• 한국분무공학회지
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• 제20권4호
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• pp.223-229
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• 2015

This paper was designed to investigate emission characteristics of regulated pollutants (CO, HC, NOx and PM) from 134 diesel and gasoline passenger cars based on emission standards according to fuel additives. The experiments using chassis dynamometer were conducted under NEDC and CVS-75 modes. Comparison for fuel additive management and test between Korea, USA, EU and Japan, Korea was more strict than others. The fuel additives of this study was satisfied within fuel manufacturing standards. For with/without fuel additives according to diesel emission standards, NOx of EURO 4 and EURO 5 showed a relatively similar tendency. In the case of PM reduction rate, EURO 5 was over 20% increased than EURO 4. In the case of standard deviation/average ratio for gasoline vehicles, variation interval was big for LEV 23.3~58% and ULEV 31.6~56.4%. Following the imposition of stricter regulations (EURO 5 and ULEV), difference rate for standard deviation was big. Especially, in the case of diesel vehicles, difference rate for NOx 68% and PM 48% was most big. The results of present study will be of assistance in completing the legislative process and will provide basic data to set up emission standards for fuel additives in Korea.

• 펄프종이기술
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• 제44권6호
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• pp.21-27
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• 2012

The effects of fines contents in OCC stock on the wet pressing process were evaluated in this study. The fines were collected from the beaten OCC stock by using 200 mesh. The dryness of handsheet samples after the couch and after the 1st wet press were greatly affected by the fine contents of the OCC stock. The higher contents of fines resulted in the lower value in dryness but the higher value of density followed by the higher strength properties. The addition of the retention aids and the drainage aids on the OCC stocks showed the wet pressing efficiency were greatly affected by the fine contents rather than the addition of polymer additives. The increase in the fine retention by the polymer additives offset the improvement in the wet pressing efficiency originated from the polymer additives.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.544-547
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• 2004

Glass frits for dielectric layers are mostly used for screen printing process. Several additives have already been known to be well matched with lead-oxide glasses system. The use of lead oxide, however, creates environmental problems, so many recent studies on lead-free glasses compositions have been carried out. A study of the suitability between additives and lead-free glass system is needed. In this study, we have used a screen-printing method to make thick films of lead-oxide glass and lead-free glass using different additives, and analyzed and compared the transmittance of the thick films.

• 한국연초학회지
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• 제7권2호
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• pp.169-178
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• 1985

In the previous paper, the kinetics of cellulose were described. In this study, the ability of some additives to act as a flame promoter for cellulose was investigated using dynamic thermogravimetry and differential scanning calorimetry. The treated cellulose was thermally decomposed through the two model as previously noted with the untreated cellulose. The first step was associated with the flaming combustion of volatile material released in the fraunentation process and the second was caused by the glowing combustion of carbonaceous residue. The first group of the additives, which could be divided into two groups by the pyrolytic mechanism of cellulose, appeared to catalyze the fragmentation, maximizing the degradation to produce tarry products, with gaseous flammable substrate. The heat evolved in flaming combustion mode was increased significantly by the treatment of the cellulose retained 1-5% of the first group additives.

• 한국표면공학회지
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• 제46권4호
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• pp.153-157
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• 2013

The defect like the void or seam is frequently generated in the PCB (Printed Circuit Board) Via-Filling plating inside via hole. The organic additives including the accelerating agent, inhibitor, leveler, and etc. are needed for the copper Via-Filling plating without this defect for the plating bath. However, the decomposition of the organic additive reduces the lifetime of the plating bath during the plating process, or it becomes the factor reducing the reliability of the Via-Filling. In this paper, the interaction of each organic additives and the decomposition of additive were discussed. As to the accelerating agent, the bis (3-sulfopropyl) disulfide (SPS) and leveler the Janus Green B (JGB) and inhibitor used the polyethlylene glycol 8000 (PEG). The research on the interaction of the organic additives and decomposition implemented in the galvanostat method. The additive decomposition time was confirmed in the plating process from 0 Ah/l (AmpereHour/ liter) to 100 Ah/l with the potential change.

