• 제목/요약/키워드: Package Components

검색결과 235건 처리시간 0.034초

Compressive strength and mixture proportions of self-compacting light weight concrete

  • Vakhshouri, Behnam;Nejadi, Shami
    • Computers and Concrete
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    • 제19권5호
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    • pp.555-566
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    • 2017
  • Recently some efforts have been performed to combine the advantages of light-weight and self-compacting concrete in one package called Light-Weight Self-Compacting Concrete (LWSCC). Accurate prediction of hardened properties from fresh state characteristics is vital in design of concrete structures. Considering the lack of references in mixture design of LWSCC, investigating the proper mixture components and their effects on mechanical properties of LWSCC can lead to a reliable basis for its application in construction industry. This study utilizes wide range of existing data of LWSCC mixtures to study the individual and combined effects of the components on the compressive strength. From sensitivity of compressive strength to the proportions and interaction of the components, two equations are proposed to estimate the LWSCC compressive strength. Predicted values of the equations are in good agreement with the experimental data. Application of lightweight aggregate to reduce the density of LWSCC may bring some mixing problems like segregation. Reaching a higher strength by lowered density is a challenging problem that is investigated as well. The results show that, the compressive strength can be improved by increasing the of mixture density of LWSCC, especially in the range of density under $2000Kg/m^3$.

$CO_2$ 소화설비 구성부품 성능시험보고 (The Report on Test Results of CO Fire Extinguishing System)

  • 김기옥;이찬주;안병호
    • 방재기술
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    • 통권14호
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    • pp.5-12
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    • 1993
  • This report is explained about test results of carbon dioxide extinguiching system components and pack-age type system (Kits) for automatic fire extinguishing system. A carbon dioxide system may be used to protect one or more hazards or hazards by menas of directional valves. Package system shall be installed to protect hazards within the limitations. The testing program was progressed by three items, external oppearance test, performance test and Total Flooding Fire Extinguishing System test. The object of this report is present the problem which apperar from the analysis of test results.

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대칭성분에 의한 퍼지형 고장형태판별에 관한 연구 (A Study on the Fuzzy-based Fault-type Detection Using Symmetrical Component)

  • 박철원;전병준;신명철;이복구;윤석무
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1997년도 하계학술대회 논문집 D
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    • pp.857-860
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    • 1997
  • This paper is on the application of fuzzy for fault-type approach using symmetrical components method. To evaluate performance of the proposed technique, we have been tested using a relaying signals obtained from EMTP simulation package.

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거친 가공표면 형상의 고정밀 측정법 개발 (Precision Profile Measurement on Roughly Processed Surfaces)

  • 김병창;이세한
    • 한국기계가공학회지
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    • 제7권1호
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    • pp.47-52
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    • 2008
  • We present a 3-D profiler specially devised for the profile measurement of rough surfaces that are difficult to be measured with conventional non-contact interferometer. The profiler comprises multiple two-point-diffraction sources made of single-mode optical fibers. Test measurement proves that the proposed profiler is well suited for the warpage inspection of microelectronics components with rough surface, such as unpolished backsides of silicon wafers and plastic molds of integrated-circuit chip package.

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Effects of Package Materials on Quality Change of Pine Bud Beverage Under Ultraviolet Light

  • An, Duek-Jun
    • Preventive Nutrition and Food Science
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    • 제14권4호
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    • pp.349-353
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    • 2009
  • The effects of packaging materials on preserving the functional component of pine bud beverage stored under UV (ultraviolet) light exposure conditions were studied. The order of UV light blocking properties of the selected packages was: opaque can> opaque PET (polyethylene terepthalate) with green lamination=transparent PET with 10% PEN (polyethylene naphthalate) blending> transparent PET, and did not depend on film thickness in specified range. At 20${^{\circ}C}$, the order of preserving degree of original color and endobornyl acetate, which is quality index of pine bud beverage, was the same as above. Exposure to UV light can cause of deterioration of functional food components, but green color lamination and blending of PEN materials with transparent PET help to preserve the UV sensitive pine bud beverage components. However, the treated PET bottles have poorer preservation capabilities than the opaque cans. Transparent PET with PEN blending, in particular, will be very useful packaging material for colorful functional beverage preservation by helping to protect the ingredients while attracting consumer attention.

전자부품의 금속소재에 따른 Electrochemical Migration에 대한 신뢰성 설계기술개발 (Development of Reliability Design Technology about Electrochemical Migration by Metal of Electronic Components)

  • 이신복;정자영;박영배;주영창
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회A
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    • pp.1724-1729
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    • 2007
  • Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature/humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the Electrochemical migration

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고속 3차원 매립 인덕터에 대한 모델링 (Modeling of High-speed 3-Disional Embedded Inductors)

  • 이서구;최종성;윤일구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.139-142
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    • 2001
  • As microeletronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important for many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (5-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

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A Symbolic Computation Method for Automatic Generation of a Full Vehicle Model Simulation Code for a Driving Simulator

  • Lee Ji-Young;Lee Woon-Sung
    • Journal of Mechanical Science and Technology
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    • 제19권spc1호
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    • pp.395-402
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    • 2005
  • This paper deals with modeling and computer simulation of a full multibody vehicle model for a driving simulator. The multibody vehicle model is based on the recursive formulation and a corresponding simulation code is generated automatically from AUTOCODE, which is a symbolic computation package developed by the authors using MAPLE. The paper describes a procedure for automatically generating a highly efficient simulation code for the full vehicle model, while incorporating realistically modeled components. The following issues have been accounted for in the procedure, including software design for representing a mechanical system in symbolic form as a set of computer data objects, a multibody formulation for systems with various types of connections between bodies, automatic manipulation of symbolic expressions in the multibody formulation, interface design for allowing users to describe unconventional force-and torque-producing components, and a method for accommodating external computer subroutines that may have already been developed. The effectiveness and efficiency of the proposed method have been demonstrated by the simulation code developed and implemented for driving simulation.

GPS 애플리케이션에 대한 컴포넌트 기반의 요구사항 분석 (Component-based Requirements Analysis for the GPS Applications)

  • 이상영;이윤현
    • 디지털산업정보학회논문지
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    • 제8권2호
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    • pp.177-188
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    • 2012
  • GIS provides the various analyzing and displaying using diverse spatial data have supported the powerful functionality and friendly user-interface. But, early GIS software is developed as package tool, it have many difficulties with reducing the cost of developing GPS application and satisfying the various user requirements. At present, the developed GPS applications across multiple domains, despite the common features are built separately for each domain in terms of software engineering development followed out waste of time and money expenditure. However, common features between GPS applications, if deployed as a component assembly and reuse components in terms of enabling the two kinds of component-based development can bring out the beneficial results. In this paper, we described the Analysis and design of GPS ApplicationsS based on Component. Each GPS component is composed of many objects accomplish the atomic service processing and cooperate with each other. And, GPS components meets the qualifications of thc low cost of developing GPS application because of the reusability and re-composition.

저온 동시소성 공정으로 제작된 3차원 매립 인덕터 모델링 (Modeling of 3-D Embedded Inductors Fabricated in LTCC Process)

  • 이서구;최종성;윤일구
    • 한국전기전자재료학회논문지
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    • 제15권4호
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    • pp.344-348
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    • 2002
  • As microelectronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important fort many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (s-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.