• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.22 no.3
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• pp.49-58
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• 2016

Corrugated board provides packaging for most diverse industries with a share of over 50%, due to the numerous advantages they offer a good protection of the products. In other hand corrugated board fails in environmental conditions, indicating that relative humidity or temperature is higher. These effects directly damage the product packaged. To overcome on this problem recently corrugated boards produced with functional material, "functional corrugated boards," have become more available in the current market. A number of commercialized forms of functional material are coated or composited products with inorganic materials, for example "Nano clay" as representative. However, although the use of functional materials is increasing in corrugated boards, the several concerns such as over cost, environmental friendly materials, recycling, and toxicity affect consumer perceptions and acceptance. In the past, number of researcher focused on process of box compression and the utility of box compression testing etc., best of our knowledge there is no review paper which focus on the functional corrugated boards used in food packaging applications. This paper aims to review the availability of functional corrugated boards in the current market, past research studies on functional material and present the current status of functional corrugated boards in leading countries.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.26 no.2
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• pp.99-103
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• 2020

The volume of parcel delivery is steadily increasing with the rapid growth of the global online e-commerce market. However, a large amount of packaging materials used for these parcel delivery is finally causing environmental problems as waste. In this study, we have taken a pilot test on the returnable parcel delivery packaging & service, which is one of various ways to reduce the generation of the distribution packaging waste raised by e-commerce-based parcel delivery. For the purpose of this project, we made 300 boxes of returnable & foldable delivery packaging(415 mm × 280 mm × 160 mm) and have cooperated with e-commerce company(CJ ENM) & logistics company(LogisAll). Consequently, about 50% of the delivered packages was returned because of the lack of consumer's understanding on the returnable packaging system. We finally have suggested the policy strategy to get over problems derived from the experiment, like the retrieval rate and cost of the returnable packaging, economic efficiency and so on.

• Journal of Biosystems Engineering
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• v.28 no.4
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• pp.315-324
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• 2003

If an optimum design technique is applied in the design of packaging container for bulk-type products, merits on the side of not only economic and compression performance but distribution efficiency are expected. Accordingly, minimum board area (mRBA), compression strength (CS) and compression strength per unit area (mCSPA) are important design parameters in optimum design of packaging container for bulk-type products. In this study, mathematical models for mRBA, CS and mCSPA of container as algorithm for optimum design program were developed. In order to develop these models, compression test by various dimensions of container and response surface analysis for mRBA, CS, and mCSPA of container were carried out. In the developed models, volume, W/L ratio and depth of container were principal independent variables. On the found of these models, optimum design program having faculties of outward and inward optimum design and information design was developed. Though the packaging specifications are same, required board area, board combination and cost of the corrugated board required container manufacture were greatly different by boundary conditions in outward design. Moreover, about 6.3∼10.1% in weight of container was lighter, and about 13.2∼25.6% in cost of container was reduced when the program was applied for 2 kinds of bulk-type products.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.2
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• pp.21-26
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• 1997

The dielectric effects on the parasitics of bondwires buried in slightly-lossy dielectric materials hav been investigated over a wide frequency range using the method of moments with incorporation of ohmic and dielectric losses. The FR-4 composite is widely used as a basis material for PCB and plastic packages, because of it sinherent electricl and chemical stbility and low cost. The cole-cole model, which is representative complex permittivity model of epoxy polymers, has been applied to consider the dielectric effects in the MoM calculation. The prasitic impedance of a grounded bondwire in FR-4 composite is greatly increased due to the dielectric loading effect enhanced by the radiation at high frequencies. These calculation results will be helpful for designing and packaging of high-frequency low-cost IC's.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1301-1302
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• 2006

In this paper, embedded spiral inductors are investigated into the PCB substrate for low cost RF SOP applications. The spiral inductors designed with geometrical variations were simulated, fabricated, measured, and characterized by using 3D EM simulator, 8 layered PCB standard process and HP 8510B network analyzer (or verifying their applicability. The fabricated embedded spiral inductor has inductance of 9.4 nH at 800MHz, maximum quality factor of 64.8 at 1.09GHz and self resonant frequency of 3.93GHz, respectively. As the measured inductances and quality factors are well matched with simulated ones. PCB embedded spiral inductors are promising for advanced electronic systems with various functionality, low cost, small size and volume.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.8 no.2
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• pp.44-48
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• 2002

