• Applied Chemistry for Engineering
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• v.10 no.7
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• pp.1014-1019
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• 1999

Copolyamic acid PMDA/6FDA-PDA(PAA) and homopolyamic acids PMDA-PDA(PAA) and 6FDA-PDA(PAA) were synthesized from 1,2,4,5-benzenetetracarboxylic dianhydride(PMDA) and 2,2'-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride(6FDA) as the dianhydride and 1,4-phenylenediamine (PDA) as the diamine. Residual stresses were detected in-situ during thermal imidization of the co- and homopolyimide precursors as a function of processing temperature over the range of $25{\sim}400^{\circ}C$ using thin film stress analyzer(TFSA), and morphological structures were investigated by WAXD. In comparison, the resultant residual stress of polyimide films composed of different compositions decreased with the increasing content of PMDA unit in the chain and was about 5 Mpa in compression mode for PMDA-PDA. In this study, the synthesis of random PMDA/6FDA-PDA copolyimide could be completed and compensate for the difficulty of process due to high $T_g$ of PMDA-PDA and relatively higher stress of 6FDA-PDA. It showed that we can make a low level stress copolyimied having excellent mechanical properties by incorporating appropriate rod-like rigid structure PMDA-PDA unit into 6FDA-PDA polyimide backbone which generally shows higher stress due to rotational hinges such as bulky di(trifluoromethyl). Specially, PMDA/6FDA-PDA(0.9:0.1:1.0) satisfied excellent mechanical property and low level stress as an inter layer showing low dielectric constant.

• Applied Chemistry for Engineering
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• v.9 no.2
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• pp.306-310
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• 1998

The soluble polyimides(PMDA/diamine/dianhydride) were prepared and investigated. After coating the prepared PMDA/diamine/dianhydride solution into the commercial tubular alumina ceramic membranes, gas permeation characteristics was investigated. $T_g{\prime}s$ of the polyimides were in the range of $337{\sim}358^{\circ}C$ and thermal stability was good. The polymer was soluble in NMP, DMAc, DMSO, THF, and m-cresol. The adhesion between the alumina membrane and the soluble polyimide was excellent. The soluble polyimide/alumina membranes containing 6FDA showed the highest permeability among others. The permeability of nitrogen of PMDA/1,3PDA/6FDA-alumina membrane was about $7.6{\times}10^{-7}(mol/m^2{\cdot}Pa{\cdot}s)$ in the gas permeation experiments. The ideal separation factor of $O_2/N_2$ and $H_2/N_2$ in PMDA/1,3PDA/6FDA-alumina membrane were 6.19, and 70.0, respectively.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.837-838
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• 2009

In this work, pyromellitic dianhydride (PMDA) was used as a cathode interfacial layer in the organic light emitting diodes (OLEDs) and its thickness was optimized. Various electrical and optical characterizations of the OLEDs having various thicknesses of the PMDA cathode interfacial layer revealed that the best OLED performance could be achieved by using 0.5 nm-thick PMDA layer compared to the control device without any interfacial layer.

• Polymer(Korea)
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• v.39 no.2
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• pp.275-280
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• 2015

Two series of copolyimides (Co-PIs) were prepared by reacting 4,4'-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) and 1,2,4,5-benzentetra carboxylic dianhydride (pyromellitic dianhydride) (PMDA), as dianhydrides based on 4,4'-biphthalic anhydride (BPA) and 2,2'-bis(trifluoromethyl)benzidine (TFB) by using thermal- and chemical imidizations. Co-PIs films with different dianhydride monomer compositions were compared in terms of their thermal properties and optical transparencies. The addition of PMDA was more effective than the addition of 6FDA for improving the thermal properties. Meanwhile, 6FDA is more effective in optical transparencies.

• Electrical & Electronic Materials
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• v.9 no.8
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• pp.776-782
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• 1996

The electrical properties of vapor deposition polymerized polymide thin films for getting an in-line system with manufacturing process of semiconductor device, have been studied. Polyimide thin films fabricated by vapor deposition polymerization(VDP) method based on PMDA and 4,4'-DDE monomer were confirmed by FT-IR spectra. It is found that the major conduction carriers of thin films are ions, and the hopping length of ions is almost same with monomer length at the temperature over 120.deg. C through the analysis of electrical conduction mechanism. Also, The activation energy is about 0.69 eV at the temperature of >$30^{\circ}C$ - >$150^{\circ}C$ and it is shown that the resistivity at which thin films can be used as an insulating film between layers of semiconductor device, is 3.2*10$^{15}$ .ohm.cm.

