• Journal of the Korea Convergence Society
• /
• v.12 no.4
• /
• pp.161-169
• /
• 2021

'Clean beauty' attracts attention with an increasing interest in cosmetics without harmful ingredients as people wear masks in the age of COVID-19. Thus, this study selected and analyzed clean beauty cosmetic brands circulated in Korea on/offline in 2020. This study extracted 36 clean beauty brands and selected 20 suitable brands through an experts' analysis. For an analysis of clean beauty cosmetic brand communication, components: naming, logo, color, package, and website were drawn to conduct a survey. Preferred were the words they come up with when they think of nature or health for naming; wordmarks in a simple form for logo; greenish or yellowish for color; the simple form aligned center on the container body for package; and the images of plants, animals, and humans for website. To sum up the components, utilizing natural, clean, and light images harmoniously, acted as a factor for preferring the clean beauty cosmetic brands.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2000.11a
• /
• pp.57-57
• /
• 2000

Brazing characteristics of the LTCC(Low Temperature Co-fired Ceramics)/ Kovar(Fe-Ni-Co alloy) was investigated. Kovar is one of the typical material for the lid of MCM and packages. In case of alumina package, Brazing process is done by higher temperature profile than 800 $^{\circ}C$ and Ag-Cu alloy. But, LTCC has sintering temperature near 850 $^{\circ}C$. So, it is difficult to use the same process as alumina brazing. The adhesion strength of the brazed part is affected by brazing alloy and metallization properties between conductor pattern and LTCC material. We investigated brazing characteristics of the LTCC/Kovar using various brazing alloys(Ag-Cu, Au-Sn) and process conditions. And, we examined the influence of the glass contents in conductor on the brazing characteristics of the LTCC/Kovar.

• The Journal of Korean Society for School & Community Health Education
• /
• v.19 no.3
• /
• pp.1-14
• /
• 2018

Objectives: The purpose of this study was to investigate the prevalence of metabolic syndrome and to find related factors according to the number of metabolic syndrome diagnostic components in Korean adolescents. Methods: The subjects of this study were 469 Korean adolescents aged from 12 to 18 enrolled in the 2016 Korea National Health and Nutrition Examination Survey. Statistical package R 3.4.2 was used for programming to apply diagnostic criterion of adolescent metabolic syndrome and for the analysis of the data such as weighted frequent analysis, weighted mean analysis and complex sampling design logistic regression analysis. Results: For adolescents 12 to 18 years of age, 2.55% had more than 2(${\geq_-}3$), 9.88% had more than 1(${\geq_-}2$) and 33.17% had more than 0(${\geq_-}1$) metabolic syndrome diagnostic components. It has been found that risk factors for no less than 2 metabolic syndrome diagnostic components were higher body mass index and higher stress, and risk factors for no less than 1 were higher body mass index, younger teenager and female. Conclusion: Obesity is the primary risk factor for the development of adolescent metabolic syndrome. Female or younger teenager are more likely to have one or more metabolic syndrome diagnostic components, and higher stress develop to the risk level of having two or more metabolic syndrome diagnostic components. Therefore, it is important to focus on obesity and stress management for the prevention and control of Korean adolescent metabolic syndrome.

• 한국디지털정책학회:학술대회논문집
• /
• 2004.11a
• /
• pp.299-310
• /
• 2004

Business process in e-government mostly embody as the flow of documents. Constructing a web-based document flow system becomes an critical task for today s digital government. But few of them use an off-the-shelf workflow product. Why? One of the reasons is that most of the workflow system are heavyweight, monolithic, and package a comprehensive set of features in an all-or-nothing manner. Another reason is that workflow technology lacks the constructs and modeling capability as programming language. It is incumbent on government IT organizations to transform their solution development to component-based computing model. Component technology isolates the computation and communication parts, but how to compose different software components is still a hard nut. An integrated development environment is necessary for CBSD. In this paper we propose a XML and component-based document flow-oriented integrated development environment (DFoIDE) for software developers. By writing some xml configure file, and operate on DFoIDE, developer can construct a workflow application quickly. This method divides system to several components and the activities in process are implemented as business component. Different components are discribed detailedly in this paper, especially one of the core component. Component Integrating Tool. Different perspectives in workflow application are seperated and depicted as different XML files. Correspondly, A component composition method for developing workflow application instead of workflow itself is proposed.

• Journal of the Korean Data and Information Science Society
• /
• v.24 no.3
• /
• pp.533-541
• /
• 2013

In this study, a simple principal component analysis using Lasso is proposed. This method consists of two steps. The first step is to compute principal components by the principal component analysis. The second step is to regress each principal component on the original data matrix by Lasso regression method. Each of new principal components is computed as the linear combination of original data matrix using the scaled estimated Lasso regression coefficient as the coefficients of the combination. This method leads to easily interpretable principal components with more 0 coefficients by the properties of Lasso regression models. This is because the estimator of the regression of each principal component on the original data matrix is the corresponding eigenvector. This method is applied to real and simulated data sets with the help of an R package for Lasso regression and its usefulness is demonstrated.

