• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.6
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• pp.297-301
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• 2006

In the present work, we investigate the characteristics of new composition material, chalcogenide $Ge_1Se_1Te_2$ material in order to overcome the problems of conventional PRAM devices. The Tc of $Ge_1Se_1Te_2$ bulk was measured $231.503^{\circ}C$ with DSC analysis. For static DC test mode, at low voltage, two different resistances are observed. depending on the crystalline state of the phase-change resistor. In the first sweep, the as-deposited amorphous $Ge_1Se_1Te_2$ showed very high resistance. However when it reached the threshold voltage(about 11.8 V), the electrical resistance of device was drastically reduced through the formation of an electrically conducting path. The phase transition between the low conductive amorphous state and the high conductive crystal]me state was caused by the set and reset pulses respectively which fed through electrical signal. Set pulse has 4.3 V. 200 ns. then sample resistance is $80\sim100{\Omega}$. Reset pulse has 8.6 V 80 ns, then the sample resistance is $50{\sim}100K{\Omega}$. For such high resistance ratio of $R_{reset}/R_{set}$, we can expect high sensing margin reading the recorded data. We have confirmed that phase change properties of $Ge_1Se_1Te_2$ materials are closely related with the structure through the experiment of self-heating layers.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.403-404
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• 2013

최근 scaling down의 한계에 부딪힌 DRAM과 Flash Memory를 대체하기 위한 차세대 메모리(Next Generation Memory)에 대한 연구가 활발히 진행되고 있다. ITRS (international technology roadmap for semiconductors)에 따르면 PRAM (phase change RAM), RRAM (resistive RAM), STT-MRAM (spin transfer torque magnetic RAM) 등이 차세대 메모리로써 부상하고 있다. 그 중 RRAM은 간단한 구조로 인한 고집적화, 빠른 program/erase 속도 (100~10 ns), 낮은 동작 전압 등의 장점을 갖고 있어 다른 차세대 메모리 중에서도 높은 평가를 받고 있다 [1]. 현재 RRAM은 주로 금속-산화물계(Metal-Oxide) 저항 변화 물질을 기반으로 연구가 활발하게 진행되고 있다. 하지만 근본적으로 공정 과정에서 산소에 의한 오염으로 인해 수율이 낮은 문제를 갖고 있으며, Endurance 및 Retention 등의 신뢰성이 떨어지는 단점이 있다. 따라서, 본 연구진은 산소 오염에 의한 신뢰성 문제를 근본적으로 해결할 수 있는 다양한 금속-질화물(Metal-Nitride) 기반의 저항 변화 물질을 제안해 연구를 진행하고 있으며, 우수한 열적 안정성($>450^{\circ}C$, 높은 종횡비, Cu 확산 방지 역할, 높은 공정 호환성 [2] 등의 장점을 가진 WN 박막을 저항 변화 물질로 사용하여 저항 변화 메모리를 구현하기 위한 연구를 진행하였다. WN 박막은 RF magnetron sputtering 방법을 사용하여 Ar/$N_2$ 가스를 20/30 sccm, 동작 압력 20 mTorr 조건에서 120 nm 의 두께로 증착하였고, E-beam Evaporation 방법을 통하여 Ti 상부 전극을 100 nm 증착하였다. I-V 실험결과, WN 기반의 RRAM은 양전압에서 SET 동작이 일어나며, 음전압에서 RESET 동작을 하는 bipolar 스위칭 특성을 보였으며, 읽기 전압 0.1 V에서 ~1 order의 저항비를 확보하였다. 신뢰성 분석 결과, $10^3$번의 Endurance 특성 및 $10^5$초의 긴 Retention time을 확보할 수 있었다. 또한, 고저항 상태에서는 Space-charge-limited Conduction, 저저항 상태에서는 Ohmic Conduction의 전도 특성을 보임에 따라 저항 변화 메카니즘이 filamentary conduction model로 확인되었다 [3]. 본 연구에서 개발한 WN 기반의 RRAM은 우수한 저항 변화 특성과 함께 높은 재료적 안정성, 그리고 기존 반도체 공정 호환성이 매우 높은 강점을 갖고 있어 핵심적인 차세대 메모리가 될 것으로 기대된다.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1438-1439
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• 2006