• 한국재료학회지
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• 제22권7호
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• Transactions on Electrical and Electronic Materials
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• 제10권1호
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• pp.31-34
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• 2009

The improvement of preparation process of ${YBa_2}{Cu_3}{O_x}$ superconductor and its conducting properties is important for practical applications. In this study, the additives such as $Ag_{2}O$ and PbO were used to improve the preparation conditions of ${YBa_2}{Cu_3}{O_x}$ superconducting bulk samples and the properties of ${YBa_2}{Cu_3}{O_x}$ superconductors prepared with powders using sol-gel method and solid state reaction method were studied. The effects of the different powders and the additives to the density, grain alignment, and porosity of samples, that affect the critical current density of superconductor, also have been investigated. It is found that the properties of ${YBa_2}{Cu_3}{O_x}$ prepared with sol-gel synthesized powder and the additives showed better superconductivities than those of conventionally prepared superconductors.

• 한국표면공학회지
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• 제43권1호
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• pp.1-6
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• 2010

The effect of organic additives, 1-(3-sulfoproyl)-2-vinylpyridineium hydroxide (SVH) and thiourea (TU), on the precision copper electrodeposition was investigated with optical, electrochemical and x-ray diffraction techniques. It was found that SVH played a r ole as a n accelerator and TU as an i nhibitor during the electroreduction of cupric ions in acidic Cu electroplating solution. Through electrochemical measurements, TU showed more strong interaction with cupric ions than SVH and dominated overall Cu electroplating process when both additives were present in the solution. In the case of three dimensional Cu electrodeposition on the 20 ${\mu}m$-patterned Ni substrates, SVH controlled the upright growth of Cu electrodeposits and so determined its flatness, while TU prohibited the lateral spreading of Cu in the course of pulse-reverse pulse current adaptation. With microscopic observation, we obtained the optimum organic additives composition, that is, 100 ppm SVH and 200 ppm TU during the current pulsation.

• 한국표면공학회지
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• 제43권6호
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• pp.297-303
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• 2010

The effect of solution acidity and organic additives, polyethylene glycol (PEG), on the trivalent chromium electroplating was systematically investigated in the view point of electroreduction of trivalent chromium ions and solution stability. It was found that solution acidity controlled at pH 2.5 showed the widest current range for bright electrodeposits in the presence of PEG additives, which reduced the local current intensification at high current densities. Through complex interaction between PEG additives and hydrogen ion, that is, solution acidity, electrode potential was moved in the negative direction in the bulk solution, while it shifted in the positive when electric potential was scanned. In conjunction with electrochemical quartz crystal microbalance (EQCM), it was found that PEG additives had a role in promoting the electron transfer to trivalent chromium ion complexes in bulk solution and their adsorption at the electrode surface as well as interfering with hydrogen ion reduction process below pH 2.5. The PEG additives developed the nodular morphology during electroreduction of trivalent chromium ions with the increase of solution acidity and enhanced its current efficiency by maintaining the consumption of complexant, formic acid, at low speed.

• 한국수소및신에너지학회논문집
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• 제18권4호
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• pp.365-373
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• 2007

We optimized the compositions of electrolyte and additives for anode in Ni-MH battery to improve the electrode characteristics at ambient and low temperatures using response surface method(RSM). Among various additives for anode, PTFE exhibited the greatest influence on the discharge capacity of the anode. Through response optimization process, we found the optimum composition of the additives to exhibit the greatest discharge capacity. When the amount of additives was too small, the anode was degraded with time due to the low binding strength among alloy powders and the resultant separation of powders from the current collector. In contrast, the addition of large amount of the additives increased in the resistance of the electrode. In addition, the discharge capacity of the anode at $-18^{\circ}C$ increased with decreasing the concentration of KOH, NaOH and LiOH in design range of electrolyte. The resistance and viscosity of electrolyte appear to affect the discharge capacity of the anode at low temperature.