• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.2
• /
• pp.65-71
• /
• 2022

In the case of Mobile PKG Trend is in a situation where a decrease in Mold Top Margin is inevitable due to its miniaturization and high capacity product requirements. However, conventional laser marking technology has an average depth of deep, and when applied to narrow top margin products, PKG strength is expected to decrease due to overlapping processing, and reliability is reduced due to poor quality such as chip damage due to laser exposure. Therefore, we have secured the technology through research on low-depth laser marking solutions that can accommodate narrow top margin products. As a result of the evaluation of applicable technology application for PKG development products, it was verified that the marking depth decreased by 67% reduced and the PKG strength increased by 12%. Furthermore, the quality verification of Laser Damage that can occur through PKG Mechanical analysis was performed, and no Chip Damage defects were found. This ensured the stability of mass production application quality.

• Journal of the Korea Institute of Information Security & Cryptology
• /
• v.15 no.4
• /
• pp.11-27
• /
• 2005

To date, most identity-based key agreement protocols are based on a single PKG (Private Key Generator) environment. In 2002, Chen and Kudla proposed an identity-based key agreement protocol for a multiple PKG environment, where each PKG shares identical system parameters but possesses distinct master key. However, it is more realistic to assume that each PKG uses different system parameters including the PKG's master key. In this paper, we propose a new two party key agreement protocol between users belonging to different PKGs that do not share system parameters. We also extend this protocol to two types of tripartite key agreement protocols. We show that our two party protocol requires minimal amount of pairing computation for a multiple PKG environment and our tripartite protocol is more efficient than existing protocols. We also show that the proposed key agreement protocols satisfy every security requirements of key agreement protocol.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.2
• /
• pp.35-41
• /
• 2011

Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.2
• /
• pp.49-52
• /
• 2022

As the difficulty of flip chip products increase, interest in stable PKG material technology from the viewpoint of reliability is increasing. Currently, the representative of poor reliability that are mainly occurring in flip chip PKG are Sn bridge and Cu dendrite. Two type defects are caused by void generated by the flux residue around the bump. In order to essentially minimize the risk of this type of reliability failure, the linkage between the composition of Molded Under-fill (MUF) and flux, which is related material, was reviewed. In this study, the correlation between base resin and filler, which is the main component of MUF, and flux, was defined, and the material composition design was carried out by refer to lesson learn. With the current material composition, it was confirmed that moisture absorption reliability 85%/85%/24hrs pass result and void did not occur during destructive analysis, and developed MUF has shown flux immunity improving result in flip Chip PKG. We think this study can be used in yield enhancement of flip chip process and give insights to study in compatibility between MUF and flux.

• Bulletin of the Korean Chemical Society
• /
• v.34 no.4
• /
• pp.1165-1169
• /
• 2013

To elucidate the role of PKG isoforms in transcriptional control of cyclin D1, we employed a series of expression vectors of PKG $1{\alpha}$ and PKG $1{\beta}$ which encode HA-tagged wild type and constitutively active (SD and ${\Delta}N$) mutants. Our present study demonstrates that both the constitutively active mutants of PKG $1{\beta}$ downregulate the transcription of cyclin D1 when transiently transfected in NIH3T3 cells, whereas PKG $1{\alpha}$ mutants show weak inhibition. We further studied the transcriptional regulators of cyclin D1, such as, c-fos, NF-${\kappa}B$, and CRE by using the luciferase reporter assay. Constitutively active mutants of PKG $1{\beta}$ showed marked transcriptional downregulation of c-fos in NIH3T3 cells, whereas PKG $1{\alpha}$ downregulated c-fos to a lesser extent. We also found that the constitutively active mutants of PKG negatively regulated the activation of NF-${\kappa}B$ and CRE, suggesting their involvement in the regulation of cyclin D1.

• ETRI Journal
• /
• v.31 no.5
• /
• pp.554-564
• /
• 2009

In information security and network management, attacks based on vulnerabilities have grown in importance. Malicious attackers break into hosts using a variety of techniques. The most common method is to exploit known vulnerabilities. Although patches have long been available for vulnerabilities, system administrators have generally been reluctant to patch their hosts immediately because they perceive the patches to be annoying and complex. To solve these problems, we propose a security vulnerability evaluation and patch framework called PKG-VUL, which evaluates the software installed on hosts to decide whether the hosts are vulnerable and then applies patches to vulnerable hosts. All these operations are accomplished by the widely used simple network management protocol (SNMP). Therefore, system administrators can easily manage their vulnerable hosts through PKG-VUL included in the SNMP-based network management systems as a module. The evaluation results demonstrate the applicability of PKG-VUL and its performance in terms of devised criteria.

