• IEMEK Journal of Embedded Systems and Applications
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• v.14 no.2
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• pp.103-111
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• 2019

The IoT-driven large-scaled systems consist of connected things with on-chip executable embedded software. These light-weighted embedded things have limited hardware space, especially small size of on-chip flash memory. In addition, on-chip embedded software in flash memory is not easy to update in runtime to equip with latest services in IoT-driven applications. It is becoming important to develop light-weighted IoT devices with various software in the limited on-chip flash memory. The remote instruction execution in cloud via IoT connectivity enables to provide high performance software execution with unlimited software instruction in cloud and low-power streaming of instruction execution in IoT edge devices. In this paper, we propose a Cloud-IoT asymmetric structure for providing high performance instruction execution in cloud, still low power code executable thing in light-weighted IoT edge environment using remote instruction execution. We propose a simulated approach to determine efficient partitioning of software runtime in cloud and IoT edge. We evaluated the instruction cloudification using remote instruction by determining the execution time by the proposed structure. The cloud-connected instruction set simulator is newly introduced to emulate the behavior of the processor. Experimental results of the cloud-IoT connected software execution using remote instruction showed the feasibility of cloudification of on-chip code flash memory. The simulation environment for cloud-connected code execution successfully emulates architectural operations of on-chip flash memory in cloud so that the various software services in IoT can be accelerated and performed in low-power by cloudification of remote instruction execution. The execution time of the program is reduced by 50% and the memory space is reduced by 24% when the cloud-connected code execution is used.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.41 no.5
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• pp.19-25
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• 2004

In this paper, we propose optimal and suboptimal serial code acquisition schemes for chip-asynchronous direct-sequence spread-spectrum systems. The conventional serial code acquisition scheme is to compare each value of correlator outputs with a threshold individually. However, such a scheme is optimum only under the chip-synchronous assumption which is actually very difficult to be held prior to acquisition at the receiver because the signal-to-noise ratios before despreading are very low. In this paper, an optimal serial code acquisition scheme is derived based on the maximum-likelihood criterion under the more realistic and general chip-asynchronous environments. A suboptimal scheme, which is simpler but yields comparable performance to the optimal one, is also derived based on the criterion of local detection power Numerical results show that, under the chip-asynchronous environments, both the optimal and suboptimal serial code acquisition schemes outperform the conventional serial code acquisition scheme.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.1
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• pp.329-332
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• 2012

LEDs are using widely in a field of illumination, LCD LED backlight, mobile signals because they have several merits, such as low power consumption, long lifetime, high brightness, fast response, environment friendly. To achieve high performance LEDs, one needs to enhance output power, reduce operation voltage, and improve device reliability. In this paper, we have proposed that the optimum design and specialized process could improve the performance of LED chip. It was showed an output power of 7cd and input supplied voltage of 3.2V by the insertion technique of current blocking layer. In this paper, GaN-based LED chip which is built on the sapphire epi-wafer by selective MOCVD were designed and developed. After that, their performances were measured. It showed the output power of 7cd more than conventional GaN-based chip. It will be used the lighting source of a medical equipment and LCD LED TV with GaN-based LED chip.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• The KIPS Transactions:PartA
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• v.13A no.7 s.104
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• pp.589-598
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• 2006

In this paper, we describe the development and optimization of an embedded Biuetooth solution on an SoC platform for real-time audio streaming over a Bluetooth wireless link. The solution includes embedded Bluetooth protocol stack and profile simplemented on a virtual operating system for portability, and other optimization techniques to fully exploit the benefits of multimedia-oriented SoC. The optimization techniques implemented in this paper are memory access minimization by using on-chip scratch pad memory, codec library optimization with DSP and parallel memory access instruction set, and dynamic audio quality adjustment regarding current wireless link status. Experimental results show that the optimized solution presented in this paper can support high-qualify audio streaming without the support of external memory.

• Journal of the Korean Wood Science and Technology
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• v.43 no.1
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• pp.122-134
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• 2015

This study was conducted to investigate the potential of torrefied larch wood as a raw material of pellets. First of all, larch chip was torrefied at the temperatures of 230, 250 and $270^{\circ}C$ for 30, 50 and 70 min. Secondly, moisture content, moisture absorption, higher heating value and ash content of the torrefied chip were measured to examine the effects of torrefaction conditions on the fuel characteristics of larch. Thirdly, surfaces of the torrefied chip were observed by light microscope (LM), field emission scanning microscope (FE-SEM) and SEM-energy dispersive spectroscopy (EDXS). With the increases of torrefied temperature and time, contents of lignin increased and those of hemicellulose reduced. Moisture content of torrefied larch chip was greatly lower than that of non-torrefied chip. Moisture absorption of the torrefied chip decreased as torrefaction temperature increased. As torrefaction temperature increased, higher heating value and ash content of larch chip increased. However, durability of torrefied-larch pellets was remarkably lower comparing to non-torrefied-larch pellets. When surface of larch chip was observed by LM and FE-SEM, surface color and cell wall of the chip was getting darker and more collapsed with the increases of torrefaction conditions. Through the analysis of SEM-EDXS, distribution and quantity of lignin existing on the surface of larch chip increased with the increases of torrefied conditions. In conclusion, $270^{\circ}C$/50 min might be an optimal condition for the torrefaction of larch with the aspect of fuel characteristics, but torrefaction condition of $230^{\circ}C$/30 min should be considered according to the durability of torrefied-larch pellets.

