• Journal of the Optical Society of Korea
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• v.18 no.1
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• pp.71-77
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• 2014

We present design and fabrication of a multi-focusing microlens array (MLA) using a thermal reflow method. To obtain multi-focusing properties with different numerical apertures at the elemental lens of the MLA, double-cylinder photoresist (PR) structures with different diameters were made within the guiding pattern with both photolithographic and partial developing processes. Due to the base PR layer supporting the thermal reflow process and the guiding structure, the thermally reflowed PR structure had different radii of curvatures with lens shapes that could be precisely modeled by the initial volume of the double-cylinder PR structures. Using the PR template, the hexagonally packed multi-focusing MLA was made via the replica molding method, which showed four different focal lengths of 0.9 mm, 1.1 mm, 1.6 mm, and 2.5 mm, and four different numerical apertures of 0.1799, 0.2783, 0.3973, and 0.4775.

• Clean Technology
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• v.11 no.4
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• pp.205-211
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• 2005

There have been many technologies and materials proposed for realizing microlens array, and plastic injection is recognized as the most promising one because of several merits such as optical properties, impact resistance, formability, lightening and environmental adaptability. Since PR reflow for injection template fabrication enables the lens shape control easier, and the sample technology more effective for mass production, it lowers the cost, enhances integration, and reduces process steps, which leads to be environmentally benign. However injection of polymers may face the difficulty of formability depending on their properties. In order to overcome the difficulty, fast heating/cooling technology was introduced in this study, and microlenses were fabricated and evaluated. template obtained by PR reflow method was heated and cooled fast during injection to fabricate microlens array. PC and PMMA polymer materials were compared, and it was realized that PMMA showed much better formability due to its lower melting temperature. Injection parameters of pressures and velocities were driven out for injection optimization.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.11
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• pp.874-878
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• 2001

Solder bump was electroplated on wafer for flip chip application. The process is as follows. Ti/Cu were sputtered and thick PR was formed by several coating PR layer. Fine pitch vias were opened using via mask and then Cu stud and solder bump were electroplated. Finally solder bump was formed by reflow process. In this paper, we opened 40㎛ vias on 57㎛ thick PR layer and electroplated solder bump with 70㎛ height and 40㎛ diameter. After reflow process, we could form solder bump with 53㎛ height and 43㎛ diameter. In plating process, we improved the plating uniformity within 3% by using ring contact instead of conventional multi-point contact.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.229-231
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• 2007

Recently, 3D-electronic packaging by TSV is in interest. TSV(Through Silicon Via) is a interconnection hole on Si-wafer filled with conducting metal such as Copper. In this research, chips with TSV are connected by electroplated Sn bump without PR. Then chips with TSV are put together and stacked by the methode of Reflow soldering. The stacking was successfully done and had no noticeable defects. By eliminating PR process, entire process can be reduced and makes it easier to apply on commercial production.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.4
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• pp.23-29
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• 2000

We demonstrate the fabrication method of high-density and high-quality solder bump solving a copper (Cu) cross-contamination in Si-LSI laboratory. The Cu cross-contamination is solved by separating solder-bump process by two steps. Former is via-formation process excluding Cu/Ti under ball metallurgy (UBM) layer sputtering in Si-LSI laboratory. Latter is electroplating process including Ti-adhesion and Cu-seed layers sputtering out of Si-LSI laboratory. Thick photoresist (PR) is achieved by a multiple coating method. After TiW/Al-electrode sputtering for electroplating and via formation in Si-LSI laboratory, Cu/Ti UBM layer is sputtered on sample. The Cu-seed layer on the PR is etched during Cu-electroplating with low-electroplating rate due to a difference in resistance of UBM layer between via bottom and PR. Therefore Cu-buffer layer can be electroplated selectively at the via bottom. After etching the Ti-adhesion layer on the PR, Sn/Pb solder layer with a composition of 60/40 is electroplated using a tin-lead electroplating bath with a metal stoichiometry of 60/40 (weight percent ratio). Scanning electron microscope image shows that the fabricated solder bump is high-uniformity and high-quality as well as symmetric mushroom shape. The solder bumps with even 40/60 $\mu\textrm{m}$ in diameter/pitch do not touch during electroplating and reflow procedures. The solder-bump process of high-uniformity and high-density with the Cu cross-contamination free in Si-LSI laboratory will be effective for electronic microwave application.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1656-1659
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• 2008

The reflective type color filter for the liquid crystal displays (LCD) was produced using cholesteric liquid crystal monomers whose phase is characterized by the unique optical features of selective reflection. Periodic micrometer scale hemi-spherical photoresist (PR) patterns were formed on glass substrates by thermal reflow method after photolithography. Cholesteric color filter films for red, green and blue light reflections were then produced and the viewing angle dependence was investigated and compared with that of reflected light on the non-patterned substrates.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.380-381
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• 2012

Bioinspired sea urchin-like structures were fabricated on silicon by inductively coupled plasma (ICP) etching using lens-like shape hexagonally patterned photoresist (PR) patterns and subsequent metal-assisted chemical etching (MaCE) [1]. The lens-like shape PR patterns with a diameter of 2 ${\mu}m$ were formed by conventional lithography method followed by thermal reflow process of PR patterns on a hotplate at $170^{\circ}C$ for 40 s. ICP etching process was carried out in an SF6 plasma ambient using an optimum etching conditions such as radio-frequency power of 50 W, ICP power of 25 W, SF6 flow rate of 30 sccm, process pressure of 10 mTorr, and etching time of 150 s in order to produce micron structure with tapered etch profile. 15 nm thick Ag film was evaporated on the samples using e-beam evaporator with a deposition rate of 0.05 nm/s. To form Ag nanoparticles (NPs), the samples were thermally treated (thermally dewetted) in a rapid thermal annealing system at $500^{\circ}C$ for 1 min in a nitrogen environment. The Ag thickness and thermal dewetting conditions were carefully chosen to obtain isolated Ag NPs. To fabricate needle-like nanostructures on both the micron structure (i.e., sea urchin-like structures) and flat surface of silicon, MaCE process, which is based on the strong catalytic activity of metal, was performed in a chemical etchant (HNO3: HF: H2O = 4: 1: 20) using Ag NPs at room temperature for 1 min. Finally, the residual Ag NPs were removed by immersion in a HNO3 solution. The fabricated structures after each process steps are shown in figure 1. It is well-known that the hierarchical micro- and nanostructures have efficient light harvesting properties [2-3]. Therefore, this fabrication technique for production of sea urchin-like structures is applicable to improve the performance of light harvesting devices.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.35-39
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• 2018

In order to improve the coupling efficiency, a collimator lens that collects the light emitted from the laser diode at a wide angle to the core of the optical fiber is essential. Glass mold method using a mold is widely used as a collimator lens currently used. Although this method is inexpensive to produce, it is difficult to form precisely and quality problems such as spherical aberration. In this study, the precision of surface processing was improved by replacing the existing glass mold method with the semiconductor process, and the material of the lens was changed to silicon suitable for the semiconductor process. The semiconductor process consists of a photolithography process using PR and a dry etching process using plasma. The optical coupling efficiency was measured using an ultra-precision alignment system for the evaluation of the optical characteristics of the silicon lens. As a result, the optical coupling efficiency was 50% when the lens diameter was $220{\mu}m$, and the optical coupling property was 5% or less with respect to the maximum optical coupling efficiency in the lens diameter range of $210-240{\mu}m$.