$Ge_{2}Sb_{2}Te_5$(GST) thin film at present is a promising candidate for a phase change random access memory (PCRAM) based on the difference in resistivity between the crystalline and amorphous phase. PCRAM is an easy to manufacture, low cost storage technology with a high storage density. Therefore today several major chip in manufacturers are investigating this data storage technique. Recently, A. Pirovano et al. showed that PCRAM can be safely scaled down to the 65 nm technology node. G. T Jeonget al. suggested that physical limit of PRAM scaling will be around 10 nm node. Etching process of GST thin ra films below 100 nm range becomes more challenging. However, not much information is available in this area. In this work, we report on a parametric study of ICP etching of GST thin films in $Cl_2$/Ar chemistry. The etching characteristics of $Ge_{2}Sb_{2}Te_5$ thin films were investigated using an inductively coupled plasma (ICP) of $Cl_2$/Ar gas mixture. The etch rate of the GST films increased with increasing $Cl_2$ flow rate, source and bias powers, and pressure. The selectivity of GST over the $SiO_2$ films was higher than 10:1. X-ray photoelectron spectroscopy(XPS) was performed to examine the chemical species present in the etched surface of GST thin films. XPS results showed that the etch rate-determining element among the Ge, Sb, and Te was Te in the $Cl_2$/Ar plasma.

• Proceedings of the Korean Information Science Society Conference
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• 2006.10a
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• pp.261-266
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• 2006

최근 낸드 플래시 메모리는 임베디드 저장 장치로서 많이 사용되고 있을 뿐만 아니라 플래시 메모리의 저장 용량의 대용량화로 하드 디스크를 대체하는 SSD(solid state disk) 같은 제품이 출시되고 있다. 플래시 메모리는 하드디스크에 비하여 저전력, 빠른 접근성, 물리적 안정성 등의 장점이 있지만 읽기와 쓰기의 연산의 불균형적인 비용과 덮어 쓰기가 안 되고 쓰기 전에 해당 블록을 지워야하는 부가적인 작업을 수행해야 한다. 이와 같은 특징은 플래시 메모리의 쓰기 성능을 저하 시키고 기존의 하드디스크를 대체하는 것을 어렵게 만든다. 이와 같은 플래시 메모리의 단점을 해결하기 위해서 본 논문에서 비휘발성 메모리와 플래시 메모리를 함께 사용하는 방법을 제안한다. 최근 MRAM, FeRAM, PRAM과 같은 차세대 메모리 기술의 발전과 배터리 백업 메모리의 가격 하락으로 인하여 비휘발성 메모리의 상품적 가치가 높아지고 있다. 하지만 아직까지 용량 대비 가격이 비효율적이기 때문에 소용량의 비휘발성 메모리를 활용하여 플래시 메모리의 쓰기 연산에 대한 단점을 보완하는 방법을 제안한다. 본 논문에서는 FTL 에서 비휘발성 메모리를 쓰기 버퍼로 이용한 여러 가지 버퍼 관리 정책을 실험하였고 각 관리 정책에 따른 플래시 메모리의 성능 향상을 측정하였다. 실험을 통하여 최대로 읽기의 횟수는 90% 감소, 쓰기 횟수는 33% 감소, 소거 횟수는 50% 감소 효과를 보였다.

• Journal of Korea Water Resources Association
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• v.40 no.10
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• pp.769-781
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• 2007

Factor analysis has been usually employed in reducing quantity of data and summarizing information on a system or phenomenon. In this analysis methodology, variables are grouped into several factors by consideration of statistic characteristics, and the results are used for dropping variables which have lower weight than others. In this study, factor analysis was applied for extracting primary factors influencing multi-dam system operation in the Han River basin, where there are two multi-purpose dams such as Soyanggang Dam and Chungju Dam, and water has been supplied by integrating two dams in water use season. In order to fulfill factor analysis, first the variables related to two dams operation were gathered and divided into five groups (Soyanggang Dam: inflow, hydropower product, storage management, storage, and operation results of the past; Chungju Dam: inflow, hydropower product, water demand, storage, and operation results of the past). And then, considering statistic properties, in the gathered variables, some variables were chosen and grouped into five factors; hydrological condition, dam operation of the past, dam operation at normal season, water demand, and downstream dam operation. In order to check the appropriateness and applicability of factors, a multiple regression equation was newly constructed using factors as description variables, and those factors were compared with terms of objective function used in operation water resources optimally in a river basin. Reviewing the results through two check processes, it was revealed that the suggested approach provided satisfactory results. And, it was expected for extracted primary factors to be useful for making dam operation schedule considering the future situation and previous results.

