• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.27 no.9
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• pp.1-5
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• 2013

We developed high-efficient 6W-LED package with simple structure by applying Heat Slug and silicone-reflector. LED package was manufactured in $8.5{\times}8.5mm$ sized multi-chip structure having thickness of $500{\mu}m$ achieved by bonding silicon-reflector with prepreg on top of the plate after implementing the reflector placed on copper substrate Half Etching by thickness of $200{\mu}m$. The luminous flux, luminous efficacy, correlated color temperature, color rendering index and thermal resistance of developed LED was evaluated, and it verified the application of products by applying it to 120W-LED road luminaires through simulation. The luminous efficacy of LED package reached over 130lm/W, and it is possible to be manufactured into 120W-LED road luminaires using 18 packages. In addition, the simulation results showed average of horizontal illuminance and overall illuminance uniformity that is suitable for three-lane road.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2014.05a
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• pp.52-53
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• 2014

The Work Breakdown Structure (WBS) is a primary tool which provides a framework that defines clear scope of all deliverables throughout the project life cycle. Once the WBS is established in projects, it should allow project team members to measure and manage work performances by the WBS; further, it should provide a reference point when any work scope needs to be redefined. Based on the project information in the Progress and Performance Measurement System (PPMS) of UAE's Barakha Nuclear Power Plant (BNPP) projects, an attempt was made to develop a new WBS which provides hierarchical and systematical decomposition of the total work scope of NPP construction projects while avoiding from the preexistence concept in Korean NPP projects that the WBS is a combination of Physical Breakdown Structure (PBS) and Functional Breakdown Structure (FBS). The unique features of the new WBS are as follows: (1) defined the definition of each level of the WBS, (2) subdivided the WBS into 5 hierarchical levels, and (3) adopted globally used general coding structure. The new WBS provides a basic hierarchical structure for the project scope and can be used as a basic tool for schedule control, performance measurement, project status monitoring, and communication among project participants. In addition, by putting the Work Package (WP) under the WBS, the Earned Value Management System (EVMS) per WP can be utilized for the project.

• Korea Journal of Hospital Management
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• v.10 no.4
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• pp.75-97
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• 2005

The research objective is to empirically investigate the compensation packages maximizing the utilities of internal customers by applying the market segmentation theory. Data was collected from four Korean hospitals in Seoul, Busan and Gyunggi-do. The research is designed to seek the compensation package maximizing the utility of doctors by mixture regression model, which has been applied as latent structure and other type of finite mixture models from various academic fields since early 1980s. The mixture regression model shows the optimal segments number and fuzzy classification for each observation by EM(expectation-maximization algorism). The finite mixture regression model is to unmix the sample, to identify the groups, and to estimate the parameters of the density function underlying the observed data within each group. The doctors were segmented into 5 groups by their preference for the compensation package. The results of this study imply that the utility of doctors increases with differentiated compensation package segmented by their preference.

• Korean Management Science Review
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• v.15 no.2
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• pp.83-90
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• 1998

Today, ERP becomes very popular as a vehicle of implementing an integrated information system since this package not only facilitates reengineering but also provides the function of generating consolidated financial statements. Yet a successful introduction strategy on the integrated information system needs to be set up because ERP has weaknesses as well as strengths. The strengths include the prompt reaction to environmental changes, the integrated management of information, the adoption of open systems, and the selection of modules according to functionsl However, the weaknesses of ERP include the provision of only basic functions, the development of package on international standard processes, and possible disadvantages to small and medium-sized firms. This paper is to suggest recommendations on the implementation strategy of ERP as an integrated information system. According to the case study with Firm A that has successfully implemented an ERP package, the most significant advantage of adopting ERP was that Firm A was able to implement an integrated information system for only six months. Finally, this research generates suggestions, such as the importance of the project team structure, the sufficient amount of time for education, and the minimization of the package modification.

• Journal of the Korea Institute of Military Science and Technology
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• v.23 no.6
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• pp.574-581
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• 2020

This paper describes the stacking effect for Ceramic Column Grid Array(CCGA) packages used for satellites. Reflow Soldering Process suitable for CCGA package with back structure was set as the process development goal to meet European Cooperation for Space Standardization(ECSS) standard. After analyzing the stacking effect according to the type of CCGA, it is verified by applying it to the CCGA Reflow Soldering Process. In order to confirm the validity of the staking effect analyzed in terms of vibration and thermal characteristics, it is verified through actual specimen production. It analyzes the cause of crack occurrence in the CCGA package and estimates the crack generation point using previously acquired inspection data.