• Journal of Information Technology Services
• /
• v.15 no.3
• /
• pp.71-95
• /
• 2016

In recent years, text mining has been used to extract meaningful insights from the large volume of unstructured text data sets of various domains. As one of the most representative text mining applications, topic modeling has been widely used to extract main topics in the form of a set of keywords extracted from a large collection of documents. In general, topic modeling is performed according to the weighted frequency of words in a document corpus. However, general topic modeling cannot discover the relation between documents if the documents share only a few terms, although the documents are in fact strongly related from a particular perspective. For instance, a document about "sexual offense" and another document about "silver industry for aged persons" might not be classified into the same topic because they may not share many key terms. However, these two documents can be strongly related from the R&D perspective because some technologies, such as "RF Tag," "CCTV," and "Heart Rate Sensor," are core components of both "sexual offense" and "silver industry." Thus, in this study, we attempted to discover the differences between the results of general topic modeling and R&D perspective topic modeling. Furthermore, we package social issues from the R&D perspective and present a prototype system, which provides a package of news articles for each R&D issue. Finally, we analyze the quality of R&D perspective topic modeling and provide the results of inter- and intra-topic analysis.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2003.11a
• /
• pp.53-58
• /
• 2003

The Wafer Level Packaging is one of the most important technologies in the semiconductor industry today. Its primary advantages are its small form factor and low cost potential for manufacturing including test procedure. The CASIO's WLP samples, application example and the structure are shown in Fig.1, 2&3. There are dielectric layer , under bump metal, re-distribution layer, copper post , encapsulation material and terminal solder .The key technologies are 'Electroplating thick copper process' and 'Unique wafer encapsulation process'. These are very effective in getting electrical and mechanical advantages of package. (Fig. 4). CASIO and CMK are developing a new System Packaging technology called the Embedded Wafer Level Package (EWLP) together. The active components (semiconductor chip) in the WLP structure are embedded into the Printed Wiring Board during their manufacturing process. This new technical approach has many advantages that can respond to requirements for future mobile products. The unique feature of this EWLP technology is that it doesn't contain any solder interconnection inside. In addition to improved electrical performance, EWLP can enable the improvement of module reliability. (Fig.5) The CASIO's WLP Technology will become the effective solution of 'KGD problem in System Packaging'. (Fig. 6) The EWLP sample shown in Fig.7 including three chips in the WLP form has almost same structure wi_th SoC's. Also, this module technology are suitable for RF and Analog system applications. (Fig. 8)

• Journal of Advanced Marine Engineering and Technology
• /
• v.40 no.2
• /
• pp.96-101
• /
• 2016

The thermal management of high-power LED components in an assembly structure is crucial for the stable operation and proper luminous function. This study employs numerical tools to determine the optimum thermal design in LEDs with a heat sink consisting of a crevice-type vapor-chamber heat pipe. The effects of the MCPCB are investigated in terms of the substrate thicknesses on which the LEDs are mounted. Further, different placement configurations in a system module are considered. This study found that for a confined area, a power of 40 W/LED is applicable to a high-power package. Furthermore, the thermal conductivity of dielectric layer materials should ideally be greater than 0.9 W/m.K. The temperature conditions of the vapor chamber in a heat pipe greatly affect the thermal performance of the system. At an offset distance of 9.0 mm and a $2^{\circ}C$ increase in the temperature of the heat pipe, the resulting maximum temperature increase is approximately $1.9^{\circ}C$ for each heat dissipation temperature. Finally, at a thermal conductivity of 0.3 W/m.K, it was found that the total thermal resistance changes dramatically. Above 1.2 W/m.K, the resistance change reduces exponentially.

• Journal of Applied Reliability
• /
• v.13 no.3
• /
• pp.207-216
• /
• 2013

This paper, we classified LED failure mechanisms that occur due to the delamination and analyzed each of the mechanism that gives the LED PKGs the effect. Usually, the LED is composed of several materials which are LED chips, gold wire, phosphor, epoxy resin, adhesive, reflector and lead frame. These different materials are usually delaminated in trouble conditions which are huge temperature difference, hot and humid or mechanical shocked. When the components are delaminated, a luminance will be lost and moisture be absorbed easily, a thermal resistance be increased attendantly. In this paper, we experimented to investigate failure mechanism of the thermal resistance and failure mechanism of the decrease of luminance that occur due to the delamination. A thermal shock test was performed to reproduce this phenomena by subjecting samples to a cold-hot cyclling process between $-30^{\circ}C$(15min) and $110^{\circ}C$(15min). The samples were inspected at 200, 600 and 1,000 cycles. We measured feature of LED using the spatial analyzer, optical microscope, thermal resistance, photometer, scanning electron microscope (SEM). As a result, the progression of the crack and the thermal resistance and decrease in luminance are proportional to number of thermal shock.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.38 no.10
• /
• pp.1049-1056
• /
• 2014

Microelectronics components contain various materials with different coefficients of thermal expansion (CTE). Although a large amount of published data on the CTE of standard materials is available, it occasionally becomes necessary to measure this property for a specific actual material over a particular temperature range. A change in the temperature of a material causes a corresponding change in the output of the strain gage installed on the specimen because of not only the mechanical load but also the temperature change. In this paper, a detailed technique for CTE measurement based on these thermal characteristics of strain gages is proposed and its reliability is evaluated. A steel specimen, aluminum specimen, and copper specimen, whose CTE values are well known, were used in this evaluation. The proposed technique was successfully applied to the measurement of the CTE of a coreless package substrate composing of electronics packages.