• 제목/요약/키워드: Packing Density

검색결과 321건 처리시간 0.027초

$CaO-P_2O_5-SiO_2$계 유리의 물성 (Properties of $CaO-P_2O_5-SiO_2$ Glasses)

  • 조정식;김철영
    • 한국세라믹학회지
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    • 제30권4호
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    • pp.289-298
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    • 1993
  • Properties in terms of the variation of the glass compositions, which were density (p), molar volume(Vm), atom/ion packing density (Dp), refractive index (nD), transformation temperature (Tg), dilatometric softening point (Td), thermal expansion coefficient (α), Young's modulus (E), and knoop hardness (KHN) were investigated in CaO-SiO2 glasses and CaO-P2O5-SiO2 glasses containing less than 10mole% of P2O5. Those properties were measured by density measurement kit, Abbe refractometer, dilatometer, ultrasonic pulse echo equipment, and micro hardness tester. When CaO content was increased in CaO-SiO2 glasses, p, Dp, nD, Tg, Td, α, E and KHN were increased, while Vm was decreased. When P2O5 was added to the CaO-SiO2 glasses with constant CaO/SiO2 ratio as 1.07, p, Dp, nD, Tg, Td, α, E and KHN were decreased, while Vm was increased. When the amount of P2O5 in glasses was kept constant, the changes of the properties with variation of CaO content in the CaO-P2O5-SiO2 glasses were very similar to those of CaO-SiO2 glasses. These phenomena could be explained by the structural role of P2O5 in the CaO-P2O5-SiO2 glasses, which was polymerization of siicate structures and resulted in [PO4] monomer structure in glasses. Due to this structural characteristics, the bond strength and packing density were changed with compositions. Proportional relationships between 1) np and Dp, 2) Tg, Td, α and CaO content, 3) E and Vm-1, and 4) KHN and P2O5 content were evaluated in this investigation.

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Fabrication of Inkjet-printed and Non-sintered $BaTiO_3$ Dielectric Film

  • Lim, Jong-Woo;Kim, Ji-Hoon;Kim, Hyo-Tea;Yoon, Young-Joon;Yoon, Ho-Gyu;Kim, Jong-Hee
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.80-80
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    • 2009
  • $BaTiO_3$ has high permittivity so that has been applied to dielectric and insulator materials in 3D system-level package integration. In order to achieve excellent performance of device, the $BaTiO_3$ layer should be highly dense. In this study, $BaTiO_3$ thick films were prepared by the inkjet printing method using 4 vol.% $BaTiO_3$ colloidal inks and cured at $28^{\circ}C$ for 5 h after infiltration of polymer resin for non-sintered process using 3 vol.% cyanate ester emulsion ink. From the obtained results. packing density was determined to be improved by overlapping rabbit ears which were generated by coffee ring effect. We also calculated the packing densities of the films and correlated these packing densities to the measured permittivity of the films.

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분말 충전 성형법을 이용한 SiC-Al Alloy 복합체의 제조 (Preparation of SiC-Al alloy Composite by Pressureless Powder Packing Forming Method)

  • 박정현;송준광;백승수;염강섭;강민수
    • 한국세라믹학회지
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    • 제34권4호
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    • pp.343-350
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    • 1997
  • To fabricate the ceramic/metal(SiC/ Al alloy) composite, SiC preform was prepared by Pressureless Powder Packing Forming Method and 6061 Al alloy was infiltrated into the preform. Uniform compact having an average pore size of 10 ${\mu}{\textrm}{m}$ and narrow pore size distribution was prepared. Phenolic resin solution(40 wt%) was penetrated into the SiC compact, and then the compact was preheated at the temperature of 120$0^{\circ}C$. The pore size distribution and the microstructure of the preform were not changed by preheating. An uniform microstructure without any crack in the preform was obtained in SiC-Al alloy composite. The infiltration of 6061. Al alloy into the preform began at the temperature of 130$0^{\circ}C$ and the amount of infiltration increased in proportion to the infiltration temperature and the soaking time. The increasement rate of the infiltration amount decreased after 3 h. As a result of the infiltration at 140$0^{\circ}C$ for 4 h, Al alloy was well distributed in the interparticle channels and the relative density of the composite was above 98%. The strength and the fracture toughness of the composite were 303 MPa and 21.65 MPam1/2, respectively.