Plastic packaging generates less problems than most consumers think, but how to develop the recycling market for plastic waste materials will be critical for the plastic manufacturers. To do this, government must provide enough facility in order to balance economics for plastic recycling market and to run successful recycling programs. Various cost effective recycling technologies have been introduced and also have significant role to boost use of recycled plastics, but this could be only with well organized recycling policy.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.8 no.2
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• pp.12-17
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• 2002

Since 1985, the growth rate of population of the world is over that of the food production. The cultivated land and the grain production rate are decreasing every year. Therefore, the most serious crisis which we will meet in the 21st century will be food shortage. In order to solve this desperate shortage of food, besides trying to produce more food, the technology of post-harvest, food processing, and food packaging should be developed to reduce and make the best use of the amount of the already produced agricultural products for which a lots of cost and labors were invested, but are being wasted during food distribution channel due to their undeveloped technology.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.7-13
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• 2011

According to increasing of data transfer rate, printed circuit board (PCB) is required improvement of transmission speed. Optical PCB and its packaging technology can be one of the solutions that overcome the limitations of conventional electrical PCB. The data transmission capacity will be increased 10 Tbps at 2015. To this end, studies on various OPCB technologies are being conducted. For cost-effective and high- performance OPCB, studies of optical coupling by polymer replication process are conducted. In this work, optical waveguide and optical fiber array block were sequentially fabricated by polymer pattern replication method. Using this method we successfully demonstrate low loss optical fiber coupling between optical waveguide and optical fiber arrays. And researches on flip chip bonding process and using electro-optic connectors for packaging are conducted.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.22 no.3
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• pp.155-161
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• 2016

As one of traditional packaging materials, paper and paperboard are being more popular and beneficial thanks to their environmental sustainability and have been widely used in packaging applications, from light weight infusible tissue for tea/coffee bags to heavy duty boards for the distribution. Papermakers have to design the products having a desired customized function with their paper machine. Globally, the use of filler and pigment in papermaking is now a very common practice to meet the needs of customers. Many benefits can be achieved as a result of filler addition, which mainly includes cost and energy savings. The replacement of traditional mineral fillers and pigments with biodegradable and renewable carbohydrate polymers is a very interesting and promising research topic due to the concern of environmental impact. In this review paper, the use of traditional and novel carbohydrate fillers and pigments in cellulosic paper is highlighted. It is noteworthy that there are still some challenges and technical barriers associated with the use of these organic materials in point of structural stabilities and manufacturing costs, although most of them are available in market as the commercialized products. With the emerging nanotechnologies, it is believed that the use of carbohydrate-based filler and pigment for papermaking will increase and bring technical advantages to industry.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.39-44
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• 2008

In this paper, fully embedded 2.4GHz WLAN band pass filter (BPF) was investigated into a multi-layered organic packaging substrate using high Q spiral stacked inductors and high Dk MIM capacitors for low cost RF System on Package (SOP) applications. The proposed 2.4GHz WLAN BPF was designed by modifying chebyshev second order filter circuit topology. It was comprised of two parallel LC resonators for obtaining two transmission zeros. It was designed by using 2D circuit and 3D EM simulators for finding out optimal geometries and verifying their applicability. It exhibited an insertion loss of max -1.7dB and return loss of min -l7dB. The two transmission zeros were observed at 1.85 and 6.7GHz, respectively. In the low frequency band of $1.8GHz{\sim}1.9GHz$, the stop band suppression of min -23dB was achieved. In the high frequency band of $4.1GHz{\sim}5.4GHz$, the stop band suppression of min -l8dB was obtained. It was the first embedded and the smallest one of the filters formed into the organic packaging substrate. It has a size of $2.2{\times}1.8{\times}0.77mm^3$.