• Korean Journal of Agricultural and Forest Meteorology
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• v.9 no.3
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• pp.188-194
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• 2007

The relationships between pine mushroom emergence and meteorological factors were analyzed with three years (from 2003 to 2005) of measurement data at Yangyang site, in order to evaluate the effect of micrometeorological environment on pine mushroom production. fine mushroom was daily monitored and collected in the survey area during the its producing period (approximately one month). Pine mushroom production was highest in 2005 with the meteorological conditions of high temperature and frequent rainfalls in October. The production was lowest in 2004 due to dry conditions from mid September to late October, The meterological factors related to humidity (i.e., relative humidity, soil water content, and precipitation) were better correlated than those related to temperature (i.e., air and soil temperature, soil heat flux and solar radiation) with pine mushroom production. However, all of the correlation coefficients were statistically insignificant with values ranging from 0.15 to 0.46. Such poor correlations may be attributed to various other environmental conditions (e.g., topography, soil, vegetation, other fungi, the relationship between pine mushroom and pine forest) affecting pine mushroom production. We found that a mycelium requires a stimulation of low temperature (of three-day moving average) below $19.5^{\circ}C$, in order to farm a mushroom primordium which grows to pine mushroom after 16 days from the stimulation. We also found that the pine mushroom production ended when the soil temperature (of three-day moving average) fell below $14.0^{\circ}C$.

• Applied Microscopy
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• v.37 no.3
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• pp.147-156
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• 2007

The dorsal lingual papillae of Myotis macrodactylus were investigated morphologically using scanning electron microscopy. Three types of lingual papillae from Myotis macrodactylus were recognized. The filiform(Fi) papillae were distributed over the entire dorsal surface of the tongue, and they could be classified into 5 types of papillae by the shape, size and number of the protrusion. Type I was distributed on dorsal surface of the apex in the anterior region of the tongue, has a crow-like shape with ten to fifteen formed projections. Type II was located in the medial portion of the anterior region of the tongue, has an eight to ten spin-like protrusion. Type III was distributed on the medial portion of the tongue, has a scale-like papille with five to seven protrusion. Type IV was distributed on the both lateral portion of the posterior region of the tongue, has a small conical papillae, does not have needle projection. Type V have not needle projection, a large of conical papillae, on the both lateral portion of the posterior region of the tongue. Most Fu(Fungiform) papillae were distributed the both lateral region or medial portion of the posterior region of the tongue, has a round or oval shape with $40{\sim}45$ papillae. The small $(65{\mu}m)$, meddle $(75{\mu}m)$ and large $(120{\mu}m)$ fungiform papillae were distributed on dorsal surface of the apex in the anterior, the both lateral portions and medial portion of the posterior region of the tongue, respectively. Two large oval vallate (V) papillae are located in the medial portion of the posterior region of the tongue. In conclusion, the morphology of lingual papillae is useful to determine species relationship among Myotis species. It suggests that the difference of types and number of lingual papillae caused by the difference of food habit.

• Journal of the Korean Geotechnical Society
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• v.23 no.9
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• pp.5-16
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• 2007

The simple linear elastic-perfectly plastic model with soil parameters $s_u,\;E_u$ and n of undrained condition is usually applied to predict the displacement of a constructed diaphragm wall(DW) on soft soils during excavation. However, the application of this soil model for finite element analysis could not interpret the continued increment of the lateral displacement of the DW for the large and deep excavation area both during the elapsed time without activity of excavation and after finishing excavation. To study the characteristic behaviors of soil behind the DW during the periods without excavation, a series of tests on soft Bangkok clay samples are simulated in the same manner as stress condition of soil elements happening behind diaphragm wall by triaxial tests. Three kinds of triaxial tests are carried out in this research: $K_0$ consolidated undrained compression($CK_0U_C$) and $K_0$ consolidated drained/undrained unloading compression with periodic decrement of horizontal pressure($CK_0DUC$ and $CK_0UUC$). The study shows that the shear strength of series $CK_0DUC$ tests is equal to the residual strength of $CK_0UC$ tests. The Young's modulus determined at each decrement step of the horizontal pressure of soil specimen on $CK_0DUC$ tests decreases with increase in the deviator stress. In addition, the slope of Critical State Line of both $CK_0UC$ and $CK_0DUC$ tests is equal. Moreover, the axial and radial strain rates of each decrement of horizontal pressure step of $CK_0DUC$ tests are established with the function of time, a slope of critical state line and a ratio of deviator and mean effective stress. This study shows that the results of the unloading compression triaxial tests can be used to predict the diaphragm wall deflection during excavation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.29-29
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• 2009

