• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.5
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• pp.385-389
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• 2003

There are four main components of the CMP process: polishing pad, slurry, elastic supporter, and pad conditioner. The polishing pad is an essential component to the reproducibility of polishing uniformity in CMP process. However, the polishing pad in recently using metal CMP raised the several points of high cost caused by the increase of cycle time and the many usage of slurry. It is necessary to develop the novel polishing pad which would lead the cost reduction by the higher pad life-cycle, minimized cycle time and lower slurry usage. The characteristics of polishing pad were studied on the effects of different sets of the Polishing pad, which can be applied to metal chemical mechanical polishing process for global planarization of multilevel interconnection structure. The main purpose of this experiment is cost reduction by the increase of pad life-time, the decrease of cycle time and the lower usage of slurry through the specific hard porous structured pad design. It is confirmed that the novel polishing pad made the slurry usage decrease to 60% as well as the pad life-time increase twice with the 25% improvement of removal rate. The polishing time could be decreased and it also helped the cycle time to diminish. It can be expected that this results will help both the process throughput and the device yield to be improved.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.178-181
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• 2002

We studied the characteristics of polishing pad, which can apply W CMP process for global planarization of multilevel interconnection structure. Also we investigated the effects of different sets of polishing pad. The purpose of this experiment is the cost reduction by the increase of pad life time and decrease of cycle time and slurry usage with new pad. Especially we studied the effect of polishing pad for CMP process by this experiment of polishing pad that is consumables material during CMP process. We expecting the increase of process throughput and improvement of device manufacturing yield because we can choose optimum polishing pad through this result.

• Elastomers and Composites
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• v.54 no.4
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• pp.351-358
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• 2019

To evaluate the aging of a rubber pad in power window switch which is the part of a vehicle, the accelerated thermal aging test of rubber pad material is performed. Finite element analysis was performed using the nonlinear material constants of the rubber pad to calculate the operating force, and the Arrhenius relationship was derived from the aging temperature and time. The aging test was performed at 150, 180, 210, or 240 ℃ for 1 to 60 days. When the operating force of the rubber pad is changed by 10% from the initial value, the service life is expected to be 113 years, which is much longer than the life of the vehicle. This indicates that the aging life of the rubber pad is sufficiently safe and the operating force of the rubber pad during the life of the vehicle (20 years) was decreased by approximately 8.4%. By examining the correlation between the shear elastic modulus and operating force calculated from finite element analysis under each aging test condition, the changes in the operating force of the rubber pad and the shear elastic modulus showed good linear relationship. The aging life could be predicted by the change in shear elastic modulus and a process for predicting the aging life of automotive power window switch rubber pad parts is described herein.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.171-175
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• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics and metal, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter level dielectrics and metal. Especially, defects like (micro-scratch) lead to severe circuit failure, and affects yield. Current conditioning method - bladder type, orbital pad motion- usually provides unsuitable pad profile during ex-situ conditioning near the end of pad life. Since much of the pad wear occurs by the mechanism of bladder type conditioning and its orbital motion without rotation, we need to implement new ex-situ conditioner which can prevent abnormal regional force on pad caused by bladder-type and also need to rotate the pad during conditioning. Another important study of ADPC is related to the orbital scratch of which source is assumed as diamond grit dropped from the strip during ex-situ conditioning. Scratch from diamond grit damaged wafer severely so usually scraped. Figure 1 shows the typical shape of scratch damaged from diamond. e suspected that intensive forces to the edge area of bladder type stripper accelerated the drop of Diamond grit during conditioning. so new designed Flat stripper was introduced.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.7
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• pp.22-29
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• 2004