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테이프 케스팅 거동에 미치는 알루미나의 입도분포의 영향 (Effects of Particle Size Distribution of Alumina on Behaviors of Tape Casting)

  • 윤원균;김정주;조상희
    • 한국세라믹학회지
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    • 제34권11호
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    • pp.1173-1181
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    • 1997
  • Effects of particle size distribution of alumina ceramics on behaviors of tape casting were investigated with emphases on the rheological characteristic of slurry, green density, green sheet strength, and sintering density. For the control of particle size distribution of alumina, the commercial grade low soda alumina, which had different mean particle size of 3.58 ${\mu}{\textrm}{m}$ and 0.42 ${\mu}{\textrm}{m}$, were chosen and blended together. As results, the mixing of 80 wt% fine powder and 20 wt% coarse powder(designated to FC20) led to the increase of packing density and strength of green sheet, and made it easy to handle during processing without lowering of sintering density. Besides, the pseudoplastic behavior of slurry decreased with increase of the fraction of coarse alumina powder.

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FPGA를 위한 분석적 배치에서 사전 패킹, 조기 배치 고정 및 밀도 분석 다층화 (Pre-Packing, Early Fixation, and Multi-Layer Density Analysis in Analytic Placement for FPGAs)

  • 김교선
    • 전자공학회논문지
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    • 제51권10호
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    • pp.96-106
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    • 2014
  • 기존 학계의 FPGA 툴 연구는 단순한 가상 아키텍처 모델 가정에 의존해 왔다. 이러한 제약을 극복하기 위한 첫걸음으로 분석적 배치 및 배치 적법화의 기본 알고리즘들을 상용 FPGA의 아키텍처에 적용하는 실제 상황에서 발생되는 이슈들을 도출하여 대안을 제시한 후 그 효과를 평가하였다. 먼저, 코어 사용률이 낮은 FPGA에서 배치된 셀들의 무게 중심이 칩 중심에서 벗어나는 현상이 발생할 수 있는데 이 변위를 최소화하는 함수를 분석적 배치의 목적 함수에 추가하였다. 또한 배치 밀도 평가의 정확도를 높이기 위해 셀 종류별로 별도의 밀도 행렬을 사용하는 다층 분석, 그리고 자원이 매우 한정된 블록의 조기 고정 방안을 제안하였다. 그밖에, 슬라이스 내에서 두 개의 플립플롭이 제어 핀들을 공유하기 때문에 발생하는 호환성 문제를 개선하기 위한 플립플롭 사전 패킹도 제안하였다. 제안된 기법은 상용 FPGA 아키텍처를 정확하게 모델링하고 수정 개선할 수 있는 K-FPGA 패브릭 평가 툴킷을 근간으로 구현되었으며 12개의 실용 예제에 적용하여 기존 방식에 비해 평균적으로 배선길이 22%, 슬라이스 사용량 5%를 감축하는 효과를 확인하였다. 본 연구는 신규 FPGA 아키텍처 개발을 위한 최적화 CAD 툴 개발 연구의 기초가 될 것으로 기대한다.

Fourier descriptor를 이용한 주문진표준사의 형상특성분석 (Analysis on Particle Shape Characteristics of Jumunjin Sand using Fourier Descriptor)

  • 민덕기;김성곤
    • 한국지반공학회:학술대회논문집
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    • 한국지반공학회 2010년도 추계 학술발표회
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    • pp.1182-1189
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    • 2010
  • The mechanical behavior of a granular material is governed by the applying effective stresses and its skeletal structure which is considered to be the packing of particles giving overall density and degree of anisotropic. Factors that affect soil packing are the particle size, size distribution and shape, and the arrangement of grain contact. Soil particle size and shape are the most important factor, but difficult to quantify. In this study, 2D Fourier analysis is applied to quantify the shape of granular particles. Jumunjin sand was used in the experiment and particle images are captured using an optical microscope. The results showed that three lower order Fourier descriptor are closely related with roundness, sphericity of the granular particle. Also statistical approach is used to determine roundness, form factor, elongation ratio, roughness of Jumunjin sand.