현재 고집적 비휘발성 메모리 소자로는 MRAM (Magnetic Random Access Memory)과 PRAM (Phase Magnetic Random Access Memory)이 활발하게 미국과 일본, 한국 등에서 다양한 연구가 진행되어 오고 있다. 이 중에서 MRAM은 DRAM과 비슷한 10 ns의 빠른 읽기/쓰기 속도와 비휘발성 특성을 가지고 있으며, 전하를 저장할 커패시터가 필요 없고, 두 개의 자성충에 약 10 mA 정도의 전류를 가하면 그때 발생하는 약 10 Oe의 자장을 개개의 비트를 write하고, read 시에는 각 비트의 자기저항을 측정함으로써 데이터를 저장하고 읽을 있으므로, 고집적화가 가능성하다 [1]. 현재 우수한 박막 재료가 개발 되었으나, 고집적 MRAM 소자의 양산에는 해결 하여야 하는 문제점이 있다. 특히 다층 박막으로 구성되어 있으므로 식각 공정의 개발이 필수적이다. 지금까지 MRAM 재료의 식각은 주로 Ion milling, ICP, ECR등의 플라즈마 장치를 되었고, 식각 가스로는 할로겐 기체와 금속카보닐 형성을 위한 Co/$NH_3$와 $Ch_3OH$ 기체가 이용되고 있다. 그러나 할로겐 계열의 기체를 사용할 경우, 식각 부산물들의 높은 끓는점 때문에 식각 부산물이 박막의 표면에서 열적 탈착에 의하여 제거되지 않기 때문에 높은 에너지를 가지는 이온의 도움에 의한 식각이 필요하다. 또한 Cl 계열의 기체를 사용할 경우, 식각 공정 후, 시료가 대기에 노출되면 대기 중의 수분과 식각 부산물이 결합하여 부식 현상이 발생하게 된다. 그러므로 이를 방지하기 위한 추가 공정이 요구된다. 최근에는 부식 현상이 없고, MTJ 상부에 사용되는 Ta 또는 Ti Hard mask와의 높은 선택비를 가지는 $CH_3OH$ 또는 CO/$NH_3$가 사용되고 있다. 하부 박막에 따른 식각 특성에 연구와 다층의 박막의 식각 공정에 발생에 관한 발표는 거의 없다. MRAM을 양산에 적용하기 위하여서는 Main etch 공정에서 빠른 식각 공정이 필요하고, Over etch 공정에서 하부박막에 대한 높은 선택비가 요구된다. 그러므로 본 논문에서는 식각 변수에 따른 플라즈마 측정과 표면 반응을 비교하여 각 공정의 식각 메커니즘을 규명하고, Main Etch 공정에서는 $Cl_2$/Ar 또는 $BCl_3$/Ar 가스를 이용하여 식각 실험을 수행하고, Over etch 공정에는 낮은 Ta 박막 식각 속도를 가지는 $Ch_4/O_2$/Ar 또는 $Ch_3OH$/Ar 가스를 이용하고자 한다. 플라즈마 내의 식각종과 Ta 박막과의 반응을 XPS와 AES를 이용하여 분석하고, 식각 공정 변수에 따른 식각 속도, 식각 선택비와 식각 프로파일 변화를 SEM을 이용하여 관찰한다.

• Korean Chemical Engineering Research
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• v.47 no.6
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• pp.715-719
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• 2009

The phase change electrode board for the bio-information detection through electrical property response of phase change material was developed in this study. We manufactured the electrode board using Aluminum first that is widely used in conventional semiconductor device process. Without further treatment, these aluminum electrodes tend to contain voids in PETEOS(plasma enhanced tetraethyoxysilane) material that are easily detected by cross-sectional SEM(Scanning Electron Microscope). The voids can be easily attacked and transformed into holes in between PETEOS and electrodes after etch back and washing process. In order to resolve this issue of Al electrode board, we developed a electrode board manufacturing method using low resistivity TiN, which has advantages in terms of the step-coverage of phase change($Ge_2Sb_2Te_5$, GST) thin film as well as thermodynamic stability, without etch back and washing process. This TiN material serves as the top and bottom electrode in PRAM(Phase-change Random Access Memory). The good connection between the TiN electrode and GST thin film was confirmed by observing the cross-section of TiN electrode board using SEM. The resistances of amorphous and crystalline GST thin film on TiN electrodes were also measured, and 1000 times difference between the amorphous and crystalline resistance of GST thin film was obtained, which is well enough for the signal detection.