• Applied Chemistry for Engineering
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• v.9 no.1
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• pp.13-19
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• 1998

Copolyimide membranes of different chemical structure based on pyromellitic dianhydride (PMDA)/methylendianiline(MDA) were prepared by varying their chemical compositions with adding meta-phenylendiamine (MPD), para- phenylendiamine (PPD), 2,4,6- trimethyl-1,3-phenylenediamine(TriMeMPD) as a co-monomer. The $N_2$ and $O_2$ permeation properties are qualitatively correlated to specific free volume and intersegmental distance of membrane. The partial replacement of MDA with MPD or PPD caused in the PMDA/MDA based membranes increase in density, and decrease in free volume, d-spacing, consequently resulted in decreased permeability coefficient. In the case of TriMeMPD, opposite results were observed. In all membranes, the permeability coefficients were pressure independent, and membranes which have high permeability coefficient showed low $N_2/O_2$ ideal separation factor as an usual manner. The permeability coefficient also increased with temperature and $N_2/O_2$ ideal separation factor decreased. The increase ratio of the $N_2$ permeability coefficient was larger than that of $O_2$.

• Applied Chemistry for Engineering
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• v.22 no.6
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• pp.623-626
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• 2011

Various poly(amic acid)s were synthesized from PMDA/BPDA/p-PDA/ODA with different mole ratios and effectively converted into 4-component polyimide films by thermal imidization. The chemical structures and thermo-mechanical properties of polyimide films were examined using Fourier transform infrared spectroscopy (FT-IR), thermo-gravimetric analyzer (TGA), thermo-mechanical analyzer (TMA), dynamic mechanical analyzer (DMA) and universal tensile machine (UTM). The tensile strength, modulus, and thermal properties of polyimides films increased with the amount of rigid PMDA and p-PDA, while the elongation and moisture absorption of polyimide films increased with the amount of flexible BPDA and ODA. One of 4-component polyimide films exhibited a similar coefficient of thermal expansion (CTE) value to that of copper when it was composed of PMDA : BPDA : p-PDA : ODA with the ratio of 5 : 5 : 4 : 6. Thus, this polyimide film could be useful for a base film for flexible copper clad laminates (FCCL) of flexible printed circuit boards.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.11a
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• pp.139-142
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• 1995

Polyimide(PI) thin films are fabricated by vapor deposition polymerization(VDP) from PMDA and DDE. The IR spectrum show that PAA the films are changed into PI films by curing. The activation energy of PI films is estimated to be 0.32 [eV] at the electric field of 0.133 [Mv/cm]. The resistivity is about 4.5${\times}$10$\_$16/ [$\Omega$$.$cm] at room temperature.

• Fire Science and Engineering
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• v.10 no.3
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• pp.3-9
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• 1996

The Polyimide thin films based on PMDA and 4,$4^{\circ}$'-DDE were fabricated by VDPM, and their heat resistance characteristics were invastigated by TGA(Thermogravimetry Analyzer). It was found that deposition rate decreased with increasing substrate temperature and the thin films were not fabricated over the substrate temperature of $70^{\circ}$. $T_{TG}$ of weight loss temperature is $565^{\circ}$, $397^{\circ}$ and $210^{\circ}$ at the substrate temperature of $20^{\circ}$, $40^{\circ}$ and $70^{\circ}$, respectively. It is realized that the endurace temperature for 20,000 hour of thin films fabricated at $20^{\circ}$ and $40^{\circ}$ is $230^{\circ}$ and $200^{\circ}$, respectively.

• Elastomers and Composites
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• v.43 no.2
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• pp.82-87
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• 2008

In this study, nine kinds of polyimides were synthesized from 1,2,4,5-benzenetetracarboxylic dianhydride (PMDA), 4,4'-(4,4'-isopropylidenediphenoxy)bis(phthalic anhydride) (BPADA), m-pheny lenediamine (m-PDA) and 4,4'-oxydianiline (ODA) by controlling molar ratio of monomers. Synthesized polyimides were used as insulator films for 2-layer Flexible Copper Clad Laminate(FCCL) which were manufactured by the casting method. Glass transition temperature and thermal degradation temperature for 5% weight loss of the polyimide film were improved by increasing contents of m-PDA and PMDA, respectively. Water absorption of polyimide film was reduced by increasing contents of ODA and BPADA which have relatively long structure, respectively. Peel strength of 2-layer FCCL was improved by increasing contents of ODA and BPADA.