• Journal of IKEEE
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• v.9 no.2 s.17
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• pp.101-107
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• 2005

This paper presents an one-chip controller for an electronic dispenser. The electronic dispenser is composed of electronic part and mechanical part. The electronic part is consisted of input keypad, micro-controller, display module, and pump module. In this paper we designed micro-controller for the electronic part. The micro-controller controls display module and pump module. The display module is composed by LCD device, and the pump module is composed by motor device . The micro-controller for an electronic dispenser is designed by VHDL. We used WX12864AP1 for the LCD device and SPS20 for the stepping motor. Also, the micro-controller is designed by Altera Quartus tool and verified with Agent 2000 Design-kit using APEX20K Device. In this paper, we present possibility to adopt of the biomedical device through the one-chip controller for the electronic dispenser.

• Journal of IKEEE
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• v.25 no.3
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• pp.517-527
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• 2021

This paper presents the phase-shift full-bridge DC-DC converter using the one-chip micom. The proposed converter primary is the full-bridge power topology that operates with the unipolar pulse-width modulation (PWM) by the phase-shift method, and the secondary is the full-bridge full-wave rectifier composed of four diodes. The control of proposed converter is performed by the one-chip micom and its MOSFET switches are driven by the bootstrap circuit. Thus the total system of proposed converter is simple. The proposed converter achieves high-efficiency using the resonant circuit and blocking capacitor. In this paper, first, the power-circuit operation of proposed converter is explained according to each operation mode. And the power-circuit design method of proposed converter is shown, and the software control algorithm on the micom and the feedback and switch drive circuits operating the proposed converter are described, briefly. Then, the operation characteristics of proposed converter are validated through the experimental results of a designed and implemented prototype converter by the shown design and implementation method in this paper. The highest efficiency in the results was about 92%.

• Design & Manufacturing
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• v.13 no.4
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• pp.10-16
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• 2019

Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip bonding is applied by a Reflow process or a Thermo-Compression(TC) bonding process. In this paper, we introduce a Laser Assisted Thermo-Compression bonding (LATCB) process to improve the anxiety of the existing process(Reflow, TC bonding). In the LATCB process, the chip is bonded to the substrate by irradiating a laser with a uniform energy density in the same area as the chip to melt only the solder bumps and press the chip with a Transparent Compression Module (TCM). The TCM consists of a fused silica header for penetrating the laser and pressurizing the chip, and a piezoelectric actuator (P.A.) coupled to both ends of the header for micro displacement control of the header. In addition, TCM is a structure that can pressurize the chip and deliver it to the chip and solder bumps without losing the energy of the laser. Fused silica, which is brittle, is vulnerable to deformation, so the header may be damaged when an external force is applied for pressurization or a displacement differenced is caused by piezoelectric actuators at both ends. On the other hand, in order to avoid interference between the header and the adjacent chip when pressing the chip using the TCM, the header has a notch at the bottom, and breakage due to stress concentration of the notch is expected. In this study, the thickness and notch length that the header does not break when the external force (500 N) is applied to both ends of the header are optimized using structural analysis and Coulomb-Mohr failure theory. In addition, the maximum displacement difference of the P.A.s at both ends where no break occurred in the header was derived. As a result, the thickness of the header is 11 mm, and the maximum displacement difference between both ends is 8 um.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.05a
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• pp.681-684
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• 2008

In this paper, triple band mobile chip antenna for DCS($1.71{\sim}1.88GHz$) / PCS($1.75{\sim}1.87GHz$) / UPCS($1.85{\sim}1.99GHz$) on PCB Layout is fabricated. As designed and fabricated antenna is loaded PCB layout, that plate a both side at two independence patterns(upper & lower) to reduce the size and a capacitor for DCS, PCS, UPCS band is proposed. The antenna has a small size of about $19mm{\times}4mm{\times}1.6mm$, narrow bandwidth which is the defect of chip antenna is improved. Bandwidth of fabricated antenna to VSWR less than 2 is satisfied and all bandwith is acquired 15.1 % at $1.71GHz{\sim}1.99GHz$.