• 한국세라믹학회지
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• 제44권2호
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• pp.98-102
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• 2007

The stability of slurry and removal rate during recycling of colloidal silica slurry was evaluated in silicon wafer polishing. The particle size distribution, pH, and zeta potential were measured to investigate the stability of colloidal silica. Large particles appeared as recycling time increased while average size of slurry did not change. Large particles were identified by EDS(energy dispersive spectrometer) as foreign substances from pad or abraded silicon flakes during polishing. As the recycling time increased, pH of slurry decreased and removal rate of silicon reduced but zeta potential decreased inversely. Hence, it could be mentioned that decrease of removal rate is related to consumption of $OH^-$ ions during recycling. Attention should be given to the control of pH of slurry during polishing.

• Tribology and Lubricants
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• 제18권3호
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• pp.204-210
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• 2002

Automotive brake pads with four different sizes of zircon particles (average sizes of 1㎛, 6㎛, 75㎛, and 140㎛, respectively) were investigated to evaluate the size effect of abrasive particles on friction performance. Results showed that the brake pads with the larger size of zircon particles tend to show better frictional stability and low pad wear. However, the rotor surface was severely abraded in the case of using larger zircon particles. On the other hand, the small zircon particles in the pads showed the fast increase of the coefficient of friction with friction force oscillation and the tendency was pronounced at low sliding speeds. The brake pads with small particle sizes also exhibited strong fade phenomena at elevated temperatures.

• 한국분말재료학회지
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• 제11권6호
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• pp.522-527
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• 2004

Nano sized FeAl intermetallic particles were successfully synthesized by plasma arc discharge pro-cess. The synthesized powders shouted core-shell structures with the particle size of 10-20 nm. The core was metallic FeAl and shell was composed of amorphous $AI_{2}O_{3}\;and\;a\;little\;amount\;of\;metallic\;Fe_{3}O_{4}.$ Because of the difference of Fe and Al vapor pressure during synthesis, the Al contents in the nanoparticles depended on the Al contents of master alloy.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.245-247
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• 2007

Sn-base solder bump is mainly used in micro-joining for flip chip package. The quantity of intermetallic compounds that was formed between Cu pad and solder interface importantly affects reliability. In this research, micro-bump was fabricated by two binary electroplating and the intermetallic compounds(IMCs) was estimated quantitatively. When the micro Sn-Ag solder bump was made by electroplating, SiC powder was added in the plating solution for protecting of intermetallic growth. Then, the intermetallic compounds growth was decrease with increase of amount of SiC power. However, if the mount of SiC particle exceeds 4 g/L, the effect of the growth restraint decrease rapidly.

• 한국분말재료학회지
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• 제18권2호
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• pp.112-121
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• 2011

This study investigated the effect of solvent on the fabrication of Ni-free Fe-based alloy nano powders by employing the PWE (pulsed wire evaporation) in liquid and compared the alloy particles fabricated by three different methods (PWE in liquid, PWE in Ar, plasma arc discharge), for high temperature oxidation-resistant metallic porous body for high temperature soot filter system. Three different solvents (ethanol, acetone, distilled water) of liquid were adapted in PWE in liquid process, while X-ray diffraction (XRD), field emission scanning microscope (FE-SEM), and transmission electron microscope (TEM) were used to investigate the characteristics of the Fe-Cr-Al nano powders. The alloy powder synthesized by PWE in ethanol has good particle size and no surface oxidation compared to that of distilled water. Since the Fe-based alloy powders, which were fabricated by PWE in Ar and PAD process, showed surface oxidation by TEM analysis, the PWE in ethanol is the best way to fabricate Fe-based alloy nano powder.