As a result of high integration of semiconductor device, the global planarization of multi-layer structures is necessary. So the chemical mechanical polishing(CMP) is widely applied to manufacturing the dielectric layer and metal line in the semiconductor device. CMP process is under influence of polisher, pad, slurry, and process itself, etc. In comparison with the general CMP which uses the slurry including abrasives, fixed abrasive pad takes advantage of planarity, resulting from decreasing pattern selectivity and defects such as dishing & erosion due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of fixed abrasive pad using hydrophilic polymers with swelling characteristic in water and explains the self-conditioning phenomenon. And the tungsten CMP using fixed abrasive pad achieved the good conclusion in terms of the removal rate, non-uniformity, surface roughness, material selectivity, micro-scratch free contemporary with the pad life-time.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.8
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• pp.739-744
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• 2009

Rail-pad is an important and readily replaceable component of a railway track, as it is the elastic layer between the rail and the sleeper. Characteristics and useful lifetime prediction of rail-pad was very important in design procedure to assure the safety and reliability. In this paper, the degradation of rail pad properties as a function of their in-service life is studied with a view of developing a technique for predicting the optimum period of track maintenance with regard to pad replacement. In order to investigate the useful lifetime, the accelerate test were carried out. Accelerated test results changes as the threshold are used for assessment of the useful life and time to threshold value were plotted against reciprocal of absolute temperature to give the Arrhenius plot. By using the acceleration test, several useful lifetime prediction for rail-pads were proposed.

• Proceedings of the KSR Conference
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• 2008.06a
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• pp.923-931
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• 2008

Coupling rubber pad are important components in railway vehicles. It can be used for reduce shock, vibration and noise. Simple tension, equi-biaxial tension and pure shear test were performed to acquire the coefficient of rubber material which were Mooney-Rivlin and Ogden model. The finite element analysis was executed to evaluate the behavior of deformation and stress distribution by using the commercial finite element analysis code. Useful life evaluation are very important in design procedure to assure the safety and reliability of the rubber components. In this paper, useful life prediction of rubber pad for railway vehicle were experimentally investigated. Accelerated heat-aging test for rubber material were carried. Compression set results changes as the threshold are used for assessment of the useful life and time to threshold value were plotted against reciprocal of absolute temperature to give the Arrhenius plot.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2001.06a
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• pp.236-242
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• 2001

In this paper the effect of bump compliance, load, and the number of pad on the lift-off speed is studied. When the load is greater and bump compliance lower, the shaft is lifted off at higher rotating speed. And when the load is applied near the center of pad, lift-off speed is lower. When the number of pad increases, the lift-off speed is higher. The lift-off characteristics can be used to lengthen the life time of the coating and design the rotating machinery supported by bump bearings.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.171-175
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• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics and metal, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter level dielectrics and metal. Especially, defects like (micro-scratch) lead to severe circuit failure, and affects yield. Current conditioning method - bladder type, orbital pad motion - usually provides unsuitable pad profile during ex-situ conditioning near the end of pad life. Since much of the pad wear occurs by the mechanism of bladder tripe conditioning and its orbital motion without rotation, we need to implement new ex-situ conditioner which can prevent abnormal regional force on pad caused by bladder-type and also need to rotate the pad during conditioning. Another important study of ADPC is related to the orbital scratch of which source is assumed as diamond grit dropped from the strip during ex-situ conditioning. Scratch from diamond grit damaged wafer severely so usual1y scraped. Figure 1 shows the typical shape of scratch damaged from diamond. We suspected that intensive forces to the edge area of bladder type stripper accelerated the drop of Diamond grit during conditioning, so new designed Flat stripper was introduced.

• Elastomers and Composites
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• v.53 no.4
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• pp.220-225
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• 2018

Resilient pads play a major role in reducing the impact of loads on a rail in a rail-fastening system, which is essentially used for a concrete track. Although a compression set test is commonly used to measure the durability of a resilient pad, the static spring constant is often observed to be different from the fatigue test. In this study, a modified compression set test method was proposed to monitor the variations in the compression set and static spring constant of a resilient pad with respect to temperature and time. In addition, the life of the resilient pad was predicted by performing an acceleration test based on the Arrhenius equation.