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A Modified Enskog-Like Equation of Self-Diffusion Coefficients for Penetrable-Sphere Model Fluids

  • Suh, Soong-Hyuck;Liu, Hong-Lai
    • Bulletin of the Korean Chemical Society
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    • 제32권4호
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    • pp.1336-1340
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    • 2011
  • Molecular dynamics simulations have been performed to investigate the transport properties of self-diffusion coefficients in the penetrable-sphere model system. The resulting simulation data for the product of the packing fraction and the self-diffusion coefficient exhibit a transition from an increasing function of density in lower repulsive systems, where the soft-type collisions are dominant, to a decreasing function in higher repulsive systems, where most particle collisions are the hard-type reflections due to the low-penetrability effects. A modified Enskog-like equation implemented by the effective packing fraction with the mean-field energy correction is also proposed, and this heuristic approximation yields a reasonably good result even in systems of high densities and high repulsive energy barriers.

The Stability and Indium Diffusion from ITO to PPV Layer of Polymer Light Emitting Devices with/without PI Blocking Layer

  • Seongjin Cho;Park, Dongkyu;Taewoo Kwon;Dongsun Yoo;Kim, Ilgon
    • Journal of Korean Vacuum Science & Technology
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    • 제6권1호
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    • pp.51-54
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    • 2002
  • Polymer EL devices of glass/ITO/PI/MEH-PPV/Al structure were fabricated using spin coating and the Ionized Cluster Beam deposition technique. PMDA-ODA type thin polyimide films which can be used as a impurity blocking layer of EL device were deposited by ICB. According to our previous results, the packing densities of polyimide films were subject to change and depend on their deposition condition. By inserting a Pl layer with various thickness and packing density, I-V characteristics and life time of the devices were investigated to determine the role of a interlayer. The blocking of impurity diffusion from ITO to luminescent layer were confirmed by XPS.

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이산요소법을 이용한 코크스 분화 거동 해석 (Analysis for Cokes Fracture Behavior using Discrete Element Method)

  • 유수현;박준영
    • 한국입자에어로졸학회지
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    • 제8권2호
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    • pp.75-81
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    • 2012
  • The strength of lumped cokes can be represented by some index numbers. Although some indexes are suggested, these indexes are not enough to enlighten fracture mechanism. To find essential mechanism, a computational way, discrete element method, is applied to the uniaxial compression test for cylindrical specimen. The cylindrical specimen is a kind of lumped particle mass with parallel bonding that will be broken when the normal stress and shear stress is over a critical value. It is revealed that the primary factors for cokes fracture are parallel spring constant, parallel bond strength, bonding radius and packing ratio the parallel bond strength and radius of the parallel combination the packing density. Especially, parallel spring constant is directly related with elastic constant and yield strength.

투과성 입자로 이루어진 미세 칼럼의 유동 특성 (Flow Properties of Micro Column Packed with Perfusive Particles)

  • 김덕종;황윤욱;박상진;허필우;윤의수
    • 유체기계공업학회:학술대회논문집
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    • 유체기계공업학회 2005년도 연구개발 발표회 논문집
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    • pp.89-93
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    • 2005
  • In this work, perfusive particles are used to form a micro column in a microfluidic chip and flow properties of the micro column are investigated. The packing flow velocity and the column/particle size ratio are shown to be important parameters affecting the packing density of the micro column. Experimental results show that the effect of the column/particle size ratio on the flow resistance of the micro column is negligible. This contrasts with previous works on the effect of the column/particle size ratio on the total pressure drop across the column.

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