• Proceedings of the IEEK Conference
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• 2000.06e
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• pp.187-190
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• 2000

We presents the construction of radio frequency pad area array package modules which operate at radio frequency of 224MHz, and proposes the structure of RF module packages to improve its electrical characteristics. The module of RF PAA package was constructed in the configuration of three dimensional stacked package and reduced size. RF PAA packages showed the optimized and improved gain of 2dB by partitioning the RF transceiver with 3 dimensional stacked PAA packages.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.3
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• pp.14-19
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• 2008

In the semiconductor IC(Integrated Circuit) package, the top surface of silicon chip is directly attached to the area of the leadframe with a double-sided adhesive layer, in which the base layer have the upper adhesive layer and the lower adhesive layer. The IC package structure has been known to encounter a thermo-mechanical failure mode such as delamination. This failure mode is due to the residual stress on the adhesive surface of silicon chip and leadframe in the curing-cooling process. The induced thermal stress in the curing process has an influence on the cooling residual stress on the silicon chip and leadframe. In this paper, for the minimization of the chip surface damage, the adhesive topologies on the silicon chip are studied through the finite element analysis(FEA).

• The Transactions of the Korean Institute of Electrical Engineers A
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• v.55 no.10
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• pp.418-425
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• 2006

This paper describes a simulation package for a power system using objected-oriented programming. The package includes four parts which are a power flow, a short circuit calculation, a transient simulation program, and an economic dispatch. The graphical user interface(GUI) is designed as a common platform which allows the user to create one-line diagrams of systems, specify components of power systems as well as simulation parameters, and view the output produced by the chosen application. The paper presents the data structure of the functional modules such as the draw module, power system data module, the power system simulation module, and the utility module using the object oriented programming. This package may be useful for educational and research purposes.

• Journal of Industrial Convergence
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• v.17 no.4
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• pp.9-14
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• 2019

This paper presents several problems that can occur in the development of the ultra-compact LED package of less than 1.0mm and introduces the solution to them. In the existing mold structure, since the upper and lower core parts are integrated, various errors have occurred due to the roughness of EDM in the small model, which is a limiting factor in further reducing the mold size. As a countermeasure, the prefabricated model was presented in an earlier study to overcome the obstacles to the development of a ultra-compact LED package. In this paper, several problems have been found during the fabrication of prototypes as a starting work to produce the results for the presented model. The types are suggested and the solutions are discussed. And by changing the existing 2-row structure to 3-row structure in the same size lead frame, the aspect of efficient production is considered. The experimental procedure verifies the proposed solution and conducts a test to produce a prototype to confirm that a good product can be produced.

• Journal of the Semiconductor & Display Technology
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• v.17 no.4
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• pp.42-45
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• 2018

As The semiconductor decrease from 10 nanometer to 7 nanometer, It is suggested that "More than Moore" is needed to follow Moore's Law, which has been a guide for the semiconductor industry. Fan-Out Wafer Level Package(FOWLP) is considered as the key to "More than Moore" to lead the next generation in semiconductors, and the reasons are as follows. the fan-out WLP does not require a substrate, unlike conventional wire bonding and flip-chip bonding packages. As a result, the thickness of the package reduces, and the interconnection becomes shorter. It is easy to increase the number of I / Os and apply it to the multi-layered 3D package. However, FOWLP has many issues that need to be resolved in order for mass production to become feasible. One of the most critical problem is the warpage problem in a process. Due to the nature of the FOWLP structure, the RDL is wired to multiple layers. The warpage problem arises when a new RDL layer is created. It occurs because the solder ball reflow process is exposed to high temperatures for long periods of time, which may cause cracks inside the package. For this reason, we have studied warpage in the FOWLP structure using commercial simulation software through the implementation of the reflow process. Simulation was performed to reproduce the experiment of products of molding compound company. Young's modulus and poisson's ratio were found to be influenced by the order of influence of the factors affecting the distortion. We confirmed that the lower young's modulus and poisson's ratio, the lower warpage.