• The Korean Journal of Physiology and Pharmacology
• /
• v.4 no.6
• /
• pp.445-453
• /
• 2000

The present investigation tested the hypothesis that the activation of protein kinase G (PKG) leads to a phosphorylation of $Ca^{2+}-activated$ potassium channel $(K_{Ca}\;channel)$ and is involved in the activation of $K_{Ca}$ channel activity in cerebral arterial smooth muscle cells of the rabbit. Single-channel currents were recorded in cell-attached and inside-out patch configurations of patch-clamp techniques. Both molsidomine derivative 3-morpholinosydnonimine-N-ethylcarbamide $(SIN-1,\;50\;{\mu}M)$ and 8-(4-Chlorophenylthio)-guanosine-3',5'-cyclic monophosphate $(8-pCPT-cGMP,\;100\;{\mu}M),$ a membrane-permeable analogue of cGMP, increased the $K_{Ca}$ channel activity in the cell-attached patch configuration, and the effect was removed upon washout of the drugs. In inside-out patches, single-channel current amplitude was not changed by SIN-1 and 8-pCPT-cGMP. Application of ATP $(100\;{\mu}M),$ cGMP $(100\;{\mu}M),$ ATP+cGMP $(100\;{\mu}M\;each),$ PKG $(5\;U/{\mu}l),$ ATP $(100\;{\mu}M)+PKG\;(5\;U/{\mu}l),$ or cGMP $(100\;{\mu}M)+PKG\;(5\;U/{\mu}l)$ did not increase the channel activity. ATP $(100\;{\mu}M)+cGMP\;(100\;{\mu}M)+PKG\;(5\;U/{\mu}l)$ added directly to the intracellular phase of inside-out patches increased the channel activity with no changes in the conductance. The heat-inactivated PKG had no effect on the channel activity, and the effect of PKG was inhibited by 8-(4-Chlorophenylthio)-guanosine-3',5'-cyclic monophosphate, Rp-isomer $(Rp-pCPT-cGMP,\;100\;{\mu}M),$ a potent inhibitor of PKG or protein phosphatase 2A (PP2A, 1 U/ml). In the presence of okadaic acid (OA, 5 nM), PP2A had no effect on the channel activity. The $K_{Ca}$ channel activity spontaneously decayed to the control level upon washout of ATP, cGMP and PKG, and this was prevented by OA (5 nM) in the medium. These results suggest that the PKG-mediated phosphorylations of $K_{Ca}$ channels, or some associated proteins in the membrane patch increase the activity of the $K_{Ca}$ channel, and the activation may be associated with the vasodilating action.

• Journal of the Microelectronics and Packaging Society
• /
• v.28 no.2
• /
• pp.45-50
• /
• 2021

As the difficulty of flip chip products increases, there is a growing interest in the material of flux, which is safe from the solder wetting and reliability. In the case of no clean flux, there is merit in terms of process efficiency because there is no cleaning process. But Cu migration and delamination can be occurred if the residue remains after the reflow process. In this study, major element materials, solvent and activator, are changed and confirmed effect of non-wet and reliability in the package environment. Stability of materials were secured through storage stability evaluation, and we found out non-wet zero materials through the application of two types of solvent and activator with different boiling point and the increase of activator content. After reliability test, no delamination was found in the plane analysis, which secured the final composition of low residue flux.

• Asian-Australasian Journal of Animal Sciences
• /
• v.15 no.7
• /
• pp.1045-1050
• /
• 2002

The aims of this study were to detect spontaneously occurring apoptosis in cultured porcine ovarian cells, to examine the role of growth hormone (GH), tyrosine kinase (TK), protein kinase G (PKG) and cyclin-dependent kinase (CDK) in the control of this process, and to determine whether the effect of GH on apoptosis is mediated by TK-, PKG- and cdc2-dependent intracellular mechanisms. We studied the action of pGH (10 ng/ml), blockers of TK (genistein, lavendustin, both 100 ng/ml), PKG (Rp-Br-PET-cGMPS, 50 nM; KT5823, 100 ng/ml) and CDK (olomoucine, $1{\mu}g/ml$), as well as combinations of GH with these blockers, on the onset of apoptosis in cultured granulosa cells isolated from antral (3-6 mm) porcine follicles. The functional characteristics of an early apoptotic event, DNA fragmentation, were determined using terminal deoxynucleotidyltransferase (TdT)-mediated dUTP nick end labelling (TUNEL), whilst morphological signs of advanced apoptosis such as pyknosis, chromatin marginalization, shrinkage and fragmentation of nucleus, were detected using routine light microscopy. After culture, some ovarian granulosa cells exhibited DNA fragmentation, which in some cases was associated with morphological apoptosis-related changes (pyknosis, shrinkage and fragmentation of the nucleus). GH significantly reduced the proportion of TUNEL-positive cells. Neither TK nor CDK blockers when given alone, significantly affected the percentage of TUNEL-positive cells although both PKG blockers significantly increased this index. Furthermore, TK and PKG blockers given together with GH, prevented or reversed the inhibitory effect of GH on apoptosis, whilst the CDK blocker olomoucine promoted it. These observations demonstrate apoptosis in porcine ovaries and suggest the involvement of GH, TK, PKG and CDK in the control of this process. They also suggest that the effect of GH on ovarian apoptosis is mediated or regulated by multiple signalling pathways including TK-, PKG- and CDK-dependent intracellular mechanisms.

• Journal of the Microelectronics and Packaging Society
• /
• v.12 no.4 s.37
• /
• pp.331-338
• /
• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.