• 한국전기전자재료학회논문지
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• 제17권10호
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• pp.1049-1055
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• 2004

Chemical Mechanical Polishing (CMP) is referred to as a three body tribological system, because it includes two solids in relative motion and the CMP slurry. On the assumption that the abrasives between the pad and the wafer could be a major reason not only for the friction force but also for material removal during polishing, the friction force generated during CMP process was investigated with the change of abrasive size and concentration of CMP slurry. The threshold point of average coefficient of friction (COF) with increase in abrasives concentration during interlayer dielectric (ILD) CMP was found experimentally and verified mathematically based on contact mechanics. The predictable models, Mode I (wafer is in contact with abrasives and pad) and Mode II (wafer is in contact with abrasives only), were proposed and used to explain the threshold point. The average COF value increased in the low abrasives concentration region which might be explained by Mode I. In contrast the average COF value decreased at high abrasives concentration which might be regarded to as Mode II. The threshold point observed seemed to be due to the transition from Mode I to Mode II. The tendency of threshold point with the variation of abrasive size was studied. The increase of particle radius could cause contact status to reach transition area faster. The correlation between COF and material removal rate was also investigated from the tribological and energetic point of view. Due to the energy loss by vibration of polishing equipment, COF value is not proportional to the material removal rate in this experiment.

• 한국재료학회지
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• 제14권7호
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• pp.511-515
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• 2004

Fe nano powders were synthesized by plasma arc discharge (PAD) process and studied by means of X-ray Diffraction (XRD), Transmission Electron Microscopy (TEM) and X-ray Photoelectron Spectroscopy (XPS). Pure Fe rod($99.9\%$) was used as a source of metallic vapor under argon and hydrogen mixed atmosphere. The synthesized Fe nano powders had nearly spherical shapes and core-shell type structures. The influence of process parameters on the structure and size was investigated. The powder size increased with increasing of the chamber pressure and input current. High hydrogen gas ratio in chamber atmosphere affected the particle size and amount of Fe nanopowder.

• 한국대기환경학회지
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• 제28권6호
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• pp.675-687
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• 2012

Applying an external electric field across air filter media is one of methods to improve the filtration performance. Metal wire meshes have been commonly used as electrodes situated on both sides of a thick filter pad. For a thin filter medium a short circuit, known as the biggest drawback for applying an external electric field to air filter, can occur at the closest point between electrodes. In this study several types of insulated meshes were prepared by coating #50 meshes with a dielectric material, Nylon 66, and the filtration property of air filter was evaluated at the presence of external electric field using those insulated meshes as electrodes and compared with that of filters using bared meshes. The collection efficiency of tested filter was increased from 78% to 95% for singly charged 100 nm particles by application of external electric field. As a result, there was no significant difference in collection efficiency between filters with insulated and bared electrodes. Similar results could be also seen from the tests using polydisperse particles. Finally, through this study, we found that the insulation of mesh electrodes doesn't affect the filtration performance of fibrous air filter under external electric field.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 반도체재료
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• pp.30-33
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• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter-level dielectrics (ILD). Especially, defects like micro-scratch lead to severe circuit failure, and affects yield. CMP slurries can contain particles exceeding $1{\mu}m$ size, which could cause micro-scratch on the wafer surface. The large particles in these slurries may be caused by particle agglomeration in slurry supply line. To reduce these defects, slurry filtration method has been recommended in oxide CMP. In this work, we have studied the effects of filtration and the defect trend as a function of polished wafer count using various filters in inter-metal dielectric(IMD)-CMP. The filter installation in CMP polisher could reduce defect after IMD-CMP. As a result of micro-scratches formation, it shows that slurry filter plays an important role in determining consumable pad lifetime.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2001년도 제33회 춘계학술대회 개최
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• pp.55-63
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• 2001

Friction and wear properties of brake friction materials containing different metal fibers (Al, Cu or Steel fibers) were investigated using a pad-on-disk type friction tester. Two different materials(gray iron and Al-MMC)) were used for disks rubbing against the friction materials. Results from ambient temperature tests revealed that the friction material containing Cu fibers sliding against cast iron disk showed a distinct negative ${\mu}$-ν (friction coefficient vs. sliding velocity) relation implying possible stick-slip generation at low speed. The negative ${\mu}$-ν relation was not observed when the Cu-containing friction materials were rubbed against the. Al-MMC counter surface. As applied loads increased, friction materials showed higher friction coefficients comparatively. Friction materials slid against cast iron disks exhibited higher friction coefficients than Al-MMC disks during high temperature tests. On the other hand, high temperature test results suggested that copper fibers in the friction material improved fade resistance and the steel fibers were not compatible with Al-MMC disks showing severe material transfer and erratic friction behavior during sliding at elevated temperatures.