-Su;Ryu, Byung-So
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.16 no.9
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    • pp.5748-5755
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    • 2015
  • Scribing is cutting process to determine production amount and characteristic of LED chip. So it is an important process for fabrication of LED chip. Mechanical process and conventional scribing process with laser source has several problems such as thermal deformation, decreasing of material strength and limitation of cutting region. To solve these problems, internal laser scribing process that generates void in wafer and derives self-crack has been researched. However, studies of sapphire wafer cutting by internal laser scribing process for fabrication of LED chip are still insufficient. In this paper, cutting parameters were determined to apply internal laser scribing process for sapphire wafer for fabrication of LED chip. Then, foundation of cutting condition was established to set up internal laser scribing system through investigation of cutting characteristics by several experiments.

Development of Combinational 2-Way Isohybrid for GSM1900 Base Station (GSM1900 기지국용 일체형 2-Way Isohybrid의 개발)

  • Park, Noh-Joon;Jung, Seung-Woo;Kang, Young-Jin;Choi, U-Sung
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.11 no.8
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    • pp.1415-1423
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    • 2007
  • Total efficiency of transmitter system was improved by developing combinational 2-Way Isohybrid for GSM1900 base station in this paper. The size of product was decreased and the characteristics were stabilized. The isohybrid transmitter combiner of chip coupler type and hybrid coupler type were designed and fabricated. Insertion loss for chip coupler type isohybrid was $3.17\;dB{\sim}3.47\;dB$. On the other hand, insertion loss for hybrid coupler type was $3.17\;dB{\sim}3.42\;dB$. Isolations between ANT and port were $24.23\;dB{\sim}29.98\;dB$ in case of chip coupler type Isohybrid and were $26.28\;dB{\sim}36.91\;dB$ in case of hybrid coupler type, respectively.

A Study on Characteristics of Triple-band Plastic Chip Antenna for Mobile Terminal using Foamex Materials (Formax 매질을 이용한 이동통신 단말기용 삼중대역 플라스틱 칩 안테나에 관한 연구)

  • Lee, Young-Hun;Song, Sung-Hae
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.11 no.12
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    • pp.2210-2216
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    • 2007
  • In this paper, triple-band plastic chip antennas for mobile terminal are investigated. Plastic chip antenna is composed of Foamex material with circle of PVC(Polyvilyl chloride). For its electric characteristics, the dielectric constant is 1.9, the insulation intensity is 112KV/cm. Plastic chip antennas are don't tend to break easily against to external shock, have more gain and efficiency than ceramic chip antennas. Triple-band plastic chip antennas of four type are implemented and experimented. From the experiments results, the antenna resonate at the triple-band, the gain of the antennas has about above -2dB, the pattern is ommidirectional the same as the conventional antennas. So, the antennas realized with Foamex material will be application for mobile phone antenna operated at the triple band which is cellular band and Korea-PCS band and ISM band or the antenna for other wireless communication system.

Key Distribution Protocol Appropriate to Wireless Terminal Embedding IC Chip (IC 칩을 내장한 무선 단말기에 적용 가능한 키 분배 프로토콜)

  • 안기범;김수진;한종수;이승우;원동호
    • Journal of the Korea Institute of Information Security & Cryptology
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    • v.13 no.4
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    • pp.85-98
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    • 2003
  • Computational power of IC chip is improved day after day producing IC chips holding co-processor continuously. Also a lot of wireless terminals which IC chip embedded in are produced in order to provide simple and various services in the wireless terminal market. However it is difficult to apply the key distribution protocol under wired communication environment to wireless communication environment. Because the computational power of co-processor embedded in IC chip under wireless communication environment is less than that under wired communication environment. In this paper, we propose the hey distribution protocol appropriate for wireless communication environment which diminishes the computational burden of server and client by using co-processor that performs cryptographic operations and makes up for the restrictive computational power of terminal. And our proposal is satisfied with the security requirements that are not provided in existing key distribution protocol.

Similarity Evaluation and Analysis of Source Code Materials for SOC System in IoT Devices (사물인터넷 디바이스의 집적회로 목적물과 소스코드의 유사성 분석 및 동일성)

  • Kim, Do-Hyeun;Lee, Kyu-Tae
    • Journal of Software Assessment and Valuation
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    • v.15 no.1
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    • pp.55-62
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    • 2019
  • The needs for small size and low power consumption of information devices is being implemented with SOC technology that implements the program on a single chip in Internet of Thing. Copyright disputes due to piracy are increasing in semiconductor chips as well, arising from disputes in the chip implementation of the design house and chip implementation by the illegal use of the source code. However, since the final chip implementation is made in the design house, it is difficult to protect the copyright. In this paper, we deal with the analysis method for extracting similarity and the criteria for setting similarity judgment in the dispute of source code written in HDL language. Especially, the chip which is manufactured based on the same specification will be divided into the same configuration and the code type.

Analysis of W-CDMA system for different number of users over JTC channel model (JTC 채널 모델에서 W-CDMA의 사용자 수에 대한 성능 분석)

  • 이주석;오동진;김철성
    • Proceedings of the IEEK Conference
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    • 2000.06a
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    • pp.25-28
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    • 2000
  • In this paper, we assume various number of multipaths in one chip duration according to spreading bandwidth. And we take into account of the effects of autocorrelation and relative phases among multipath components within one chip duration, and analyze fading effects. We derive the average error probability for different number of users. Then, we compare the performance of W-CDMA systems with different bandwidths. From the simulation results for different band-widths, wideband CDMA systems show better performance than narrowband CDMA systems in vehicular and pedestrian environments.

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